TR0636E-20027

1/6 TR0636E-20027 IT3D(M)-300S-BGA (57) BGA Shearing Force TEST REPORT APPROVED CHECKED PREPARED TY. ARAI TM.MATSUO TY.TAKADA HIROSE ELECTRIC CO., LTD. 2/6 [1] Objective To evaluate BGA shearing force by comparing Initial state and Post 3500 thermal cycle in accordance with IPC-9701. [2] Specimens Type Type_1 Type_2 Type_3 Type_4 Product IT3D-300S-BGA (57) IT3D-300S-BGA (57) IT3D-300S-BGA (57) IT3D-300S-BGA (57) Assembly Virgin Reworked Virgin Reworked State In i ti a l In i ti a l Post 3500 cycles Post 3500 cycles 3 # of specimens 3 3 3 Remarks *Type_3, Type_4 are assembled as Fig.1. *The test board design is based on IPC-9701 specif ication. *Thickness of the PCB: 3.3mm Fig.1 [3] Test period From: To : 2007- 09- 12 2008- 01- 18 [4] Test Equipment Test equipment Insertion and withdrawal force tester Model AG-IS Manufacture Shimazu 3/6 BGA shearing force 1. Requirements The failure mode for the sheared balls shall be either bulk solder failure or copper p a d l i ft- o ff. Intermetallic failure is unacceptable. 2. Co n d i t i o n s 2-1 Test Condition 0 (+10 / 0 C ) ( 0 / -100C ) Test cycle : 3500 cycles 2-2 BGA Shearing Force IT3D-300S-BGA(57) CONNECTOR Sam ple * Speed: 500 m icrom eter /second Insertion and withdrawal force tester 0.3m m space Test PCB 4/6 4. Results 4- 1 BGA Shearing Force UNIT: KN No. State Assem bly 1 2 3 MAX MIN AVG Virgin 1.22 1.18 1.25 1.25 1.18 1.22 Type-1 Initial Reworked 1.18 1.16 1.18 1.18 1.16 1.17 Type-2 Type-3 Type-4 Post 3500 therm al cycles Virgin 1.21 1.13 1.13 1.21 1.13 1.16 Reworked 1.13 0.91 1.11 1.13 0.91 1.05 4- 2 Failure Mode No intermetallic failure was found in all specimens. Copper pad lift-off was found in the sheared area. Details are shown in the following pages. 5/6 Type-1 (Initial) Virgin Copper Pad lift-off Type-2 (Initial) Reworked Copper Pad lift-off 6/6 Type-3 (Post 3500 thermal cycles) Virgin Copper Pad lift-off Type-4 (Post 3500 thermal cycles) Reworked Copper Pad lift-off