FH16M-96S-0.4SHW

High Density FPC Connector (0.3mm/0.4mm/0.5mm Pitch) FH16 Series FH16 Series Variation 0.3mm pitch 60 contact 0.3mm pitch 80 contact 0.3mm pitch 90 contact 0.4mm pitch 80 contact 0.5mm pitch 50 contact 0.5mm pitch 64 contact sFeatures 1. High Density FPC Connector [Conventional product (FH12 series)] 0.5mm pitch 30 contact The FH16 series is a fine pitch, zero insertion force (ZIF), right angle, bottom contact, connector compatible with flexible printed circuits (FPC) with a pitch of 0.3mm, 0.4mm, and 0.5mm and a recommended thickness of 0.295mm for single-sided or 0.306mm for double-sided. The FH16 provides a higher pin Excellent Serviceability with Flip-Lock Design count given the same amount of board space than other manufacturers of similar product. With a large selection in pin density, the FH16 series greatly improves design flexibility. FH16 : 0.3mm pitch 60, 80, and 90 contacts Flip-lock type FH16M : 0.4mm pitch 80 and 96 contacts FH16H : 0.5mm pitch 50 contacts FH16P : 0.5mm pitch 64 contacts 2. Easy mounting on PCB FH16 supports 0.3mm pitch cable but only requires a 0.6mm pitch pad layout on the PCB. The FH16’s staggered pin design allows the mounting lead area to be twice as wide as the FPC contact area making it easier to place the connector on the board given the fine pitch of the contacts. 3. User Friendly Flip-Lock Design The flip-lock (one-touch rotating type) ZIF structure secures the FPC connection with a single and light force. This design helps simplify assembly and repair work. When locking the FPC, the audible click assures the assembly worker of a steady FPC connection resulting in improved customer service. Mechanism to prevent FPC from escape and oblique mating 4. Prevents FPC from escape and oblique mating The FH16 series with its recommended FPC dimensions prevents the FPC from escape and oblique mating thereby securing a steady connection. 5. Compatible with Automatic Assembly Tooling Embossed tape packaging allows for automatic placement onto the PCB. sApplications Notebook computers, printers, PDAs, digital cameras and other compact devices for interconnecting the main circuit board with the LCD,PDP(Plasma Display),HDD or other device. Hard Disk-Drive PCB PCB Notebook PC HDD PDP PCB 66 sProduct Specifications Pitch Ratings Current rating 0.3mm 0.15A 0.4mm 0.3A 50V AC 0.5mm 0.4A Operating Temperature Range: –40ç to +70ç Operating Relative Humidity: Relative humidity 90% max Storage Temperature Range: –10ç to +50ç Storage Relative Humidity: Relative humidity 90% max (not dewed) Note2 Voltage rating 3 0V AC 60V AC (not dewed) Note1 Applicable cable t=0.30 ±0.05, Tin-lead plating (Note 3) Item 1. Insulation Resistance 500M ohms min. 2. Withstanding Voltage No flashover or insulation breakdown. 150m ohms max. *Including FPC conductor resistance. 150m ohms max. No electrical discontinuity of 1µs or more 5. Vibration Contact resistance: 150m ohms max. No damage, cracks, or parts dislocation. No electrical discontinuity of 1µs or more 6. Shock Contact resistance: 150m ohms max. No damage, cracks, or parts dislocation. 7. Humidity Specification 100V DC 0.3mm pitch: 090V AC 0.4mm pitch: 150V AC 0.5mm pitch: 200V AC 1mA 20 cycles Conditions applied for one minute 3. Contact Resistance 4. Durability (Insertion/withdrawal) No damage, cracks, or parts dislocation. Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours in each of the 3 directions. Acceleration of 490 m/s2, 11 ms duration, sine half-wave waveform, 3 cycles in each of the 3 axis. Contact resistance: 150m ohms max. Insulation resistance: 50M ohms min. No damage, cracks, or parts dislocation. Contact resistance: 150m ohms max. Temperature: – 40 Time 5 cycles Reflow: At the recommended temperature profile Manual soldering: 350±5ç for 3 seconds ¡ +15 to 35ç ¡ +85ç ¡ +15ç to 35ç : 30 minutes ¡ 5 minutes max. ¡ 30 minutes ¡ 5 minutes max. 96 hours at temperature of 40ç and humidity of 90% to 95% (Steady state) 8. Temperature cycle Insulation resistance: 50M ohms min. No damage, cracks, or parts dislocation. 