FH25-21S-0.3SH

NEW 0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. FH 25 Series (51pos. type) 3.45mm 17 .1m m sFeatures 1. Extremely light weight The largest version, with all contacts loaded, weights only 0.11gramms. No exposed contacts Metal fittings do not protrude outside of the connector body 2. Conductive traces on the PCB can run under the connector No exposed contacts on the bottom of the connector. 3. High density together with reliable solderability on the board Staggered contact points and the leads plus the nickel barriers assure sufficient distance to prevents solder bridging. Absence of protrusions on each side of connector allows closer side-by-side mounting of the connectors or closer component placement in miniaturized devices. 4. Easy FPC insertion and reliable electrical connection Proven Flip Lock® actuator allows easy insertion of FPC. Tactile sensation when fully closed confirms complete electrical and mechanical connection. Mounting pitch Nickel barrier prevents solder bridges Insulator body 0.6mm Contacts 5. Accepts standard thickness FPC 0.2 mm thick standard Flexible Printed Circuit board can be used. This is the only ultra-low profile ZIF connector allowing the use of standard FPC. 0.3mm Solid bottom surface 6. Board placement with automatic equipment Flat top surface and packaging on the tape-and-reel allows use of vacuum nozzles. Standard reel contains 5,000 connectors. Actuator open sApplications Mobile phones, PDA’s, digital cameras, digital video cameras, LCD connections, plasma displays (PDP), camera modules and other compact devices requiring Flexible Printed Circuit connections using high reliability ultra-small profile connectors. FPC FPC insertion direction Actuator closed FPC fully inserted 2004.6 0.9mm 1 sProduct Specifications Rating Rated current 0.15 A DC Rated voltage 30 V AC Operating temperature range -55ç to +85ç (Note 1) Operating humidity range Relative humidity 90% max. (No condensation) Storage temperature range -10ç to +50ç (Note 2) Storage humidity range Relative humidity 90% max. Recommended FPC Item Thickness: = 0.2±0.03mm thick, gold plated connecting traces Specification 100 V DC 90 V AC /one minute 1 mA 10 cycles Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 10 cycles,3 axis. Acceleration of 981 m/s2, 6 ms duration, sine half-wave waveform, 3 cycles,3 axis. 96 hours at temperature of 40ç and humidity of 90% to 95%. Temperature: -55ç / +15ç to +35ç / +85ç / +15ç to +35ç Time: 30 / 2 to 3 / 30 / 2 to 3 (Minutes) 5 cycles Reflow: At the recommended temperature profile Manual soldering: 350ç±5ç for 5 seconds Conditions 1. Insulation resistance 50 M ohms min. 2. Withstanding voltage No flashover or insulation breakdown. 100 m ohms max. 3. Contact resistance * Including FPC conductor resistance Contact resistance: 100 m ohms max. 4. Durability (insertion/ withdrawal) No damage, cracks, or parts dislocation. No electrical discontinuity of 1 µs or more. Contact resistance: 100 m ohms max. 5. Vibration No damage, cracks, or parts dislocation. No electrical discontinuity of 1 µs. min. Contact resistance: 100 m ohms max. 6. Shock No damage, cracks, or parts dislocation. Contact resistance: 100 m ohms max. 7. Humidity Insulation resistance: 50 M ohms min. (Steady state) No affect on appearance or performance. Contact resistance: 100 m ohms max. Insulation resistance: 50 M ohms min. 8. Temperature cycle No damage, cracks, or parts looseness. 