SURFACE MOUNT DEVICE LED Part No. : 1206KYCT
PACKAGE OUTLINE DIMENSIONS
REV:B / 01
1 .20 R0.10
1.10
0.55
2.10
0.55
5.00°
1.10 0.48 ~ 0.50 0.50
Notes: 1. All dimensions are in millimeters. 2. Tolerance is ± 0.1mm (.004") unless otherwise noted.
Features
Top view, wide view angle, single color Chip LED. Package in 8mm tape on 7" diameter reels. Compatible with automatic Pick & Place equipment. Compatible with Infrared and Wave soldering reflow solder processes. EIA STD package. I.C. compatible.
DRAWING NO. : DS-71-04-0005
DATE : 2004-06-07
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SURFACE MOUNT DEVICE LED Part No. : 1206KYCT
Chip Materials
Dice Material : AlInGaP Light Color : Super Yellow Lens Color : Water Clear
REV:B / 01
Absolute Maximum Ratings(Ta=25℃)
Symbol PD IPF IF VR ESD Topr Tstg Power Dissipation Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) Continuous Forward Current De-rating Linear From 25℃ Reverse Voltage Electrostatic Discharge Threshold(HBM) Operating Temperature Range Storage Temperature Range Wave Soldering Condition (Two times Max.)
Note A
Parameter
Rating 75 80 30 0.25 5 2000 -40 ~ +85 -40 ~ +85 260 (for 5 seconds)
Unit mW mA mA mA/℃ V V ℃ ℃ ℃ ℃
Infrared Soldering Condition (Two times MAX.) 240 (for 10 seconds)
Note A : HBM : Human Body Model. Seller gives no other assurances regarding the ability of to withstand ESD.
Electro-Optical Characteristics(Ta=25℃)
Parameter Luminous Intensity Viewing Angle Peak Emission Wavelength Dominant Wavelength Spectral Line Half-Width Forward Voltage Reverse Current Symbol IV 2θ1/2 λp λd Δλ VF IR Min. 40.0 Typ. 70.0 130 591 590 16 2.05 2.4 100 Max. Unit mcd deg nm nm nm V μA IF =20mA VR = 5V Test Condition IF=20mA Note 2 Measurement @Peak IF=20mA
DRAWING NO. : DS-71-04-0005
DATE : 2004-06-07
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SURFACE MOUNT DEVICE LED Part No. : 1206KYCT
Notes:
1. Luminous intensity is measured with a light sensor and filter combination that proximities the CIE eye-response curve. 2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. The dominant wavelength λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 4. Caution in ESD : Static Electricity and surge damages the LED. It is recommend use a wrist band or anti-electrostatic glove when handling the LED. All devices, equipment and machinery must be properly grounded. 5. Major standard testing equipment by “Instrument System” Model : CAS140B Compact Array Spectrometer and “KEITHLEY” Source Meter Model : 2400.
REV:B / 01
Typical Electro-Optical Characteristics Curves
Fig.1 Relative Intensity vs. Wavelength
DRAWING NO. : DS-71-04-0005
DATE : 2004-06-07
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SURFACE MOUNT DEVICE LED Part No. : 1206KYCT
Typical Electro-Optical Characteristics Curves
(25℃ Ambient Temperature Unless Otherwise Noted)
REV:B / 01
Fig.2 Forward Current vs.Forward Voltage
Luminous lntensity(mcd) Fig.3 Luminous Intensity vs.Forward Current 1000 Relative Luminous lntensity Normalized of 20mA Relative luminous intensity(%) 100 10 1 -60 -40 -20 -0 20 40 60 80 100 Ambient Temperature Ta(℃) Fig.4 Relative Luminous Intensity vs.Forward Current Fig.5 Luminous Intensity vs.Ambient Temperature
50 Forward Current IF(mA) 40 30 20 10 0 0 20 40 60 80 100 1.0 0.9 0.8 0.7 0.5 0.3
0°
10°
20° 30°
40° 50° 60° 70° 80° 90°
0.1 0.2 0.4 0.6
Ambient Temperature Ta(℃) Fig.6 Forward Current Derating Curve Fig.7 Relative Intensity vs.Angle
DRAWING NO. : DS-71-04-0005
DATE : 2004-06-07
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SURFACE MOUNT DEVICE LED Part No. : 1206KYCT
Label Explanation
BATCH: L1 B9 AC L1: Luminous Intensity Code B9: Forward Voltage Code AC: Dom Wavelength Code
REV:B / 01
Reel Dimensions
Notes: 1. Taping Quantity : 3000PCS 2. The tolerances unless mentioned is±0.1mm, Angle±0.5°, Unit : mm.
DRAWING NO. : DS-71-04-0005
DATE : 2004-06-07
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SURFACE MOUNT DEVICE LED Part No. : 1206KRCT
Package Dimensions Of Tape And Reel
REV:A / 03
Progressive direction
Polarity
Notes:All dimensions are in millimeters.
Moisture Resistant Packaging
Label
Reel
Label Aluminum moistue-proof bag Desiccant
240
145
255
Label
T LIG H
210
Box
435
Carton
Notes : One reel in a bag, one bag in a inner box, ten inner boxes in a carton. Unit : mm.
DRAWING NO. : DS-71-03-0005
DATE : 2004-06-07
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SURFACE MOUNT DEVICE LED Part No. : 1206KYCT
Cleaning
If cleaning is required , use the following solutions for less than 1 minute and less than 40℃. Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem.
