ZEPTOSMDC0011F

POLYSWITCH® Surface Mount > zeptoSMDC PPTC zeptoSMDC Series Description Littelfuse zeptoSMDC Series PPTC is developed for overcurrent and overtemperature protection at low-cost in mobile application components. It works as a ‘fail-safe’ to protect battery management ICs and fuel gauges. Applications • Mobile phone • Lithium battery management • Wearable device RY Features • Maximum electrical rating: 13 VDC • Small footprint 0201 size • Short circuit current: 82~200mA • ISO/TS 16949 certified Benefits A • Resettable • RoHS compliant IN • Save space in PCBs due to small footprint Electrical Characteristics Part Number Initial Resistance Ohms @ 25°C zeptoSMDC0011F 10 zeptoSMDC0015F 10 IMAX 3 (mA) Max Trip Temperature °C TYP IM Min 1 VMAX 2 (Vdc) Hold Current 4 (mA) @ 25°C Time to Trip 5 Current (mA) Time (ms) Max ohms @ -20°C Min ohms @ 60°C Max 80 13 82 125 11 80 20 68 290 60 13 200 125 15 80 20 28 150 PR EL Notes: 1. Rmin = Minimum resistance of device in initial (un-soldered) state 2. Vmax = Maximum voltage device can withstand without damage at rated current (Imax) 3. Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax) 4. Ihold = Hold current: maximum current device will pass without tripping in 25°C still air. Values specified using PCB’s with 0.004” x 1.0 ounce copper traces 5. Time to trip values specified using PCB’s with 0.004” x 1.0 ounce copper traces 6. With LOCTITE ECCOBOND UF 3915, curing condition: 140°C/20mins, resistance is measured 12 hours post coating curing process © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/04/20 Post Process Resistance 6 POLYSWITCH® Surface Mount > zeptoSMDC Physical Specifications Operating Temperature -20°C to 60°C Passive Aging +85°C, 1000 hours -25% typical resistance change +65°C, 90% R.H.,100 hours -/+15% typical resistance change Thermal Shock MIL–STD–202, Method 107G -33% typical resistance change -40°C to +85°C (20 Times) Vibration MIL–STD–202, Method 204, Condition A No change Moisture Sensitivity Level Level 2a, J–STD–020 Lead Solderability Meets EIA Specification RS186-9E, ANSI/J- STD-002B, Test S IN Soldering Parameters Solder-Plated Copper (Solder Material: NiAu) A Humidity Aging Terminal Materials RY Environmental Specifications Pb-free assembly Average Ramp-Up Rate (Liquidus Temp (TL) to peak 1~3ºC/second max. TP Temperature Min. (Tsmin) 130ºC TL Temperature Max. (Tsmax) 180ºC Time Min. to Max. (Ts) 90-110 seconds Tsmax to TL Ramp-up Rate Reflow ≤2ºC/seconds max. Temperature (TL) (Liquidus) 217ºC Time (tL) 60~70 seconds Peak Temperature (TP) 240ºC 35 seconds Ramp-Down Rate 2~4ºC/seconds Time 25ºC to Peak Temperature (TP) 300 seconds max. Ramp-up tL Ramp-do Ramp-down TS(min) 25 Preheat tS time to peak temperature Time • All temperature refer to topside of the package, measured on the package body surface. • If reflow temperature exceeds the recommended profile, devices may not meet the performance requirements. • Recommended reflow methods:IR, vapor phase oven, hot air oven. • Customer should validate that the solder paste amount and reflow recommendations to meet its application • Recommended maximum paste thickness is 0.25 mm (0.010 inch). • Devices can be cleaned using standard industry methods and aqueous solvents. • Devices can be reworked using the standard industry practices (avoid contact to the device). PR EL Time within 3ºC of actual Peak Temperature (tP) tP TS(max) Temperature Preheat IM Profile Feature © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/04/20 POLYSWITCH® Surface Mount > zeptoSMDC Physical Dimension Solder Pad Layout B A C B D A B B C A Part Number RY C A D Max Min Max Min Max Min Max zeptoSMDC0011F 0.55 (0.022) 0.65 (0.026) --- 0.40 (0.016) 0.40 (0.016) 0.50 (0.020) 0.10 (0.004) 0.25 (0.010) zeptoSMDC0015F 0.55 (0.022) 0.65 (0.026) --- 0.40 (0.016) 0.40 (0.016) 0.50 (0.020) 0.10 (0.004) 0.25 (0.010) Packaging IN Min Ordering Tape & Reel Quantity Minimum Orgder Quantity zeptoSMDC0011F RF5005-000 15,000 zeptoSMDC0015F RF5006-000 15,000 Part Numbering System zepto SMDC 0011 F 0201 SIZE SERIES PR SURFACE MOUNT DEVICE HOLD CURRENT 11mA LEAD-FREE © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/04/20 Recommneded Pad Layout Figures [mm(in)] Dimension A (Nom) Dimension B (Nom) Dimension C (Nom) 15,000 0.45 (0.0178) 0.325 (0.013) 0.250 (0.010) 15,000 0.45 (0.0178) 0.325 (0.013) 0.250 (0.010) IM EL Part Number Warning • Electrical performance of the device can differ according to installation conditions. Users should independently evaluate the suitability of the device under the actual application conditions. • Operation beyond maximum ratings may result in device damage. • Exposure to silicon-based oils, solvents, electrolytes, acids, or similar materials can adversely affect device performance. • The device undergoes thermal expansion during fault conditions. It should be provided with adequate space to allow expansion and should be protected against mechanical stress. • Consult with Littelfuse if the device will experience thermal process other than reflow onto PCB board, such as molding or hand soldering. POLYSWITCH® Surface Mount > zeptoSMDC Tape and Reel Specifications 40±0.1 (10xP0) 4±0.1 (P0) 3.5±0.05 (F) 0.42±0.03 (T) 0.53±0.03 (A0) 2±0.05 (P1) W2 All dimensions in mm W W1 (Measure at Hub) ØN ØA P0 P1 P2 ESD Logo 4 ± 0.1 2 ± 0.05 2 ± 0.05 0.53 ± 0.03 B0 0.70 ± 0.03 D0 1.55 ± 0.05 F 3.5 ± 0.05 E 1.75 ± 0.05 PR EL IM Standard Pack Quantity: 15,000 pcs Minimum Order Quantity: 15,000 pcs 8 ± 0.1 IN A0 Front View RY 0.70±0.03 (B0) A 8±0.1 (W) 1.75±0.05 (E) Ø1.55±0.05 (D0) 2±0.05 (P2) T 0.42 ± 0.03 A 178.0 ± 1.0 N 54.0 ± 0.5 W1 9.5 ± 0.5 W2 max 15.0 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/04/20