9. Resistance to No deformation of components affecting performance. soldering heat Note 1: Includes temperature rise caused by current flow. Note 2: The term ”storage” refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation. sMaterials Part Insulator Contacts Metal fittings Material LCP LCP Phosphor bronze Phosphor bronze Finish Color: Black Color: Dark brown Gold plated Tin plated(No-lead) Remarks UL94V-0 ----------------------------- sOrdering information FH25 - 51S - 0.3 - SH (05) 1 2 3 4 5 4 Terminal type SH: SMT horizontal mounting type 1 Series name: FH25 2 No. of contacts 3 Number of contacts: 21, 27, 33, 39, 45, 51 Contact pitch: 0.3 mm 5 Plating specifications (05): Gold, selective flash plated 2 BOperation and Precautions Operation Precautions 1 Do not apply excessive force or use any type of tool to operate the actuator. 1.FPC insertion procedure. Connector installed on the board. 1 Lift up the actuator. Use thumb or index finger. 2 Fully insert the FPC in the connector parallel to mounting surface, with the exposed conductive traces facing down. 2 The connector will assure reliable performance when the actuator is open to 130˚maximum. Do not exceed this angle, as this may cause permanent damage to the connector. 130° FPC conductor surface (Bottom side) 3 Rotate down the actuator until firmly closed. It is critical that the inserted FPC is not moved and remains fully inserted. 3 Exercise caution when applying upward force to the connected FPC. FPC conductor surface on opposite side. 2.FPC removal 1 Lift up the actuator. Carefully withdraw the FPC. 3 sSpecifications A B 0.3 ∞Number of contacts (0.15) 0.15 G G (0.12) 0.9(Including contact terminal leads) 0 (0.85) 2 1 A** Polarizing mark indicator (0.4) Number of contacts indicator (1.35) 3.05 1.0 E (1.8) 0 (0.15) (C: FPC insertion slot dimension) D 0.1MAX. (1.75) 2.3 0.1MAX. 1 2 Notes 1 The coplanarity of each terminal lead is within 0.1. 2 The contact terminal lead position indicates the dimension from the E surface, the bottom surface of the insulator body. 3 Slight variations in color of the plastic compounds do not affect form, fit or function of the connector. Unit: mm Part Number FH25-21S-0.3SH(05) FH25-27S-0.3SH(05) FH25-33S-0.3SH(05) FH25-39S-0.3SH(05) FH25-45S-0.3SH(05) FH25-51S-0.3SH(05) CL No. CL586-1204-3-05 CL586-1205-6-05 CL586-1207-1-05 CL586-1208-4-05 CL586-1209-7-05 CL586-1200-2-05 Number of Contacts 21 27 33 39 45 51 A 8.1 9.9 11.7 13.5 15.3 17.1 B 6.0 7.8 9.6 11.4 13.2 15.0 C 6.64 8.44 10.24 12.04 13.84 15.64 D 7.45 9.25 11.05 12.85 14.65 16.45 Embossed tape reel packaging (5,000 pieces/reel). Order by number of reels. 4 BRecommended PCB mounting pattern and metal mask dimensions A H 0.7±0.03 0.7±0.03 0.3 (0.25) ∞Number of contacts 0.3±0.05(Land) 0.1 H 0.25±0.05(Metal mask) Recommended metal mask thickness: t = 0.1 mm (0.25) R 1.65±0.03 (0.2) (0.15) (0.15) (0.15) (0.15) 0.2±0.03 0.4±0.03 FU LL 2.65±0.05 0.9±0.03 (0.05) (0.2) B±0.05 0.4±0.03 BRecommended FPC Dimensions C±0.05 A±0.03 2.8 MIN(Area with removed covering film layer) 1.2±0.15 1.1±0.15 0.3±0.15 0.6±0.02 0.3±0.07 0.3 +0.04 - 0.03 2-R0.2 MAX 2.8 (2.3) (0.2) 0.3 +0.04 - 0.03 0.6±0.02 0.3±0.02 D±0.03 (0.6) 0.6±0.07 Covering film layer 1 Polyamide and thermally hardening adhesive is recommended as the stiffener materials. 2 Overlap between covering film layer and stiffener is 0.5mm min. 2 0.5MIN Stiffener Unit: mm Part Number FH25-21S-0.3SH(05) FH25-27S-0.3SH(05) FH25-33S-0.3SH(05) FH25-39S-0.3SH(05) FH25-45S-0.3SH(05) FH25-51S-0.3SH(05) CL No. CL586-1204-3-05 CL586-1205-6-05 CL586-1207-1-05 CL586-1208-4-05 CL586-1209-7-05 CL586-1200-2-05 Number of Contacts 21 27 33 39 45 51 A 6.0 7.8 9.6 11.4 13.2 15.0 B 7.2 9.0 10.8 12.6 14.4 16.2 C 6.6 8.4 10.2 12.0 13.8 15.6 D 5.4 7.2 9.0 10.8 12.6 14.4 Embossed tape reel packaging (5,000 pieces/reel). Order by number of reels. 