Thyristors
Surface Mount – 600V > Z0103MN, Z0107MN, Z0109MN
Z0103MN, Z0107MN, Z0109MN
Pb
Description
Designed for use in solid state relays, MPU interface, TTL
logic and other light industrial or consumer applications.
Supplied in surface mount package for use in automated
manufacturing.
Features
• Sensitive Gate Trigger
Current in Four Trigger
Modes
• Blocking Voltage to 600 V
• Glass Passivated Surface
for Reliability and
Uniformity
Pin Out
• Surface Mount Package
• These are Pb−Free
Devices
Functional Diagram
4
MT 2
MT 1
G
1
2
3
Additional Information
Datasheet
Resources
Samples
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/26/19
Thyristors
Surface Mount – 600V > Z0103MN, Z0107MN, Z0109MN
Maximum Ratings (TJ = 25°C unless otherwise noted)
Symbol
Value
Peak Repetitive Off−State Voltage (Note 1)
(RGK = IK, TJ− 40 to +125°C, Sine Wave, 50 to 60 Hz)
Rating
VDRM,
VRRM
600
On-State RMS Current (Full Sine Wave 50 to 60 Hz; TC = 80°C)
IT
(RMS)
1.0
A
Peak Non−repetitive Surge Current
(One Full Cycle Sine Wave, 60 Hz, TC = 25ºC)
IT
(RMS)
8.0
A
2
It
0.4
A2s
PG(AV)
1.0
W
IGM
1.0
A
Circuit Fusing Considerations (t = 8.3 ms)
Average Gate Power (TC = 80°C, t ≤ 8.3 ms)
Peak Gate Current (t ≤ 20 s, TJ = +125°C)
Unit
V
Operating Junction Temperature Range @ Rated VRRM and VDRM
TJ
-40 to +110
°C
Storage Temperature Range
Tstg
-40 to +150
°C
Thermal Characteristics
Rating
Thermal Resistance, Junction−to−Ambient PCB Mounted per Figure 1
Thermal Resistance, Junction−to−Tab Measured on MT2 Tab Adjacent
to Epoxy
Maximum Device Temperature for Soldering Purposes for
10 Secs Maximum
Symbol
Value
Unit
R8JA
156
°C/W
R8JT
25
°C/W
TL
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. VDRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall not be applied concurrent with negative
potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded.
Electrical Characteristics - OFF (TJ = 25°C unless otherwise noted)
Characteristic
Peak Repetitive Forward or Reverse Blocking Current (Note 3)
(VAK = Rated VDRM or VRRM, RGK = 1000 kQ
Symbol
TJ = 25°C
TJ = 125°C
IDRM,
Min
Typ
Max
-
-
5.0
-
-
500
Unit
μA
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/26/19
Thyristors
Surface Mount – 600V > Z0103MN, Z0107MN, Z0109MN
Electrical Characteristics - ON (TJ = 25°C unless otherwise noted; Electricals apply in both directions)
Characteristic
Symbol
Min
Typ
Max
Unit
VTM
−
−
1.8
V
MT2(+), G(+)
0.15
−
3.0
MT2(+), G(−)
0.15
−
3.0
0.15
−
3.0
Peak On−State Voltage (ITM = ±11 A Peak, Pulse Width ≤2 ms,
Duty Cycle ≤2%)
Z0103MN
Gate Trigger Current
(Continuous dc)
(VD = 12 V, RL = 30 Ohms)
Z0107MN
Gate Trigger Current
(Continuous dc)
(VD = 12 V, RL = 30 Ohms)
Z0109MN
Gate Trigger Current
(Continuous dc)
(VD = 12 V, RL = 30 Ohms)
Z0103MN
Latching Current
