NEW
0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors
FH 27 Series
qFPC thickness: 0.2±0.03 mm
q1.2 mm Height, actuator fully closed. (54 pos. shown)
sOverview
C ontinuous miniaturization of personal mobile devices created a need for a low profile, high density interconnection system.In the same time, the demand for higher currents and higher reliability Flexible Printed Circuits has also increased. Hirose meets all these challenges with introduction of this connector.
24.2mm
1.2mm
4.0mm
sFeatures
1. Low profile, small PCB mounting area, weight reduction
Protruding only 1.2 mm above the board the connector occupies 50% less area than comparable type having contacts spaced on 0.5 mm centers. Creative design, coupled with high manufacturing capabilities resulted in extremely low weight of the connector.
qFPC temporary retention
2. Higher current carrying capacity
Contact spacing of 0.4 mm allows production of wider and simpler pattern of conductive traces on FPC.
FPC notch
FPC temporary hold protrusion
3. FPC temporary hold and verification of correct insertion
The connector has built-in FPC hold protrusions allowing the tactile feel of the correct FPC insertion and holding it in position before closing of the actuator.
Temporary hold-FPC fully inserted
4. Uses standard 0.2 mm thick FPC 5. One-finger operation of the actuator
Proven (in several other Hirose's connectors!) Flip-Lock rotating actuator assures reliable mechanical and electrical connection with FPC, confirming it with a definite tactile feel.
qWider FPC conductive traces
0.4mm 0.27mm
6. Board placement with automatic equipment
Flat top surface and packaging on the tape-and reel allows the use of vacuum nozzles. Standard reel contains 2,500 connectors.
0.3mm 0.1mm
7. Environmental considerations
The center cores of the embossed tape reels are made of Styrofoam.
8. Variety of contact positions
Available with 10, 40, 54, 57 and 60 pos.
0.4 mm pitch FPC Metal fittings on each side do not protrude out allowing side-byside mounting of the connectors or closer component placement.
0.3 mm pitch FPC
sApplications
Mobile phones, PDA’s, digital cameras, digital video cameras, LCD connections, plasma displays (PDP), camera modules and other compact devices requiring Flexible Printed Circuit connections using high reliability ultra-small profile connectors
Metal fitting
2004.7
1
sProduct Specifications
Rating Rated current 0.4 A DC Rated voltage 40 V AC Operating temperature range -55ç to +85ç (Note 1) Operating humidity range Relative humidity 90% max. (No condensation) Storage temperature range -10ç to +50ç (Note 2) Storage humidity range Relative humidity 90% max.
Recommended FPC Item
Thickness: = 0.2±0.03mm tin-lead plated (Note 3) Specification
100 V DC 120 V AC /one minute 1 mA 20 cycles
Conditions
1. Insulation resistance 500 M ø min. 2. Withstanding voltage No flashover or insulation breakdown. 100 m ohms max. 3. Contact resistance * Including FPC conductor resistance Contact resistance: 100 m ø max. 4. Durability (insertion/ withdrawal) No damage, cracks, or parts dislocation. No electrical discontinuity of 1 µs or more. Contact resistance: 100 m ø max. 5. Vibration No damage, cracks, or parts dislocation. No electrical discontinuity of 1 µs. min. Contact resistance: 100 m ø max. 6. Shock No damage, cracks, or parts dislocation. Contact resistance: 100 m ø max. 7. Humidity Insulation resistance: 50 M ø min. (Steady state) No damage, cracks, or parts dislocation. Contact resistance: 100 m ø max. Insulation resistance: 50 M ø min. 8. Temperature cycle No damage, cracks, or parts dislocation. 9. Resistance to No deformation of components affecting performance. soldering heat
Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 10 cycle in each of the 3 directions. Acceleration of 981 m/s2, 6ms duration, sine half-wave waveform, 3 cycles / each of 3 axis
96 hours at temperature of 40ç and humidity of 90% to 95%.RH Temperature: -55ç / +15ç to +35ç / +85ç / +15ç to +35ç Time: 30 / 2 to 3 / 30 / 2 to 3 (Minutes) 5 cycles Reflow: At the recommended temperature profile Manual soldering: 350ç±5ç for 5 seconds
Note 1: Includes temperature rise caused by current flow. Note 2: The term ”storage” refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation. Note 3: When using FPC with gold plated contact pads the connector contacts must be also gold plated : Select the (05) plating code.
sMaterials
Part
Insulator Actuator Contacts Metal fittings
Material
LCP LCP Phosphor bronze Phosphor bronze
Finish
Color: Black Color: Dark brown Tin-lead plated (Note 3) Tin plated(No-lead)
Remarks
UL94V-0 -------------------------------------------
sOrdering information
FH27 - 54S - 0.4 - SH (05)
1 2 3 4 5 4 Terminal type 5 Plating code
SH: SMT horizontal mounting type (05): Gold plated (51): Tin-lead plated
1 Series name: FH27 2 No. of contacts 3
Number of contacts: 10, 40, 54, 57, 60 Contact pitch: 0.4 mm
2
BOperation and Precautions
Operation Precautions
1 Do not apply excessive force or use any type of tool to operate the
actuator.