REV:B / 01
Suggest Soldering Pad Dimensions
Direction of PWB camber and go to reflow furnace
Suggest IR Reflow Soldering Profile Condition:
240° C(MAX) Rising +5℃/sec (MAX) Temperature(℃)
C C
Cooling -5℃/sec (MAX)
+5℃/sec (MAX)
Time
DRAWING NO. : DS-71-04-0005
DATE : 2004-06-07
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SURFACE MOUNT DEVICE LED Part No. : 1206KYCT
Bin Code List
Luminous Intensity(IV), Unit:mcd@20mA Bin Code P Q R Min 40.0 63.0 100.0 Including test tolerance Bin Code YA YB Min 586.0 589.0 Including±1nm test tolerance Max 80.0 125.0 200.0 Forward Voltage(VF), Unit:V@20mA Bin Code 4 5 6 7 Min 1.85 1.95 2.05 2.15 Including test tolerance Max 591.0 594.0 Max 2.05 2.15 2.25 2.35
REV:B / 01
Dominant Wavelength (Hue),Unit: nm@20mA
CAUTIONS
1.Application Limitation :
The LED’s described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household application).Consult HB’s sales in advance for information on application in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LED’s may directly jeopardize life or health (such as airplanes, automobiles, traffic control equipment, life support system and safety devices).
2.Storage :
Before opening the package : The LEDs should be kept at 5°C to 30°C or less and 85%RH or less. The LEDs should be used within a year. After opening the package : The LEDs should be kept at 5°C to 30°C or less and 70%RH or less. The LEDs should be soldered within 168 hours(7 days) after opening the package. Please avoid rapid transitions in ambient temperature in high humidity environments where condensation may occur.
3.Soldering
Do not apply any stress to the lead frame during soldering while the LED is at high temperature. Recommended soldering condition. Reflow Soldering : Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max. Soldering Iron : (Not recommended) Temperature 300°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron : 20W Max. use SN60 solder of solder with silver content and don’t to touch LED lens when soldering.
DRAWING NO. : DS-71-04-0005
DATE : 2004-06-07
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SURFACE MOUNT DEVICE LED Part No. : 1206KYCT
REV:B / 01
Wave soldering : Pre-heat 100°C Max, Pre-heat time 60 sec. Max, Solder wave 260°C Max, Soldering time 5 sec. Max. preformed consecutively cooling process is required between 1st and 2nd soldering processes. 4. Lead-Free Soldering For Reflow Soldering : 1、Pre-Heat Temp:150-180℃,120sec.Max. 2、Soldering Temp:Temperature Of Soldering Pot Over 230℃,40sec.Max. 3、Peak Temperature:260℃,5sec. 4、Reflow Repetition:2 Times Max. 5、Suggest Solder Paste Formula 93.3 Sn/3.1 Ag/3.1 B /0.5 Cu For Soldering Iron (Not Recommended) : 1、Iron Tip Temp:350℃ Max. 2、Soldering Iron:30w Max. 3、Soldering Time:3 Sec. Max. One Time. For Dip Soldering : 1、Pre-Heat Temp:150℃ Max. 120 Sec. Max. 2、Bath Temp:265℃ Max. 3、Dip Time:5 Sec. Max.
DRAWING NO. : DS-71-04-0005
DATE : 2004-06-07
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SURFACE MOUNT DEVICE LED Part No. : 1206KYCT
5. Drive Method Circuit model A Circuit model B
REV:B / 01
(A)Recommended circuit. (B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED. 6.Reliability Test
Classification Test Item Test Condition Ta= Under Room Temperature As Per Data Sheet Maximum Rating *Test Time= 1000HRS (-24HRS,+72HRS)*@20mA. IR-Reflow In-Board, 2 Times Ta= 65±5℃,RH= 90~95% *Test Time= 1000HRS±2HRS Ta= 105±5℃ Test Time= 1000HRS (-24HRS,72HRS) Ta= -55±5℃ *Test Time=1000HRS (-24HRS,72H RS) 105±5℃ 10mins -55±5℃ 10mins Reference Standard MIL-STD-750D:1026 (1995) MIL-STD-883D:1005 (1991) JIS C 7021:B-1 (1982) MIL-STD-202F:103B(1980) JIS C 7021:B-11(1982) MIL-STD-883D:1008 (1991) JIS C 7021:B-10 (1982) JIS C 7021:B-12 (1982) MIL-STD-202F:107D (1980) MIL-STD-750D:1051(1995) MIL-STD-883D:1010 (1991) JIS C 7021:A-4(1982) MIL-STD-202F:107D(1980) MIL-STD-750D:1051(1995) MIL-STD-883D:1011 (1991) MIL-STD-202F:210A(1980) MIL-STD-750D:2031(1995) JIS C 7021:A-1(1982) MIL-STD-202F:208D(1980) MIL-STD-750D:2026(1995) MIL-STD-883D:2003(1991) IEC 68 Part 2-20 JIS C 7021:A-2(1982)
Operation Life High Temperature Endurance Test High Humidity Storage High Temperature Storage Low Temperature Storage Temperature Cycling
100 Cycles
Thermal Shock Environmental Test Solder Resistance
IR-Reflow In-Board, 2 Times 105±5℃ -55℃±5℃ 10mins 10mins 100 Cycles Tsol= 260 ± 5℃ Dwell Time= 10 ± 1sec Tsol= 235 ± 5℃ Immersion time 2±0.5 sec Immersion rate 25±2.5 mm/sec Coverage ≧95% of the dipped surface
Solder ability
7.Others: The appearance and specifications of the product may be modified for improvement without notice.
DRAWING NO. : DS-71-04-0005
DATE : 2004-06-07
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