PRODUCT : ZEN164V130A24LS
PolyZen
DOCUMENT: SCD27330
REV LETTER: D
REV DATE: JULY 26, 2016
PAGE NO.: 1 OF 10
Polymer Enhanced Zener Diode
Micro-Assemblies
Specification Status: Released
GENERAL DESCRIPTION
Littelfuse PolyZen devices are polymer
enhanced, precision Zener diode microassemblies. They offer resettable
protection against multi-Watt fault
events without the need for multi-Watt
heat sinks.
The Zener diode used for voltage
clamping in a PolyZen micro-assembly
was selected due to its relatively flat voltage vs current
response. This helps improve output voltage clamping,
even when input voltage is high and diode currents are
large.
An advanced feature of the PolyZen micro-assembly is that
the Zener diode is thermally coupled to a resistively nonlinear, polymer PTC (positive temperature coefficient) layer.
This PTC layer is fully integrated into the device, and is
electrically in series between VIN and the diode clamped
VOUT.
This advanced PTC layer responds to either extended
diode heating or overcurrent events by transitioning from a
low to high resistance state, also known as ”tripping”. A
tripped PTC will limit current and generate voltage drop. It
helps to protect both the Zener diode and the follow on
electronics and effectively increases the diode’s power
handling capability.
The polymer enhanced Zener diode helps protect sensitive
portable electronics from damage caused by inductive
voltage spikes, voltage transients, incorrect power supplies
and reverse bias. These devices are particularly suitable
for portable electronics and other low-power DC devices.
BENEFITS
Stable Zener diode helps shield
downstream electronics from
overvoltage and reverse bias
Trip events shut out overvoltage and
reverse bias sources
Analog nature of trip events minimizes
upstream inductive spikes
Minimal power dissipation requirements
Single component placement
FEATURES
Overvoltage transient suppression
Stable VZ vs fault current
Time delayed, overvoltage trip
Time delayed, reverse bias trip
Multi-Watt power handling capability
Integrated device construction
RoHS Compliant
TARGET APPLICATIONS
DC power port protection in portable
electronics
DC power port protection for systems
using barrel jacks for power input
Internal overvoltage & transient
suppression
DC output voltage regulation
TYPICAL APPLICATION BLOCK DIAGRAM
Power Supply
PolyZen Protected Electronics
(External or Internal)
2
VIN
+
1
PolyZen
Device
GND
VOUT
3 Regulated
Output
© 2016 Littelfuse,Inc.
Specifications are subject to change without notice.
Revised July 26,2016
RLoad
Protected downstream
electronics
littelfuse.com
PRODUCT : ZEN164V130A24LS
PolyZen
DOCUMENT: SCD27330
REV LETTER: D
REV DATE: JULY 26, 2016
PAGE NO.: 2 OF 10
Polymer Enhanced Zener Diode
Micro-Assemblies
CONFIGURATION INFORMATION
Pin Configuration (Top View)
Recommended Pad Dimensions
2
VIN
0.94 mm
(0.037”)
GND
2.21 mm
(0.087”)
1
3
0.33 mm
(0.013”)
0.94 mm
(0.037”)
VOUT
0.56 mm
(0.022”)
2.88 mm
(0.1135”)
0.56 mm
(0.022”)
PIN DESCRIPTION
Pin Number
1
2
3
Pin Name
VIN
GND
VOUT
Pin Function
VIN. Protected input to Zener diode.
GND
VOUT. Zener regulated voltage output
BLOCK DIAGRAM
Polymer PTC
VIN
Zener
Diode
VOUT
GND
DEFINITION of TERMS
IPTC
IFLT
IOUT
Trip Event
Trip
Endurance
Current flowing through the PTC portion of the
circuit
RMS fault current flowing through the diode
Current flowing out the VOUT pin of the device
A condition where the PTC transitions to a high
resistance state, thereby significantly limiting I PTC
and related currents, and significantly increasing
the voltage drop between VIN and VOUT.
Time the PTC portion of the device remains both
powered and in a tripped state.
© 2016 Littelfuse,Inc.
Specifications are subject to change without notice.
Revised July 26,2016
IOUT
IPTC
VIN
VOUT
IFLT
GND
littelfuse.com
PRODUCT : ZEN164V130A24LS
PolyZen
DOCUMENT: SCD27330
REV LETTER: D
REV DATE: JULY 26, 2016
PAGE NO.: 3 OF 10
Polymer Enhanced Zener Diode
Micro-Assemblies
GENERAL SPECIFICATIONS
ELECTRICAL
Izt4
(A)
Typ
Max
16.1
16.4
16.6
-40º to +85ºC
Storage Temperature
-40º to +85ºC
CHARACTERISTICS1-3, 11
VZ4
(V)
Min
Operating Temperature
0.1
IHOLD5
@
(Typical unless otherwise specified)
VInt Max8
(V)
Leakage Current
20ºC
(A)
Test
Voltage
Max
Current
(mA)
16
5
1.3
R Typ6
(Ohms)
R1Max7
(Ohms)
0.12
0.16
VINT
Max
(V)
24V
IFLT Max9
Tripped Power
Dissipation10
Max
Test
Current
(A)
IFLT
Max
(A)
Test
Voltage
(V)
Value
(W)
Test
Voltage
(V)
3A
+1.25
-40
+24
-16V
1.0
24
Note 1:
Note 2:
Electrical characteristics determined at 25ºC unless otherwise specified.
