CB1F-10S-1.5H-TEJL-PA

NEW NEW Memory Stick® Connectors CB1 Series Card Push Insert/Push Eject q Card ejection distance of 10 mm q Mounting height of 3.5 mm q Mounting area: Smaller design is 78% of former size sOutline Receptacle connectors for use with the new generation of digital media devices requiring “Memory Stick® ” type of consumer removable memory card. Several variations are available: Miniature, Low Profile and with or without ejection mechanism. Button Touch Ejection sFeatures 1. Indication of Incorrect Card Insertion The connector will not allow the card to be complete inserted from the wrong end or reversed. The card will stop about 7mm before complete insertion position, visually indicating incorrect insertion. 2. Protection of the Contacts Incorrect insertion of the card will not damage the contacts. The card can be easily withdrawn and reinserted correctly. q Card ejection with tactile button operation q Card ejection distance of 10 mm q Equipped with card ejection switch 3. Excellent Card Handling The type that is equipped with an ejection mechanism provides a long ejection of the card which offers excellent card handling qualities. *Memory Stick is a registered trademark of the Sony Corporation. Without Card Ejection q Miniaturized, low profile design q Improved installation to the equipment is permitted using (M1.7) tapping screws q C an be equipped with an ejection mechanism depending on the design of the equipment side portion Note: Please position the card ejection button at the side of the equipment. 2003.12 1 sProduct Specifications Current rating 0.5A Rating Voltage rating 125V AC Operating temperature range -20ç to +85ç(Note) -40ç to +85ç Operating humidity range Relative humidity 96% max. (No condensation) Storage temperature range Item 1. Insulation resistance 2. Withstanding voltage 3. Contact resistance 4. Vibration 5. Humidity Specification 1000 M ohms min. No flashover or insulation breakdown 100 m ohms max. No electrical discontinuity of 1 µs or more Contact resistance: 40 m ohms max. from initial value Insulation resistance: 100 M ohms min. Contact resistance: 40 m ohms max. from initial value Insulation resistance: 100 M ohms min. Contact resistance: 40m ohms max. from initial value No deformation of any component. No affect on contacts 500 V DC Conditions 500 V AC / one minute 100mA DC Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours / 3 axis 96 hours at temperature of 40ç±2ç and humidity of 90% to 95% Temperature: -55ç/+5ç to +35ç/+85ç/+5ç to +35ç Duration: 30/5/30/5(Minutes) 5 cycles 12000 cycles at 400 to 600 cycles per hour Reflow: At the recommended temperature profile Manual soldering: 300ç for 3 seconds 6. Temperature cycle 7. Durability (mating/unmating) 