5 BPackaging Specification qEmbossed Carrier Tape Dimensions 4±0.1 (1.7) 2±0.15 8±0.1 1.75±0.1 (C) B±0.1 (3.75) (5.25) Unreeling direction (1.35) Flat surface for placement with automatic equipment A±0.3 Ø1 (0.3) .5 + 0 0 .1 Unit: mm Part Number FH25-21S-0.3SH(05) FH25-27S-0.3SH(05) FH25-33S-0.3SH(05) FH25-39S-0.3SH(05) FH25-45S-0.3SH(05) FH25-51S-0.3SH(05) 5,000 pieces per reel. CL No. CL586-1204-3-05 CL586-1205-6-05 CL586-1207-1-05 CL586-1208-4-05 CL586-1209-7-05 CL586-1200-2-05 Number of Contacts 21 27 33 39 45 51 A 16 24 24 24 24 24 B 7.5 11.5 11.5 11.5 11.5 11.5 C 8.4 10.2 12.0 13.8 15.6 17.4 D 16.5 24.5 24.5 24.5 24.5 24.5 qReel Dimensions 3± 0.5 (2) (D) Ø1 (Ø380) End portion Mounting portion Embossed carrier tape Lead portion (400mm min.) (Ø80) Blank portion (10 pockets min.) Blank portion (10 pockets min.) Top cover tape 6 BRecommended Temperature Profile qUsing Typical Solder Paste 5 sec. max. 250 240ç Temperature 200 200ç 150 160ç 150ç ç) 100 50 25ç 0 Start 60 Preheating 120 Time (Seconds) Soldering (30sec.) (60sec.) 60 sec. to 90 sec. 20 sec. to 30 sec. HRS test conditions Solder method :Reflow, IR/hot air (Nihon Den-netsu Co., Ltd.’s Part Number: SENSBY NR-2) Environment :Room air Solder composition :Paste, 63%Sn/37%Pb (Senju Metal Industry, Co., Ltd.’s Part Number: OZ63-201C-50-9) Test board :Glass epoxy 70mm∞80mm∞1.6mm thick Land dimensions: 0.3mm∞0.65mm,0.3mm∞0.8mm Metal mask :0.23∞0.55∞0.1mm thick, 0.23∞0.65∞0.1mm thick This temperature profile is based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment manufacturer for specific recommendations. qUsing Lead-free Solder Paste MAX 250ç 250 230ç 200 Temperature 200ç HRS test condition Solder method :Reflow, IR/hot air (Nihon Den-netsu Co., Ltd.’s Part Number: SENSBY NR-2) Environment :Room air (Senju Metal Industry, Co., Ltd.’s Part Number: M705-221CM5-42-10.5) Test board :Glass epoxy 70mm∞80mm∞1.6mm thick Land dimensions: 0.3mm∞0.65mm, 0.3mm∞0.8mm Metal mask :0.23∞0.55∞0.1mm thick, 0.23∞0.65∞0.1mm thick Solder composition :Paste, 96.5%Sn/3.0%Ag/0.5%Cu 150 150ç ç) 100 50 25ç (60sec.) 0 Start 60 Preheating 120 Time (Seconds) Soldering 60 sec. to 120 sec. (60sec.) The temperature profiles are based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment manufacturer for specific recommendations. 7 BFH25 Series FPC Construction (Recommended) 1. Using Single-sided FPC Name Covering film layer Cover adhesive Surface treatment Copper foil Base adhesive Base film Reinforcement material adhesive Stiffener Polyamide 3 mil thick Total Polyamide 1 mil thick 1µm to 5µm nickel underplated 0.2µm gold plated Cu 1oz Material Polyamide 1 mil thick. Thickness (µm) 25 25 (3) 35 25 25 30 75 193 2. Using Double-sided FPC Name Covering film layer Cover adhesive Surface treatment Through-hole copper Copper foil Base adhesive Base film Base adhesive Copper foil Cover adhesive Covering layer film Reinforcement material adhesive Rear side Stiffener Polyamide 1 mil thick Total Polyamide 1 mil thick Cu 1/2oz Polyamide 1 mil thick 1µm to 5µm nickel underplated 0.2µm gold plated Cu Cu 1/2oz Material Polyamide 1 mil thick Thickness (µm) 25 25 (3) 15 18 18 25 18 18 25 25 25 25 197 To prevent release of the lock due to FPC bending, use of the FPC with copper foil on rear side is NOT RECOMMENDED. 3. Precautions Note: Recommended specification for FPC 0.2 ± 0.03 mm thick. ® 5-23,OSAKI 5-CHOME,SHINAGAWA-KU,TOKYO 141-8587,JAPAN PHONE: 81-3-3491-9741, FAX: 81-3-3493-2933 http://www.hirose.com http://www.hirose-connectors.com 8 The contents of this catalog are current as of date of publication. Contents are subject to change without notice for the purpose of improvements.