(VD = 12 V, IG = 1.2 x IGT)
ALL TYPES
Z0107MN
Latching Current
(VD = 12 V, IG = 1.2 x IGT)
ALL TYPES
Z0109MN
Latching Current
(VD = 12 V, IG = 1.2 x IGT)
ALL TYPES
MT2(−), G(−)
IGT
MT2(−), G(+)
0.25
−
5.0
MT2(+), G(+)
0.15
−
5.0
0.15
−
5.0
0.15
−
5.0
MT2(+), G(−)
MT2(−), G(−)
IGT
MT2(−), G(+)
0.25
−
7.0
MT2(+), G(+)
0.15
−
10
MT2(+), G(−)
0.15
−
10
0.15
−
10
MT2(−), G(−)
IGT
MT2(−), G(+)
0.25
−
10
MT2(+), G(+)
−
−
7.0
−
−
15
−
−
7.0
7.0
MT2(+), G(−)
MT2(−), G(−)
IL
MT2(−), G(+)
−
−
MT2(+), G(+)
−
−
10
MT2(+), G(−)
−
−
20
−
−
10
MT2(−), G(−)
IL
MT2(−), G(+)
−
−
10
MT2(+), G(+)
−
−
15
−
−
25
−
−
15
−
−
15
MT2(+), G(−)
MT2(−), G(−)
IL
MT2(−), G(+)
Electrical Characteristics - ON (TJ = 25°C unless otherwise noted; Electricals apply in both directions)
mA
mA
mA
mA
mA
mA
Continued
Gate Trigger Voltage (Continuous dc)
(VD = 12 Vdc, RL = 30 Ohms)
VGT
−
−
1.3
V
Gate−Controlled Turn−On Time,
(VD = Rated VDRM, ITM = 16 A Peak, IG = 30 mA)
tgt
0.2
−
10
μs
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/26/19
Thyristors
Surface Mount – 600V > Z0103MN, Z0107MN, Z0109MN
Dynamic Characteristics
Characteristic
Rate of Change of Commutating Current
(VD = 400 V, ITM = 0.84 A, Commutating dv/dt = 1.5 V/µs,
Gate Open, TJ = 110ºC, f = 250 Hz, with Snubber)
Symbol
Min
Typ
Max
Unit
dv/dt
1.6
−
−
A/ms
10
30
_
Z0103MN
Critical Rate of Rise of On−State Current
(TC = 110°C, IG = 2 x IGT, RGK = 1 kΩ)
Z0107MN
di/dt
Z0109MN
Repetitive Critical Rate of Rise of On−State Current,
TJ = 125ºC Pulse Width = 20 µs, IPKmax = 15 A,
diG/dt = 1 A/µs, f = 60 Hz
20
60
_
50
75
_
−
−
20
V/µs
A/µs
Voltage Current Characteristic of SCR
Symbol
Parameter
VDRM
Peak Repetitive Forward Off State Voltage
IDRM
Peak Forward Blocking Current
VRRM
Peak Repetitive Reverse Off State Voltage
IRRM
Peak Reverse Blocking Current
VTM
Maximum On State Voltage
IH
+C urrent
V TM
on stat e
IH
I RR M at V RR M
Holding Current
off stat e
IH
Quadrant 3
Main Terminal 2
MT2 POSITIVE
(Positive Half Cycle)
+
0.15
3.8
0.079
2.0
0.091
2.3
MT 1
RE F
RE F
( ) MT 2
( ) MT 2
I GT
0.091
2.3
0.244
6.2
0.079
2.0
Q ua dr a nt I
(+) I GT
GA TE
MT 1
Q u a dr a n t III
V TM
(+) MT 2
(+) MT 2
( ) I GT
GA TE
+V oltage
I DR M at V DR M
Figure 1. PCB for Thermal Impedance and Power Testing
of SOT-223
Quadrant Definitions for a Triac
Q u a dr a n t II
Quadrant 1
Main Terminal 2 +
0.059
1.5
0.984
25.0
0.059
1.5
0.059
1.5
inches
mm
+I GT
Q u a dr a n t IV
(+) I GT
GA TE
( ) I GT
GA TE
MT 1
MT 1
0.096
2.44
0.096
2.44
0.096
2.44
0.059
1.5
0.059
1.5
RE F
RE F
0.472
12.0
MT2 NEGA TIVE
(Negative Half Cycle)
All polarities are referenced to MT1.
With in phase signals (using standard AC lines) quadrants I and III are used
.
BOARD MOUNTED VERTICALLY IN CINCH 8840 EDGE CONNECTOR
BOARD THICKNESS = 65 MIL., FOIL THICKNESS = 2.5 MIL.
