560JY8C

5.0 mm DIA LED LAMP REV:A / 0 560JY8C PACKAGE DIMENSIONS Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm(0.010 ") Unless otherwise specified. 3.Protruded resin under flange is 1.5mm(0.059 ") max. 4.Lead spacing is measured where the leads emerge from the package. 5.Specification are subject to change without notice DRAWING NO. : DS-35-03-0393 DATE : 2003-06-26 Page : 1 HD-R/RD013 5.0 mm DIA LED LAMP REV:A / 0 560JY8C FEATURES * 5.0mm DIA LED LAMP * HIGH LUMINOUS INTENSITY OUTPUT. * LOW POWER CONSUMPTION. * HIGH EFFICIENCY. * VERSATILE MOUNTING ON P.C. BOARD OR PANEL. * I.C. COMPATIBLE. CHIP MATERIALS * Dice Material : AlGaInP/GaAs * Light Color : ULTRA YELLOW * Lens Color : WATER CLEAR ABSOLUTE MAXIMUM RATING : ( Ta = 25°C ) SYMBOL PAD VR IAF IPF － Topr Tstg PARAMETER Power Dissipation Per Chip Reverse Voltage Per Chip Continuous Forward Current Per Chip Peak Forward Current Per Chip (Duty－0.1,1KHz) Derating Linear From 25°C Per Chip Operating Temperature Range Storage Temperature Range ULTRA YELLOW 80 5 30 80 0.40 UNIT mW V mA mA mA/°C -25°C to 85°C -40°C to 85°C Lead Soldering Temperature｛1.6mm(0.063 inch) From Body｝260°C ± 5°C for 5 Seconds ELECTRO-OPTICAL CHARACTERISTICS : ( Ta = 25°C ) SYMBOL VF IR λD ∆λ 2θ1/2 IV PARAMETER Forward Voltage Reverse Current Dominant Wavelength Spectral Line Half-Width Half Intensity Angle Luminous Intensity TEST CONDITION MIN. TYP. MAX. UNIT IF = 20mA VR = 5V IF = 20mA IF = 20mA IF = 20mA IF = 20mA 50 585 588 15 55 60 1.8 2.1 2.6 100 590 V µA nm nm deg 1500 1900 2400 mcd DRAWING NO. : DS-35-03-0393 DATE : 2003-06-26 Page : 2 HD-R/RD014 5.0 mm DIA LED LAMP REV:A / 0 560JY8C DRAWING NO. : DS-35-03-0393 DATE : 2003-06-26 Page : 3 5.0 mm SOLDERING METHOD DIA LED LAMP REV:A / 0 560JY8C SOLDERING CONDITIONS REMARK Solder no closer than 3mm from the base of the package Using soldering flux,” RESIN FLUX” is recommended. DIP SOLDERING Bath temperature: 260±5℃ Immersion time: with 5 sec During soldering, take care not to press the tip of iron against the Soldering iron: 30W or smaller lead. SOLDERING Temperature at tip of iron: 260℃ or lower (To prevent heat from being IRON Soldering time: within 5 sec. transferred directly to the lead, hold the lead with a pair of tweezers while soldering 1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1), be careful not to stress the leads with iron tip.  Lead wries Panel (Fig.1) 2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.  Lead wries Leave a slight clearance (Fig.2) DRAWING NO. : DS-35-04-0744 DATE : 2004-12-03 Page : 4 5.0 mm DIA LED 560JY8C LAMP REV:A / 0 3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to avoid steering the leads (See Fig.3).  