520LB7C-F2

5.0 mm PACKAGE DIMENSIONS DIA LED LAMP REV:A / 1 520LB7C-F2 ITEM RESIN LEAD FRAME Note: MATERIALS Epoxy Resin Sn Plating iron Alloy 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm(0.010 ") Unless otherwise specified. 3.Protruded resin under flange is 1.5mm(0.059 ") max. 4.Lead spacing is measured where the leads emerge from the package. 5.Specification are subject to change without notice 6.highlight 2.0V at IF=0.5mA ) DRAWING NO. : DS-35-07-0016 DATE : 2008-12-24 Page : 6 5.0 mm LED MOUNTING METHOD DIA LED LAMP REV:A / 1 520LB7C-F2 4) When mounting the LED by using a case, as shown Fig.4, ensure that the mounting holds on the PC board match the pitch of the leads correctly-tolerance of dimensions of the respective components including the LED should be taken into account especially when designing the case, PC board, etc. to prevent pitch misalignment between the leads and board holes, the diameter of the board holes should be slightly larger than the size of the lead. Alternatively, the shape of the holes should be made oval. (See Fig.4) case pc board Fig.4 5) Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs. Tube Stand-off Fig.5 Fig.6 DRAWING NO. : DS-35-07-0016 DATE : 2008-12-24 Page : 7 5.0 mm FORMED LEAD DIA LED LAMP REV:A / 1 520LB7C-F2 should be performed with base fixed means of a jig or pliers (Fig.7) 1) The lead should be bent at a point located at least 2mm away from the package. Bending Fig.7 2) Forming lead should be carried our prior to soldering and never during or after soldering. 3) Form the lead to ensure alignment between the leads and the hole on board, so that stress against the LED is prevented. (Fig.8) LEAD STRENGTH 1) Bend strength Do not bend the lead more than twice. (Fig.9) Fig.9 2mm DRAWING NO. : DS-35-07-0016 DATE : 2008-12-24 Page :8 5.0 mm DIA LED LAMP REV:A / 1 520LB7C-F2 2) Tensile strength (@Room Temperature) If the force is 1kg or less, there will be no problem. (Fig.10) OK！ 1Kg Fig.10 HEAT GENERATION 1) Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. The operating current should be decided after considering the ambient maximum temperature of LEDs. CHEMICAL RESISTANCE 1) Avoid exposure to chemicals as it may attack the LED surface and cause discoloration. 2) When washing is required, refer to the following table for the proper chemical to be sued. (Immersion time: within 3 minutes at room temperature.) SOLVENT Freon TE Chlorothene Isopropyl Alcohol Thinner Acetone Trichloroethylene ⊙--Usable ADAPTABILITY ⊙ ╳ ⊙ ╳ ╳ ╳ NOTE: Influences of ultrasonic cleaning of the LED resin body differ depending on such factors as the oscillator output, size of the PC board and the way in which the LED is mounted. Therefore, ultrasonic cleaning should only be performed after confirming there is no problem by conducting a test under practical. ╳--Do not use. DRAWING NO. : DS-35-07-0016 DATE : 2008-12-24 Page :9 5.0 mm OTHERS DIA LED LAMP REV:A / 1 520LB7C-F2 1) Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum 2) rating when using the LEDs with matrix drive. Flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it. The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult PARA’s sales staff in advance for information on the applications in which exceptional quality and reliability are required , particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices). User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from PARA. When defective LEDs are found, the User shall inform PARA directly before disassembling or analysis. The formal specifications must be exchanged and signed by both parties before large volume purchase begins. The appearance and specifications of the product may be modified for improvement without notice. 3) 4) 5) 6) DRAWING NO. : DS-35-07-0016 DATE : 2008-12-24 Page :10 5.0 mm DIA LED LAMP REV: A / 1 520LB7C-F2 Bin Code List Forward Voltage (VF), Unit:v@20mA Bin Code V0 V1 V2 V3 V4 V5 Min 2.8 3.0 3.2 3.4 3.6 3.8 Max 3.0 3.2 3.4 3.6 3.8 4.0 Tolerance of each bin are±0.1Volt Dominant Wavelength(λD), Unit:nm@20mA Bin Code D4 D5 D6 D7 D8 Min 463 466 469 472 474 Max 466 469 472 474 476 Luminous Intensity(IV), Unit:mcd@20mA Bin Code I J K L M Min 1510 2110 2950 4130 5780 Max 2110 2950 4130 5780 8090 Tolerance of each bin are±15% DRAWING NO. : DS-35-07-0016 DATE : 2008-12-24 Page : 11