This device is intended for limited fault protection. Repeated trip events or extended trip endurance can degrade the
device and may affect performance to specifications. Performance impact will depend on multiple factors including,
but not limited to, voltage, trip current, trip duration, trip cycles, and circuit design. For details or ratings specific to
your application contact Littelfuse Circuit Protection directly.
Note 3:
Specifications developed using 1.0 ounce 0.045” wide copper traces on dedicated FR4 test boards.
Performance in your application may vary.
Note 4:
Izt is the current at which Vz is measured (VZ = VOUT). Additional VZ values are available on request.
Note 5:
IHOLD : Maximum steady state IPTC (current entering or exiting the VIN pin of the device) that will not generate a trip
event at the specified temperature. Specification assumes IFLT (current flowing through the Zener diode) is
sufficiently low so as to prevent the diode from acting as a heat source. Testing is conducted with an “open” Zener.
Note 6:
R Typ: Resistance between VIN and VOUT pins during normal operation at room temperature.
Note 7:
R1Max: The maximum resistance between VIN and VOUT pins at room temperature, one hour after 1st trip or after
reflow soldering.
Note 8:
VINT Max: VINT Max relates to the voltage across the PPTC portion of the PolyZen device (V IN-VOUT). VINT Max is
defined as the voltage (VIN-VOUT) at which typical qualification devices (98% devices, 95% confidence) survived
at least 100 trip cycles and 24 hours trip endurance at the specified voltage (VIN-VOUT) and current (IPTC). VINT Max
testing is conducted using a "shorted" load (VOUT = 0V). VINT Max is a survivability rating, not a performance rating.
Note 9: IFLT Max: IFLT Max relates to the stead state current flowing through the diode portion of the PolyZen device in a fault
condition, prior to a trip event. IFLT Max is defined as the current at which typical qualification devices (12 parts per
lot from 3 lots) survived 100 test cycles. RMS fault currents above I FLT Max may permanently damage the diode
portion of the PolyZen device. Testing is conducted with NO load connected to VOUT, such that IOUT = 0.
“Test voltage” is defined as the voltage between VIN to GND and includes the PolyZen Diode drop. Specification is
dependent on the direction of current flow through the diode. I FLT Max is a survivability rating, not a performance
rating.
Note 10: The power dissipated by the device when in the “tripped” state, as measured on Littelfuse test boards (see note 3).
Note 11: Specifications based on limited qualification data and subject to change.
© 2016 Littelfuse,Inc.
Specifications are subject to change without notice.
Revised July 26,2016
littelfuse.com
PRODUCT : ZEN164V130A24LS
PolyZen
DOCUMENT: SCD27330
REV LETTER: D
REV DATE: JULY 26, 2016
PAGE NO.: 4 OF 10
Polymer Enhanced Zener Diode
Micro-Assemblies
.
MECHANICAL DIMENSIONS
Length
L
Width
W
Height
H
Length
Diode
Height
Diode
Min
3.85 mm
(0.152”)
3.85 mm
(0.152”)
1.4mm
(0.055”)
Ld
-
Hd
-
Offset
O1
-
Offset
O2
-
Typical
4 mm
(0.16”)
4 mm
(0.16”)
1.7 mm
(0.067”)
3.0 mm
(0.118”)
1.0 mm
(0.039”)
0.6 mm
(0.024”)
0.7 mm
(0.028”)
SOLDER REFLOW RECOMMENDATIONS:
Classification Reflow Profiles
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Preheat
• Temperature Min (Tsmin)
• Temperature Max (Tsmax)
• Time (tsmin to tsmax)
Time maintained above:
• Temperature (TL)
• Time (tL)
Peak/Classification Temperature
(Tp)
Time within 5 °C of actual Peak
Temperature (tp)
Ramp-Down Rate
Time 25 °C to Peak Temperature
© 2016 Littelfuse,Inc.
Specifications are subject to change without notice.
Revised July 26,2016
Pb-Free Assembly
3° C/second max.
150 °C
200 °C
60-180 seconds
217 °C
60-150 seconds
260 °C
20-40 seconds
6 °C/second max.
8 minutes max.
littelfuse.com
Max
4.15 mm
(0.163")
4.15 mm
(0.163")
2.0 mm
(0.081”)
-
PolyZen
Polymer Enhanced Zener Diode
Micro-Assemblies
PRODUCT : ZEN164V130A24LS
DOCUMENT: SCD27330
REV LETTER: D
REV DATE: JULY 26, 2016
PAGE NO.: 5 OF 10
PACKAGING
Packaging
ZENXXXVXXXAXXLS
Tape & Reel
3,000
Standard Box
15,000
Reel Dimensions for PolyZen Devices
Amax = 330
Nmin = 102
W1 = 8.4
W2 = 11.1
© 2016 Littelfuse,Inc.