1.FPC insertion procedure. Connector installed on the board.
1 1) Lift up the actuator. Use thumb or index finger.
2 Fully insert the FPC in the connector parallel to mounting surface, with 2 The connector will assure reliable performance when the actuator is
the exposed conductive traces facing down. open to 130˚maximum. Do not exceed this angle, as this may cause permanent damage to the connector.
Over 130°
FPC conductor surface (Bottom side)
3 Rotate down the actuator until firmly closed. It is critical that the
inserted FPC is not moved and remains fully inserted.
3 Exercise caution when applying upward force to the connected FPC.
2.FPC removal
1 Lift up the actuator.
Carefully withdraw the FPC.
3
sConnector Dimension
A B 0.4 ×Number of contacts (0.15) 0.15 H
H 0.5 Number of contacts indicator (2.2) 0 1.2 K (1.7) 2 1 0.15MAX 3 2 1 0.15MAX 0 3.5 (3.9)
A** 4 Polarizing mark indicator
(0.15) (C: FPC insertion slot dimension) D
Notes 1 The coplanarity of each terminal lead is within 0.1. 2 The contact terminal lead position indicates the dimension from the K surface, the bottom surface of the insulator body. 3 Slight variations in color of the plastic compounds do not affect form, fit or function of the connector.
4 Some versions may have material removed from this area. No affect on form, fit or function of the connector.
Unit: mm Part Number
FH27-10S-0.4SH FH27-40S-0.4SH FH27-54S-0.4SH FH27-57S-0.4SH FH27-60S-0.4SH
CL No.
CL580-0004-0 CL580-0005-3 CL580-0001-2 CL580-0003-8 CL580-0006-6
Number of Contacts
10 40 54 57 60
A
06.6 18.6 24.2 25.4 26.6
B
03.6 15.6 21.2 22.4 23.6
C
05.24 17.24 22.84 24.04 25.24
D
06.0 18.0 23.6 24.8 26.0
Tape and reel packaging (2,500 pieces/reel). Order by number of reels.
4
BRecommended PCB mounting pattern and metal mask dimensions
E 0.8±0.05 0.4 0.23±0.03(Land) 0.04 R 0.2±0.01(Metal mask) Recommended metal mask thickness: .t=0.12 R
(0.2) (0.2) (0.25) (0.225) 1.2±0.05
2.25±0.05
1.4±0.05
Outline of the connector 0.55±0.05 F±0.05
(0.175)
0.55±0.05
BRecommended FPC Dimensions
0.8±0.07
2-
G±0.05 E±0.03 0.4±0.03 0.27±0.03 0.13±0.03
0.8±0.07 0.2±0.05
(0.25) 0.2±0.03
1.9±0.1
(3.5)
(0.5)
R0.2MAX 2-R0.25MAX
.2 R0
(0.07) Covering film layer H±0.05 G±0.05 (0.07) 2 0.5MIN
1 Polyamide and thermally hardening adhesive is recommended as the materials for the stiffener. 2 Overlap between covering film layer and stiffener is 0.5mm min.
3.2MIN(Stiffener)
2.7MIN
2.2
R 0. 2
Unit: mm Part Number
FH27-10S-0.4SH FH27-40S-0.4SH FH27-54S-0.4SH FH27-57S-0.4SH FH27-60S-0.4SH
CL No.
CL580-0004-0 CL580-0005-3 CL580-0001-2 CL580-0003-8 CL580-0006-6
Number of Contacts
10 40 54 57 60
E
03.6 15.6 21.2 22.4 23.6
F
05.5 17.5 23.1 24.3 25.5
G
05.2 17.2 22.8 24.0 25.2
H
04.01 16.01 21.61 22.81 24.01
Tape and tape reel packaging (2,500 pieces/reel). Order by number of reels.
5
BPackaging Specification
qEmbossed Carrier Tape Dimensions
qTape width up to 24mm . qTape width 32mm and over.