8. Resistance to soldering heat Note :Includes temperature rise caused by current flow. sMaterials Part Insulator Contacts Material Heat resistant glass reinforced therm oplastic compound Phosphor bronze Finish Color: Black Contact area: Gold plated Termination area: Tin-Iead plated or tinned copper plated Contact area: Nickel plating Termination area: Tin-Iead plated or tinned copper plated ------------------- Remarks UL94V-0 ---------- Metal hold down Cover Eject mechanism components Phosphor bronze or stainless steel Stainless steel or cupper alloy Stainless steel Heat resistant glass reinforced therm oplastic compound CB1E,CB1F,CB1G Series is without the termination area. The CB1E Series has termination area with tin-lead plated. UL94V-0 sOrdering information CB 1 E - 10 S - 1.5 H - PEJC - * 1 2 3 : CB :1 4 5 6 7 8 9 1 Series name 2 Series No. 3 Ejector type :C E With eject mechanism F G D Without eject mechanism A 4 Number of contacts : 10 5 Connector type S : Receptacle } } 6 Contact pitch : 1.5 mm 7 Surface mount 8 Eject mechanism codes: PEJC : Card Push insert/Push eject EJL : Left button eject EJR : Right button eject 9 Suffix 2 sLow Profile, Push Insert-Push Eject Card pushed for ejection Card ejected Card fully inserted 29.4 26.8 (5.525) Memory stick card outline BPCB mounting pattern 3.85 (3.25) (31) 1.9±0.1 (19.8) (21) 26.8±0.1 1.9±0.1 26.6±0.1 33 Part No. CB1G-10S-1.5H-PEJC2 CL No. CL689-0037-5 26.2 1.9±0.1 3.2 4±0.1 0.9±0.05 P=1.5±0.03 3.5 9.3±0.05 0.6 P=1.5 13.5 CONTACT No.1 9.3 sButton Touch Eject Card ejected 27.75 22.75 Card fully inserted 11.975 (5.525) BPCB mounting pattern Memory stick card outline 3.85 (3.25) Eject stroke (2) (23) 32.5±00.3 .2 1 0. 0 + 0. - 4Ø3 (13) (0.8) 18.3 34.9 10.9 Part No. CB1F-10S-1.5H-TEJL-PA CL No. CL689-0028-4 16.5±0.03 1.5±0.03 4.5 11.15±0.03 3.4±0.1 .8 1 0. +0 0.6±0.05 0.9±0.05 0.6 P=1.5 13.5 32.5 37 Ø0.55 0.4 3 4.2 CONTACT No.1 3.5 P=1.5±0.05 13.5±0.05 3±0.05 4.2±0.05 11.15 Ø1.2 16.5 1.5 sWithout Card Ejection 24.7 BPCB mounting pattern 3.5 5.3±0.1 2.65±0.03 2-Ø 1.3 .05 +0 0 19.5 Ø1 0 .05 .3 Ø1 .3 +0 6.1±0.05 .3 Ø1 1.4 5.5 1.05±0.05 4.15±0.05 +0 0 .0 18.7±0.03 5 Ø1 10.9±00.3 39.8 18.3±00.3 5 1.45 CONTACT No.1 0.6 P=1.5 13.5 24.5 4.15 5.8 6.95 3.55 0.3 2±0.1 1±0.1 P=1.5±0.05 13.5±0.05 5.8±0.05 1±0.1 Part No. CB1D-10S-1.5H CL No. CL689-0021-5 0.6 Ø1.2 18.7 4.15 2±0.1 6.1±0.05 .4 Ø2 4- 3 sPush Insert-Push Eject Card ejected (19.5) (13.3) Card fully inserted Card pushed for ejection (12) q Normal type 30.4 26.8 (5.525) Memory stick card outline (3.25) BPCB mounting pattern 2.4±0.1 26.8±0.1 2.4±0.1 24±0.03 3.2 Part No. CB1EB-10S-1.5H-PEJC2 CL No. CL689-0026-9 10.1 10.5±0.1 8.6±0.1 40.8 24 4±0.1 4±0.1 0.9±0.05 P=1.5±0.03 9.3±0.05 CONTACT No.1 