9. Resistance to Soldering heat No deformation of components affecting performance. Note 1: Includes temperature rise caused by current flow. Note 2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers nonconducting condition of installed connectors in storage, shipment or during transportation. Note 3: When FPC is gold plated, the connector contacts should be also gold plated: Select the (05) specification. sMaterials Part Insulator Material Polyamide LCP PPS Contact Phosphor bronze Finish Color : Beige Color : Dark brown Tin-lead plating Gold plating ––––––– Remarks UL94V-0 sOrdering Information q Series name : FH : 16 : 0.3mm, 0.4mm, 0.5mm : SHW(SMT horizontal staggered row mount type) w Series No. r Contact pitch t Terminal Shape FH 16 – 64S – 0.5 SHW (05) q w e r t y e Number of contacts : 50, 60, 64, 80, 90, and 96 contacts y Plating Specification : No symbol : Tin-lead plating (05) : gold plating 67 BConnector Operating Instructions, precautions and recommendations Operation Precautions 1) Fully insert the FPC parallel to mounting surface, with the exposed conductive traces facing down. 1.FPC Termination procedure. Connector installed on the board. 1) Remove and dispose the pick-and-place insert. Positioning point 2) Rotate down the actuator until firmly closed. It is critical that the inserted FPC is not moved and remains fully inserted. Should the FPC be moved, open the actuator and repeat the process, starting with Step 1 above. 2) The connector will assure reliable performance when the actuator is open to 120° maximum (see fig.1) Do not exceed this angle, as this may cause permanent damage to the connector. Fig.1 120° 3) Do NOT push/pull actuator. Any damage to actuator will require replacement of the entire connector. 2.FPC Removal 1) Lift up the actuator. 2) Carefully remove the FPC. 68 sConnector Dimensions A B Q R Mark 10 C 0.12 R D 0.12 Suction Parts for Automatic Mounting 4.9 6.5 5.5 E FPC Conductive Surface 6.6 7.4 Unit: mm Part Number FH16-60S-0.3SHW FH16-80S-0.3SHW FH16-90S-0.3SHW FH16M-80S-0.4SHW FH16M-96S-0.4SHW FH16H-50S-0.5SHW FH16P-64S-0.5SHW CL No. 586-0620-2 586-0613-7 586-0697-7 586-0675-4 586-0715-7 586-0676-7 586-0649-4 Number of FPC contacts Contact Pitch 60 0.3 80 90 80 96 50 64 0.3 0.3 0.4 0.4 0.5 0.5 A 21.9 27.9 30.9 36.1 42.5 29.4 36.0 B 17.7 23.7 26.7 31.6 38.0 24.5 31.5 C 17.4 23.4 26.4 31.2 37.6 24.0 31.0 D 17.4 23.4 26.4 31.2 37.6 24.0 31.0 E 18.35 24.35 27.35 32.25 38.65 25.55 32.15 Q 0.3 0.3 0.3 0.4 0.4 0.5 0.5 R 0.6 0.6 0.6 0.8 0.8 1.0 1.0 NOTE: Embossed tape reel packaging (1,000 pieces/reel). Order by number of reels. 3 69 BRecommended PCB layout and metal mask dimensions B±0.05 Q±0.05 1.7±0.1 3.95±0.1 R±0.05 C±0.05 W (PCB) X (Metal mask) 1.7±0.1 Mark side R±0.05 D±0.05 W (PCB) X (Metal mask) * Recommended metal mask thickness: t=0.15 BFPC recommended dimensions 0.3 +0.04 _0.03 R0 .2 R 0. 0.1±0.05 0.07±0.07 ( 0.5 ) 1.4±0.1 1.4±0.1 1.3±0.1 1.8±0.1 2.65±0.2 0.8 R0 .2 R0 .2 +0.04 _0.03 Q±0.02 R±0.02 2 0.1±0.05 +0.04 0.3 _0.03 3 MIN 0.3±0.05 S±0.07 B±0.03 F±0.05 G±0.1 H±0.1 S±0.07 1 * Forced film material shall be polyamide + thermal hardened additives. 