MATERIAL: G10 FIBERGLASS BASE EPOXY
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/26/19
Thyristors
Surface Mount – 600V > Z0103MN, Z0107MN, Z0109MN
Figure 3. Junction to Ambient Thermal Resistance vs
Copper Tab Area
Figure 2. On-State Characteristics
10
1.0
0.1
TYPICAL AT TJ = 110°C
MAX AT TJ = 110°C
MAX AT TJ = 25°C
IT
0.01
0
1.0
2.0
3.0
4.0
5.0
vT
TA , MAXIMUM ALLOWABLEA MBIENT TEMPERATURE ( °C)
Figure 4. Current Derating, Minimum Pad Size Reference:
Ambient Temperature
Figure 5. Current Derating, 1.0 cm Square Pad Reference:
Ambient Temperature
110
α
100
30°
90
α
60°
90°
80
α = CONDUCTION
ANGLE
dc
70
α = 180°
60
120°
50
MINIMUM FOOTPRINT
50 OR 60 Hz
40
30
20
0
0.1
IT(RMS)
0.2
0.3
0.4
0.5
Figure 6. Current Derating, 2.0 cm Square Pad Reference:
Ambient Temperature
Figure 7. Current Derating Reference: MT2 Tab
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/26/19
Thyristors
Surface Mount – 600V > Z0103MN, Z0107MN, Z0109MN
Figure 9. Thermal Response, Device Mounted on Figure 1
Printed Circuit Board
Figure 8. Power Dissipation
Figure 10. Simplified Test Circuit to Measure the Critical Rate of Rise of Commutating Voltage (dv/dt)c
LL
1N4007
200 VRMS
ADJUST FOR
ITM, 60 Hz VAC
TRIGGER
CHARGE
CONTROL
CL
TRIGGER CONTROL
CHARGE
MEASURE
I
CS
MT2
1N914 51
G
c.
Figure 11. Typical Commutating dv/dt vs Current Crossing Rate
and Junction Temperature
RS
-
ADJUST FOR +
dv/dt(c)
200 V
MT1
See AN1048 for additional information.
Figure 12. Typical Commutating dv/dt vs Junction Temperature at
0.8 Amps RMS
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/26/19
Thyristors
Surface Mount – 600V > Z0103MN, Z0107MN, Z0109MN
Figure 13. Exponential Static dv/dt versus Gate −
Main Terminal 1 Resistance
Figure 14. Typical Gate Trigger Current Variation
Figure 15. Typical Holding Current Variation
Figure 16. Gate Trigger Voltage Variation
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/26/19
Thyristors
Surface Mount – 600V > Z0103MN, Z0107MN, Z0109MN
Dimensions
Soldering Footprint
3.8
0.15
D
b1
HE
2.0
0.079
4
12
E
3
2.3
0.091
b
e1
e
C
A
0.08 (0003)
Dim
A1
L
Inches
2.0
0.079
L1
1.5
0.059
Millimeters
Min
Nom
Max
Min
Nom
Max
---
---
0.071
---
---
1.80
A1
0.001
0.003
0.005
0.02
0.07
0.13
b
0.026
0.030
0.033
0.66
0.75
0.84
b1
0.114
0.118
0.122
2.90
3.00
3.10
c
0.009
0.011
0.014
0.23
0.29
0.35
D
0.260
0.260
0.264
6.60
6.60
6.71
E
0.130
0.138
0.146
3.30
3.50
3.70
e
---
0.091
---
---
2.30
---
e1
0.030
0.037
0.045
0.75
0.95
1.15
A
L1
0.059
0.069
0.079
1.50
1.75
2.00
HE
0.268
0.276
0.283
6.80
7.00
7.20
ø
0°
---
10°
0°
---
10°
Ordering Information
Z0103MNT1G
Z0107MNT1G
Z0109MNT1G
Package
Shipping
SOT-223
(Pb-Free)
SOT-223
(Pb-Free)
SOT-223
(Pb-Free)
1000 /
Tape & Reel
SCALE 6:1
mm
inches
Part Marking System
SOT 223
CASE 318 E
STYLE 11
10XMN
x
Y
M
A
XX
G
10XMN
YMAXX
=Device Code
=3, 7, and 9
=Year
=Month
=Assembly Site
=Lot Serial Code
=Pb-Free Package
(Note: Microdot may be in either location)
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
Device
6.3
0.248
2.3
0.091
Pin Assignment
1
Main Terminal 1
2
Main Terminal 2
3
Gate
4
Main Terminal 2
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability
of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at: www.littelfuse.com/disclaimer-electronics
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/26/19