0.6 P=1.5 13.5 9.3 (3.5) (19.5) Card ejected Card fully inserted (13.3) Card pushed for ejection (12) q With "U" cut-out 30.4 26.8 13.4 (5.525) BPCB mounting pattern 8.85 3.85 Memory stick (3.25) card outline 2.4±0.1 26.8±0.1 2.4±0.1 24 15.1 3.2 24±0.03 10.5±0.1 8.6±0.1 4±0.1 Part No. CB1EBG-10S-1.5H-PEJC2 CL No. CL689-0034-7 10.1 40.8 4±0.1 0.9±0.05 P=1.5±0.03 9.3±0.05 0.6 P=1.5 13.5 CONTACT No.1 3.5 9.3 Card pushed for ejection q With square window (19.5) Card ejected (13.3) Card fully inserted 8.1 29.4 26.8 8.3 (5.525) Memory stick card outline 3.85 (3.25) BPCB mounting pattern 1.9±0.1 26.8±0.1 1.9±0.1 3.6 23.8 3.2 24±0.03 10.5±0.1 8.6±0.1 4±0.1 24 Part No. CB1EBH-10S-1.5H-PEJC2 CL No. CL689-0035-0 10.1 40.8 4±0.1 (12) 0.9±0.05 P=1.5±0.03 9.3±0.05 0.6 P=1.5 13.5 CONTACT No.1 3.5 9.3 4 sLeft Ejection Card ejected 23.1 21.8 4.45 3.65 Eject stroke (6) 0.1 4.05 Memory stick card outline 8.75 16.45 3.5 5.2 (3.3) Ø1 53.45 .8 CB1C-10S-1.5H-EJL(56) CL689-0006-1-56 47.95 26.45 Part No. CL No. BPCB mounting pattern Front edge of the printed circuit board 48MAX 10.5±0.03 3±0.1 1 2-Ø .3 .05 +00 51.45 10.5 3.45 4.65±0.05 6.55 5.55 29.9 4.95±0.05 CONTACT No.1 2 4.55 0.6 P=1.5 13.5 .2 Ø1 2- 0.4±0.05 2.4±0.1 0.9±0.1 P= 1.5±0.05 13.5±0.05 3.2±0.1 4.55±0.05 sRight Ejection Card ejected 23 21.8 9.25 4.05 17.35 Memory stick card outline 5.5 4.4 3.65 3.2 Ø2 . 3 Part No. CB1C-10S-1.5H-EJR(59) CL No. CL689-0007-4-59 23.4 10.5 5.55 Front edge of the printed circuit board 4.65±0.05 5 .0 +0 0 3.45 BPCB mounting pattern 41MAX 10.5±0.03 3±0.1 2 4.55 0.6 P=1.5 13.5 43.95 47.15 53.45 Eject stroke (3.3) 8.6 (6) 2. Ø1 2 31.2 CONTACT No.1 Ø 2- 1. 3 0.4±0.05 0.9±0.1 P=1.5±0.05 13.5±0.05 3.2±0.1 4.55±0.05 4.95±0.05 2.4±0.1 5.5 5 sWith flange, for screw attachment 33.45 16.5 13.5 P=1.5 1.5 BPCB mounting pattern 4.725 1.7 0.6 0.5 CONTACT No.1 30.05 26.3 8 2Ø1 . 30.05±0.05 4.725±0.05 5.25 .2 Ø2 16.5±0.05 ol Ø2 .2 + 0 0 .2 P=1.5±0.05 1.9 4.4 7.4±0.1 (h 20.3 18.6 1.2 Part No. CB1A-10S-1.5H(57) CL No. CL689-0001-8-57 2 19.25 4.9±0.1 4.4±0.05 11.6±0.1 0.9±0.05 2.75±0.1 5.3 3.3±0.1 3.8±0.1 1.5 Ø2 sWithout flange 16.5 13.5 P=1.5 BPCB mounting pattern 16.5±0.05 13.5±0.05 26.3 0.5 0.6 CONTACT No.1 5.25 7.4±0.1 P=1.5±0.05 3.8±0.1 4.1±0.1 3.8±0.1 4.1±0.1 e) ol (h 4.9±0.1 18.6 11.6±0.1 20.3 0.9±0.05 .1 Ø2 2- 1.2 2.75±0.1 Part No. CB1AA-10S-1.5H(57) CL No. CL689-0002-0-57 26.7 19.25 2 3.3±0.1 5.3 3.8±0.1 1.5 Ø2 BMemory Stick card insertion direction BMemory Stick fully inserted dimensions 21.45 1.35 2.8 4.4 6 9.5 40.5 6.3±0.1 6.6±0.1 1 0. +0 6.3±0.1 6.6±0.1 .1 Ø2 2.1 +0 0 2.9 e) 13.5±0.05 2 0. +0 e) ol (h e) ol (h sPackaging specification (Tray packaging) q Part Number: CB1G-10S-1.5H-PEJC2(1 tray: 40 pieces) q Part Number: CB1F-10S-1.5H-TEJL-PA(1 