1.75±0.1 N±0.1 L±0.3 Unreeling direction 1.5+0.1 0 (4.2) (5.2) (2) (Q) (Ø380) Lead portion (400mm min.) (Ø80) Top cover tape 1.7
+0.1 0
2±0.15 (2) (0.3) 1.75±0.1
+ 0 0 .1
4±0.1
12±0.1
Ø1 .5
+ 0 0 .1
Ø1
.5
(2) (0.3)
2±0.15 4±0.1 12±0.1
(P)
N±0.1
(4.2) Unreeling direction (5.2)
qReel Dimensions
3
End portion
Mounting portion
No connector inserted (10 pockets min.)
Embossed carrier tape No connector inserted (10 pockets min.)
Ø1
Part Number FH27-10S-0.4SH FH27-40S-0.4SH FH27-54S-0.4SH FH27-57S-0.4SH FH27-60S-0.4SH 2,500 pieces per reel.
CL No. CL580-0004-0 CL580-0005-3 CL580-0001-2 CL580-0003-8 CL580-0006-6
Number of Contacts 10 40 54 57 60
L 16.0 32.0 44.0 44.0 44.0
M ------28.4 40.4 40.4 40.4
N 07.5 14.2 20.2 20.2 20.2
P 06.9 18.9 24.5 25.7 26.9
M±0.1 L±0.3
(P)
Unit: mm
Q 16.5 32.5 44.5 44.5 44.5
6
BRecommended Temperature Profile
qUsing Typical Solder Paste
5 sec. max. 250 240ç
200 Temperature(ç)
200ç
150
160ç 150ç
100
HRS test conditions Solder method :Reflow, IR/hot air (Nihon Den-netsu Co., Ltd.’s Part SENSBY NR-2) Environment :Room air Solder composition :Paste, 63%Sn/37%Pb (Senju Metal Industry, Co., Ltd.’s Part Number: OZ63-201C-50-9) Test board :Glass epoxy 40mm∞100mm∞1.6mm thick Land dimensions:0.23mm∞0.8mm Metal mask :0.2∞0.8∞0.12mm thick The temperature profiles are based on the above conditions.
50 25ç 0 Start (30 sec.) (60sec.) 90 sec. to 120 sec. Preheating Time (Seconds) (20 sec. to 30 sec.) Soldering
In individual applications the actual temperature may vary, depending on solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment manufacturer for specific recommendations.
qUsing Lead-free Solder Paste
MAX 250ç 250 230ç 200 Temperature(ç) 200ç
HRS test condition Solder method :Reflow, IR/hot air (Nihon Den-netsu Co., Ltd.’s Part Number: SENSBY NR-2) Environment :Room air (Senju Metal Industry, Co., Ltd.’s Part Number: M705-221CM5-42-10.5) Test board Metal mask :Glass epoxy 70mm∞80mm∞1.6mm thick Land dimensions:0.23mm∞08mm :0.2∞0.8∞0.12mm thick Solder composition :Paste, 96.5%Sn/3.0%Ag/0.5%Cu
150ç
150
100
50 25ç 0 Start (60sec.) 90 sec. to 120 sec. Preheating Time (Seconds) (60 sec.) Soldering
The temperature profiles shown are based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, volume / thickness and board size / thickness. Consult your solder paste and equipment manufacturer for specific recommendations.
7
BFPC Construction (Recommended Specifications) 1. Using Single-sided FPC
Top side Material Name Covering layer film Cover adhesive Surface treatment Copper foil Base adhesive Base film Polyamide 1 mil thick Tin-lead plated Cu 1/2oz Material Polyamide 1 mil thick. Thickness (µm) 25 25 5 35 25 25 30 75 195
Reinforcement material adhesive Thermosetting adhesive Stiffener Bottom side Polyamide 3 mil thick Total
2. Using Double-sided FPC
Material Name Top side Covering layer film Cover adhesive Surface treatment Through-hole copper Copper foil Base adhesive Base film Base adhesive Copper foil Cover adhesive Covering layer film Polyamide 1 mil thick Cu 1/2oz Polyamide 1 mil thick Tin-lead plated Cu Cu 1/2oz Material Polyamide 1 mil thick Thickness (µm) 25 25 5 15 18 18 25 18 18 25 25 25 25 199
Reinforcement material adhesive Thermosetting adhesive Bottom side Stiffener Polyamide 1 mil thick Total
To prevent release of the lock due to FPC bending, use of the FPC with copper foil on bottom side is not recommended.
®
5-23,OSAKI 5-CHOME,SHINAGAWA-KU,TOKYO 141-8587,JAPAN PHONE: 81-3-3491-9741, FAX: 81-3-3493-2933 http://www.hirose.com http://www.hirose-connectors.com
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The contents of this catalog are current as of date of publication. Contents are subject to change without notice for the purpose of improvements.