Specifications are subject to change without notice.
Revised July 26,2016
littelfuse.com
PolyZen
Polymer Enhanced Zener Diode
Micro-Assemblies
PRODUCT : ZEN164V130A24LS
DOCUMENT: SCD27330
REV LETTER: D
REV DATE: JULY 26, 2016
PAGE NO.: 6 OF 10
Matte Finish These Area
Nmin
Amax
Taped Component Dimensions for PolyZen Devices
© 2016 Littelfuse,Inc.
Specifications are subject to change without notice.
Revised July 26,2016
littelfuse.com
PRODUCT : ZEN164V130A24LS
PolyZen
DOCUMENT: SCD27330
REV LETTER: D
REV DATE: JULY 26, 2016
PAGE NO.: 7 OF 10
Polymer Enhanced Zener Diode
Micro-Assemblies
TYPICAL CHARACTERISTICS
V (V) or I (A)
Typical Fault Response: ZEN164V130A24LS
24 V/1.0 A Current Limited Source (Iout=0)
24
22
20
18
Vin (V)
16
Vout (V)
14
I FLT (A)
12
10
8
6
4
2
0
0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50
Time (sec)
Pulse IV (100uSec Pulse)
Pulse IV (100uSec Pulse)
10
17
Current: IFLT (A)
Voltage: V OUT (V)
18
16
15
ZEN164VxxxAxxLS
5
0
-5
ZEN164VxxxAxxLS
14
1
© 2016 Littelfuse,Inc.
Specifications are subject to change without notice.
Revised July 26,2016
0.1
0.01
0.001
0.0001
0.00001
Current: IFLT (A)
-10
-5
0
5
10
15
Voltage: V OUT (V)
littelfuse.com
20
PRODUCT : ZEN164V130A24LS
PolyZen
DOCUMENT: SCD27330
REV LETTER: D
REV DATE: JULY 26, 2016
PAGE NO.: 8 OF 10
Polymer Enhanced Zener Diode
Micro-Assemblies
Time to Trip Vs IFLT RMS (IOUT = 0)
10.00
VOUT Peak Vs IFLT RMS (IOUT = 0)
Time To Trip (Sec)
22.0
VOUT Peak (V)
20.0
18.0
16.0
14.0
12.0
ZEN164V130A24LS
0.5
IFLT RMS(A)
1.00
0.10
10.0
0.0
ZEN164V130A24LS
0.0
1.0
1
Time To Trip (Sec)
ZENxxxV130A24LS
-0.2
VOUT (V)
1.0
Time to Trip Vs IFLT (IOUT = 0)
VOUT Peak Vs IFLT (IOUT = 0)
0
-0.4
-0.6
-0.8
-1
ZENxxxV130A24LS
0.1
0.01
0.001
-1.2
-50
-40
-30
-20
IFLT RMS(A)
-10
-50
0
Temperature Effect on IHold (IFLT = 0)
Time To Trip (Sec)
ZENxxxV130A24LS
2.00
Linear
(ZENxxxV130A24LS)
1.50
-40
-30
-20
IFLT RMS (A)
-10
Time to Trip Vs IPTC RMS (IFLT = 0)
10
2.50
IHold (A)
0.5
IFLT RMS (A)
1.00
0.50
0.00
ZENxxxV130A24LS
1
0.1
0.01
0.001
-40
-20
0
20
40
60
80
Ambient Temperature (C)
© 2016 Littelfuse,Inc.
Specifications are subject to change without notice.
Revised July 26,2016
100
0
10
20
30
IPTC RMS (A)
littelfuse.com
40
0
PRODUCT : ZEN164V130A24LS
PolyZen
Polymer Enhanced Zener Diode
Micro-Assemblies
DOCUMENT: SCD27330
REV LETTER: D
REV DATE: JULY 26, 2016
PAGE NO.: 9 OF 10
Temperature Effect on RTyp
0.40
RTyp (Ohms)
ZENxxxV130A24LS
0.30
0.20
0.10
0.00
20
40
60
80
Ambient Temperature (C)
Materials Information
ROHS Compliant
ELV Compliant
Pb-Free
Halogen Free*
HF
* Halogen Free refers to: Br≤900ppm, Cl≤900ppm, Br+Cl≤1500ppm.
Littelfuse products are not designed for, and shall not be used for, any purpose (including, without limitation, automotive, military, aerospace, medical, life-saving,
life-sustaining or nuclear facility applications, devices intended for surgical implant into the body, or any other application in which the failure or lack of desired
operation of the product may result in personal injury, death, or property damage) other than those expressly set forth in applicable Littelfuse product
documentation. Warranties granted by Littelfuse shall be deemed void for products used for any purpose not expressly set forth in applicable Littelfuse
documentation. Littelfuse shall not be liable for any claims or damages arising out of products used in applications not expressly intended by Littelfuse as set forth in
applicable Littelfuse documentation. The sale and use of Littelfuse products is subject to Littlefuse Terms and Conditions of Sale, unless otherwise agreed by
Littelfuse
© 2016 Littelfuse,Inc.
Specifications are subject to change without notice.
Revised July 26,2016
littelfuse.com