tray: 20 pieces) 0 330 -1 0 330 -1 30.1±0.2 30.1±0.2 43±0.2 320±0.5 252±0.3 P=36±0.2 A PS 40PICS 100±0.2 320±0.5 195±0.3 P=65±0.2 A A A PS 215±0.5 160±0.3 P=40±0.2 CB1G SERIES 215±0.5 160±0.3 P=40±0.2 225 -1 0 225 -1 0 2 0 PI CS q Part Number: CB1D-10S-1.5H(1 tray: 50 pieces) q Part Number: CB1EB*-10S-1.5H-PEJC2(1 tray: 25 pieces) 0 330 -1 0 330 -1 27.5±0.2 320±0.5 32.25±0.2 19±0.2 255.5±0.3 P=36.5±0.2 B 320±0.5 220±0.3 55±0.2 P=55±0.2 A CB1F(TEJL1) A B PS 215±0.5 177±0.3 P=29.5±0.2 215±0.5 160±0.3 P=40±0.2 0 225 -1 225 -1 0 25PICS q Part Number: CB1C-10S-1.5H-EJL(56)(1 tray: 20 pieces) q Part Number: CB1C-10S-1.5H-EJR(59)(1 tray: 20 pieces) 33.4±0.2 29.5±0.2 A A 27.5±0.2 0 330 -1 320±0.5 253.2±0.3 P=63.3±0.2 0 330 -1 320±0.5 222±0.3 55±0.2 P=74±0.2 CB1E(PEJC1) B B 0 225 -1 215±0.5 156±0.3 P=52±0.2 0 225 -1 215±0.5 160±0.3 P=40±0.2 20PICS CB1C(L1) 20PICS q Part Number: CB1A*-10S-1.5H(57)(1 tray: 50 pieces) 21.75±0.2 19±0.2 0 330 -1 320±0.5 276.5±0.3 P=39.5±0.2 C C 0 225 -1 215±0.5 177±0.3 P=29.5±0.2 CB1C(R1) CB1A(1) 7 BUsage Precautions 1.Care should be taken to correctly insert/withdraw the Memory Stick® card. Following correct insertion/withdrawal procedures will prevent device or connector damage. When handling the CB1C series connectors, hold it in the areas indicated by the arrows, as illustrated below. CB1A Series CB1C Series Contacts Recommended holding area Recommended holding area Contacts, metal hold-down and ejection components areas Metal hold-down 2.Follow the recommended insertion angles, as illustrated below. CB1A Series Outline of the Memory Stick card CB1C Series ±2°MA X ±1°MAX ±1°M AX Outline of the Memory Stick card 0°±0 .22° ±0.5 °MAX ±0. 2°M AX 15 Initial insertion (15 mm max.) Complete insertion (from 15 mm to full insertion) 8 3.When inserting or withdrawing cards from the CB1C Series, the side contacts on both sides will protrude outward by 0.6 mm. Care should be taken that they will not be restricted or touch other components. side contact (0.6) 4. Application of an excessive external force to the push rod may prevent the ejection or insertion of the card. Do not apply any load in a direction other than the push direction. Push direction Do not twist or bend ! Do not pull ! Push rod 9 sRecommended Temperature Profile 300ç IR Reflow Conditions Preheating : 150ç 30 to 90 sec. Soldering : 235±5ç 10 sec. max. 220ç min. 10 to 20 sec. 200ç Soldering 150ç Preheating 100ç 240ç max. 220ç 0ç 0S 50S 100S 150S 200S Reflow system : IR reflow Solder : Paste type 63 Sn/37 Pb (Flux content 9 wt%) Test board : Glass epoxy 60mm x 100mm x 1.6 mm Metal mask thickness : 0.15 mm Recommended temperature. The temperature may be slightly changed according to the solder paste type and volume used. 10