2 Conductor width shall be 0.1±0.05 if FPC has plating bars. FPC, Land, Metal Mask Dimension Table Part Number FH16-60S-0.3SHW FH16-80S-0.3SHW FH16-90S-0.3SHW CL No. 586-0620-2 586-0613-7 586-0697-7 Number of FPC contacts Contact Pitch 60 80 90 80 96 50 64 0.3 0.3 0.3 0.4 0.4 0.5 0.5 B C D F G H Q 0.3 0.3 0.3 0.4 0.4 0.5 0.5 R 0.6 0.6 0.6 0.8 0.8 1.0 1.0 S 0.3 0.3 0.3 0.3 0.3 0.5 0.3 W 17.7 17.4 17.4 18.3 18.8 20.3 23.7 23.4 23.4 24.3 24.8 26.3 26.7 26.4 26.4 27.3 27.8 29.3 31.6 31.2 31.2 32.2 32.7 34.2 38.0 37.6 37.6 38.6 39.1 40.6 24.5 24.0 24.0 25.5 25.5 27.5 31.5 31.0 31.0 32.1 32.6 34.1 4 MIN FH16M-80S-0.4SHW 586-0675-4 FH16M-96S-0.4SHW 586-0715-7 FH16H-50S-0.5SHW 586-0676-7 FH16P-64S-0.5SHW 586-0649-4 2 Unit: mm X 0.3±0.03 0.25±0.03 0.3±0.03 0.25±0.03 0.3±0.03 0.25±0.03 0.3±0.03 0.25±0.03 0.3±0.03 0.25±0.03 0.6±0.10 00.5±0.05 0.6±0.10 00.5±0.05 70 BPackaging Specification qEmbossed Carrier Tape Dimensions 4 2 12 1.75 6.8 Ø1 .5 0.5 M L K 1.7 10 J 7 1.5 4.9 Flat surface for placement with Automatic equipment Unreeling direction Unit: mm Inserted Connector FH16-60S-0.3SHW FH16-80S-0.3SHW FH16-90S-0.3SHW FH16M-80S-0.4SHW FH16M-96S-0.4SHW FH16H-50S-0.5SHW FH16P-64S-0.5SHW NOTE: 1,000 pieces per reel. Number of Contacts 60 80 90 80 96 50 64 J 44 44 44 56 56 44 56 K 40.4 40.4 40.4 52.4 52.4 40.4 52.4 L 20.2 20.2 20.2 26.2 26.2 20.2 26.2 M 22.3 28.3 31.3 36.6 43.0 29.9 36.6 2 Ø13 T 44.5 44.5 44.5 56.5 56.5 44.5 56.5 T qReel Dimensions Ø370 End portion Mounting portion Blank portion (10 pocket min.) Blank portion Lead portion (400mm min.) Ø 80 Top cover tape Embossed carrier tape (10 pocket min.) 71 BRecommended Temperature Profile 5 sec. max. 250 240ç 200 Temperature (ç) 200ç 150 160ç 150ç 100 50 25ç 0 Start (30 sec.) (60 sec.) 60 60 to 90 sec. Preheating Time (sec.) 120 (20 to 30 sec.) Soldering 180 HRS test conditions Solder method :Reflow, IR/hot air (Nihon Den-netsu Co., Ltd.’s Part Number: SENSBY NR-2) Environment :Room air Solder composition :Paste, 63%Sn/37%Pb (Senju Metal Industry, Co., Ltd.’s Part Number: OZ63-201C-50-9) Test board :Glass epoxy 45mm∞80mm∞1.6mm thick Land dimensions :Contact Pitch 0.3mm, 0.4mm 0.3mm∞1.7mm Contact Pitch 0.5mm 0.6mm∞1.7mm Metal mask :Contact Pitch 0.3mm, 0.4mm 0.25mm∞1.7mm∞0.15mm thick Contact Pitch 0.5mm 0.5mm∞1.7mm∞0.15mm thick This temperature profile is based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment manufacturer for specific recommendations. 72 BFH16 Series FPC Construction (Recommended Specifications) 1. Using Single-Sided FPC Material Name Covering layer film Cover adhesive Surface treatment Copper foil Base adhesive Base film Stiffener Polyamide 1 mil Polyamide 7 mil Total Reinforcement material adhesive Heat-hardened adhesive Tin-lead plating Cu 1oz Material Polyamide 1 mil Thickness (µm) 25 25 5 35 25 25 30 175 295 2. Using Double-Sided FPC Material Name Covering layer film Cover adhesive Surface treatment Through hole copper Copper foil Base adhesive Base film Base adhesive Copper foil Cover adhesive Cover layer film Stiffener Polyamide 1 mil Polyamide 1 mil Total Reinforcement material adhesive Heat-hardened adhesive Cu 1/2 oz Polyamide 1 mil Tin-lead plating Cu Cu 1/2 oz Material Polyamide 1 mil Thickness (µm) 25 25 5 15 18 18 25 18 18 25 25 50 100 299 Note : To prevent release of the lock due to FPC bending, please do not use copper foil on the rear side. 3. Precautions 1. This specification is a recommendation for the construction of the FH16 Series FPC (t=0.3 ±0.05). 2. The FH16 Series are connectors for thin FPC which is beginning to be used in cameras and other miniature equipment. Stiffener is not required for double-sided FPC which will be reflected in FPC cost reduction. Please note that in the case of single-sided FPC, stiffener is required, but the thickness dimension can be created easily. For details about the construction, please contact the FPC manufacturer. FPC Manufactures' Contact List Sumitomo Bakelite Co., Ltd. Flexible Printed Circuit Board Division 5-8, Higashi-shinagawa 2-chome, Shinagawa-ku, Tokyo, Japan Fujikura Ltd. Electronics Global Marketing Department 1-5-1, Kiba, Koto-ku, Tokyo, Japan NOK Corporation Sales Division Overseas Business Department 1-12-15, Shiba-Daimon, Minato-ku, Tokyo, Japan TEL:+81 3 5462 4191 FAX:+81 3 5462 4882 TEL:+81 3 5606 1165 FAX:+81 3 5606 1530 TEL:+81 3 3432 6976/8415 FAX:+81 3 3432 3919 73