PC board （F ） ig.3 jig 4) Repositioning after soldering should be avoided as much as possible. If inevitable, be sure to preserve the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature. LED MOUNTING METHOD 1) When mounting the LED by using a case, as shown Fig.4, ensure that the mounting holds on the PC board match the pitch of the leads correctly-tolerance of dimensions of the respective components including the LED should be taken into account especially when designing the case, PC board, etc. to prevent pitch misalignment between the leads and board holes, the diameter of the board holes should be slightly larger than the size of the lead. Alternatively, the shape of the holes should be made oval. (See Fig.4) case pc board Fig.4 DRAWING NO. : DS-35-04-0744 DATE : 2004-12-03 Page : 5 5.0 mm DIA LED 560JY8C LAMP REV:A / 0 2) Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs. Tube Stand-off Fig.5 Fig.6 FORMED LEAD 1) The lead should be bent at a point located at least 2mm away from the package. Bending should be performed with base fixed means of a jig or pliers (Fig.7) Fig.7 2) Forming lead should be carried our prior to soldering and never during or after soldering. 3) Form the lead to ensure alignment between the leads and the hole on board, so that stress against the LED is prevented. (Fig.8) 2mm DRAWING NO. : DS-35-04-0744 DATE : 2004-12-03 Page : 6 5.0 mm LEAD STRENGTH DIA LED 560JY8C LAMP REV:A / 0 1) Bend strength Do not bend the lead more than twice. (Fig.9) Fig.9 2) Tensile strength (@Room Temperature) If the force is 1kg or less, there will be no problem. (Fig.10) OK！ 1Kg Fig.10 HANDLING PRECAUTIONS Although rigid against vibration, the LEDs may damaged or scratched if dropped. So take care when handling. CHEMICAL RESISTANCE 1) Avoid exposure to chemicals as it may attack the LED surface and cause discoloration. 2) When washing is required, refer to the following table for the proper chemical to be sued. (Immersion time: within 3 minutes at room temperature.) SOLVENT Freon TE Chlorothene Isopropyl Alcohol Thinner Acetone Trichloroethylene ⊙--Usable ADAPTABILITY ⊙ ╳ ⊙ ╳ ╳ ╳ NOTE: Influences of ultrasonic cleaning of the LED resin body differ depending on such factors as the oscillator output, size of the PC board and the way in which the LED is mounted. Therefore, ultrasonic cleaning should only be performed after confirming there is no problem by conducting a test under practical. ╳--Do not use. DRAWING NO. : DS-35-04-0744 DATE : 2004-12-03 Page : 7 5.0 mm DIA LED 560JY8C LAMP ssREV:A / 0 Experiment Item: Item Test Condition Lamp & IR Ta： 25±5℃ IF= 20mA RH：＜=60%RH ① DYNAMIC:100mA 1ms 1/10 duty ② STATIC STATE: IF＝20mA TEST TIME: 168HRS（-24HRS，+24HRS） 500HRS（-24HRS，+24HRS） 1000HRS（-24HRS，+72HRS） Ta： 65℃±5℃ RH： 90〜95%RH TEST TIME：240HRS±2HRS 105℃〜25℃〜-55℃〜25℃ 30min 5min 30min 5min 10CYCLES 105℃±5℃〜-55℃±5℃ 10min 10min 10CYCLES Reference Standard OPERATION LIFE MIL-STD-750：1026 MIL-STD-883：1005 JIS C 7021：B-1 HIGH TEMPERATURE HIGH HUMIDITY STORAGE TEMPERATURE CYCLING MIL-STD-202：103B JIS C 7021 ：B-1 MIL-STD-202：107D MIL-STD-750：1051 MIL-STD-883：1010 JIS C 7021 ：A-4 MIL-STD-202：107D MIL-STD-750：1051 MIL-SYD-883：1011 MIL-STD-202：210A MIL-STD-750-2031 JIS C 7021：A-1 MIL-STD-202：208D MIL-STD-750：2026 MIL-STD-883：2003 JIS C 7021 ：A-2 THERMAL SHOCK SOLDER RESISTANCE T，sol：260℃±5℃ DWELL TIME：10±lsec T，sol：230℃±5℃ DWELL TIME：5±lsec SOLDERABILITY DRAWING NO. : DS-35-04-0744 DATE : 2004-12-03 Page : 8