130MR2C

Hebei I.T. (Shanghai) Co., Ltd LED SPECIFICATION Part No. ¾ Features/ z Single color/ z High bright output/ z Low power consumption/ z High reliability and long life/ z z 130MR2C ¾ Descriptions/ z z Dice material/ Emitting Color/ Super Bright Red/ Device Outline/ Special Type/ Lens Type Water Clear/ 2.4±0.2 AlGaInP .2 7±0 R1. 8 1. .2 ±0 3.3±0.2 2.4±0.2 3±0.2 1.6±0.2 CATHODE 25.4min 2.54±0.2 1±0.2 NOTE: z z All dimensions are millimeters/ mm.. Tolerance is +/-0.25mm unless otherwise noted/ 0.25mm Http //www.hebeiltd.com.cn 1.0Max 0.5±0.2 Page: 1 of 3 Hebei I.T. (Shanghai) Co., Ltd LED SPECIFICATION Part No. Absolute maximum ratings/ 130MR2C Ta = 25 Values Min. Max. -30 75 100 +85 +100 V mA mW mA Parameter Reverse Voltage Forward Current Power Dissipation Pulse Current Operating Temperature Storage Temperature Symbol Test Condition Unit VR IF Pd Ipeak Topr Tstr I R = 30 A ------Duty=0.1mS 1kHz ------- 5 ----------40 -40 ¾ Electrical and optical characteristics/ Parameter Forward Voltage Reverse Current Dominate Wavelength Peak Wavelength Spectral Line half-width Luminous Intensity IV Symbol Test Condition Ta = 25 Values Min. Typ. 2.0 ---624 632 20 1200 Max. 2.5 30 ------------V A nm nm nm mcd Unit VF IR d IF=20mA VR=5V IF=20mA IF=20mA IF=20mA IF=20mA ------------------- p ¾ Http //www.hebeiltd.com.cn Page: 2 of 3 Hebei I.T. (Shanghai) Co., Ltd LED SPECIFICATION Part No. ¾ Typical electrical/optical characteristic curves/ Fig.1 50 40 30 20 10 0 1 .5 Luminous Intensity Relative Value at IF=20mA Forward Current(mA) 130MR2C V s. F ig.2 2.5 2.0 1 .5 1.0 0.5 0 0 V s. 1.7 1.9 2.1 2.3 Forward Voltage(V) 2.5 10 20 30 40 IF-Forward Current (mA) 50 F ig.3 50 Forward Current(mA) 40 30 20 10 0 0 20 40 V s. Relative Luminous Intensity Fig.4 2 .5 2.0 1.5 1.0 0.5 0 -30 V s. 60 80 ) 100 Ambient Temperature T A ( -10 10 30 50 70 Ambient Temperature T A ( 90 ) Fig.5 Relative Luminous Intensity 100 75 50 25 0 300 Vs. 400 500 600 (nm)/ 700 800 900 Wavelength Http //www.hebeiltd.com.cn Page: 3 of 3 BIN ranking for LEDs BRIGHTNESS BIN Bin Code A B C D E F G IV(mcd) 0-5.0 5.0-7.0 7.0-9.8 9.8-13.7 13.7-19.0 19.0-26.6 26.6-37.2 Bin Code H J K L M N P IV(mcd) Bin Code 37.2-52.0 52.0-72.8 72.8-102 102-145 145-200 200-280 280-390 Q R S T U V W IV(mcd) 390-550 550-770 770-1100 1100-1520 1520-2130 2130-3000 3000-4180 Bin Code X Y Z1 Z2 Z3 Z4 Z5 IV(mcd) 4180--5860 5860-8200 8-10cd 10-12cd 12-14cd 14-16cd 16-18cd WAVELENGTH BIN Ligth Col. Bin Code Wavel. (nm) Ligth Col. Bin Code Wavel. (nm) B1 B2 B3 B4 B5 B6 G1 G2 BLUE GREEN G3 G4 G5 G6 G7 G8 G9 G10 G11 G12 G13 PURE GREEN G14 G15 G16 G17 G18 G19 450-455 455-460 460-465 465-470 470-475 475-480 491-494 494-497 497-500 500-503 503-506 506-509 509-512 512-515 515-518 518-521 521-524 524-527 527-530 530-533 533-536 536-539 539-542 542-545 545-548 RED PURE ORANGE YELLOW ORANGE YELLOW YG1 YG2 YG3 YG4 YG5 YG6 YG7 Y1 Y2 Y3 Y4 Y5 YO1 YO2 YO3 YO4 O1 O2 O3 R1 R2 R3 R4 R5 R6 555-558 558-561 561-564 564-567 567-570 570-573 573-576 582-585 585-588 588-591 591-594 594-597 597-600 600-603 603-606 606-609 609-612 612-615 615-618 618-621 621-624 624-627 627-630 630-633 633-636 BLUE YELLOW GREEN FORWARD VOLTAGE (VF) BIN Bin Code V1 V2 V3 V4 VF (V) 1.6-1.8 1.8-2.0 2.0-2.2 2.2-2.4 Bin Code V5 V6 V7 V8 VF (V) 2.4-2.6 2.6-2.8 2.8-3.0 3.0-3.2 Bin Code V9 V10 V11 V12 VF (V) 3.2-3.4 3.4-3.6 3.6-3.8 3.8-4.0 Bin Code V13 V14 V15 V16 VF (V) 4.0-4.2 4.2-4.4 4.4-4.6 4.6-4.8 Page:4 LED ySOLDERING METHOD LAMP APPLICATION SOLDERING CONDITIONS REMARK y Solder no closer than 3mm from the base of the package y Using soldering flux,” RESIN FLUX” is recommended. y During soldering, take care not to press the tip of iron against the DIP SOLDERING Bath temperature: 260±5 Immersion time: with 5 sec Soldering iron: 30W or smaller lead. SOLDERING Temperature at tip of iron: 260 or lower (To prevent heat from being IRON Soldering time: within 5 sec. transferred directly to the lead, hold the lead with a pair of tweezers while soldering 1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1), be careful not to stress the leads with iron tip. /HDG ZULHV 3DQHO )LJ 2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package. /HDG ZULHV /HDYH D VOLJKW FOHDUDQFH )LJ Page : 5 LED LAMP APPLICATION 3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to avoid steering the leads (See Fig.3). 3& ERDUG ) LJ MLJ 4) Repositioning after soldering should be avoided as much as possible. If inevitable, be sure to preserve the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature. yLED MOUNTING METHOD 1) When mounting the LED by using a case, as shown Fig.4, ensure that the mounting holds on the PC board match the pitch of the leads correctly-tolerance of dimensions of the respective components including the LED should be taken into account especially when designing the case, PC board, etc. to prevent pitch misalignment between the leads and board holes, the diameter of the board holes should be slightly larger than the size of the lead. Alternatively, the shape of the holes should be made oval. (See Fig.4) case pc board Fig.4 Page : 6 LED LAMP APPLICATION 2) Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs. Tube Stand-off Fig.5 Fig.6 yFORMED LEAD 1) The lead should be bent at a point located at least 2mm away from the package. Bending should be performed with base fixed means of a jig or pliers (Fig.7) )LJ 2) Forming lead should be carried our prior to soldering and never during or after soldering. 3) Form the lead to ensure alignment between the leads and the hole on board, so that stress against the LED is prevented. (Fig.8) PP Page : 7 LED yLEAD STRENGTH LAMP APPLICATION 1) Bend strength Do not bend the lead more than twice. (Fig.9) Fig.9 2) Tensile strength (@Room Temperature) If the force is 1kg or less, there will be no problem. (Fig.10) 2. .J Fig.10 yHANDLING PRECAUTIONS Although rigid against vibration, the LEDs may damaged or scratched if dropped. So take care when handling. yCHEMICAL RESISTANCE 1) Avoid exposure to chemicals as it may attack the LED surface and cause discoloration. 2) When washing is required, refer to the following table for the proper chemical to be sued. (Immersion time: within 3 minutes at room temperature.) SOLVENT Freon TE Chlorothene Isopropyl Alcohol Thinner Acetone Trichloroethylene --Usable --Do not use. ADAPTABILITY NOTE: Influences of ultrasonic cleaning of the LED resin body differ depending on such factors as the oscillator output, size of the PC board and the way in which the LED is mounted. Therefore, ultrasonic cleaning should only be performed after confirming there is no problem by conducting a test under practical. Page : 8 LED LAMP PASSED TESTS Experiment Item: Item Test Condition Lamp & IR Ta 25 5 IF= 20mA RH =60%RH DYNAMIC:100mA 1ms 1/10 duty STATIC STATE: IF 20mA TEST TIME: 168HRS -24HRS +24HRS 500HRS -24HRS +24HRS 1000HRS -24HRS +72HRS Ta 65 5 RH 90 95%RH TEST TIME 240HRS 2HRS 105 25 -55 25 30min 5min 30min 5min 10CYCLES 105 5 -55 5 10min 10min 10CYCLES Reference Standard OPERATION LIFE MIL-STD-750 1026 MIL-STD-883 1005 JIS C 7021 B-1 HIGH TEMPERATURE HIGH HUMIDITY STORAGE MIL-STD-202 103B JIS C 7021 B-1 TEMPERATURE CYCLING MIL-STD-202 107D MIL-STD-750 1051 MIL-STD-883 1010 JIS C 7021 A-4 MIL-STD-202 107D MIL-STD-750 1051 MIL-SYD-883 1011 MIL-STD-202 210A MIL-STD-750-2031 JIS C 7021 A-1 MIL-STD-202 208D MIL-STD-750 2026 MIL-STD-883 2003 JIS C 7021 A-2 THERMAL SHOCK SOLDER RESISTANCE T sol 260 5 DWELL TIME 10 lsec T sol 230 5 DWELL TIME 5 lsec SOLDERABILITY Drive Method Circuit model A Circuit model B Page : 9 (A)Recommended circuit. (B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.