TR0636E-20033

1/4 TR0636E-20033 IT3D(M)-300S-BGA (57) Cross Sectioning TEST REPORT APPROVED CHECKED PREPARED TY. ARAI TM.MATSUO TY.TAKADA HIROSE ELECTRIC CO., LTD. 2/4 [1] Objective To evaluate SnCu intermetallic at BGA joints by cross sectioning initial state and post 3500 thermal cycle in accordance with IPC-9701. [2] Specimens No. 1 2 3 4 5 6 Product IT3D-300S-BGA (57) IT3M-300S-BGA (57) IT3M-300S-BGA (57) IT3D-300S-BGA (57) IT3D-300S-BGA (57) IT3M-300S-BGA (57) Assem bly Raw connector Virgin Reworked Virgin Reworked Virgin State Initial Initial Initial Initial Initial Post 3500 cycles 7 IT3M-300S-BGA (57) Reworked Post 3500 cycles 8 IT3D-300S-BGA (57) Virgin Post 3500 cycles 9 IT3D-300S-BGA (57) Reworked Post 3500 cycles Remarks *Specimens are assembled as Fig.1. *The test board design is based on IPC-9701 specif ication. *Thickness of the PCB: 3.3mm # of specim ens 1 1 1 1 1 1 1 1 1 [3] Test Period From: To : 2007- 09- 12 2008- 01- 18 Fig.1 3/4 Cross Sectioning 1. Requirements SnCu intermetallic is observed at ‘the solder to connector pin interface’ and ‘the solder to pad interface’. 2. Co n d i t i o n s 2-1 Test condition 0 (+10 / 0 C ) ( 0 / -100C ) Test cycle : 3500 cycles 2-2 Cross Sectioning Locations 1 Column of Solder Joints st Pin 1 Side 1 Row of Solder Joints st 4/4 3. Results Typical SnCu intermetallic was observed in all specimens. Cross sections are shown in the attachm ent : TR060E_20033_CROSS_SECTIONING_Analysis TR0636E-20033 - IT3 CROSS SECTIONING Analysis TR0636E-20033 IT3 CROSS SECTIONING ANALYSIS Preliminary Analysis Time-Zero September 12, 2007 No.1 SnPb Raw Connector X-Ray Image Typical Solder Joint 100 micron Cross-section Target Pin 10 micron No.2 /IT3M-300S-BGA(57) / Virgin / Initial SnPb_MB_026 Conn-2 X-Ray Image Typical Solder Joint 100 micron Cross-section Target PCB 10 micron Pin 10 micron No.3 /IT3M-300S-BGA(57) / Reworked / Initial SnPb_MB_026 Conn-1 X-Ray Image Typical Solder Joint 100 micron Cross-section Target PCB 10 micron 10 micron Pin No.4 /IT3D-300S-BGA(57) / Virgin / Initial SnPb_DC_027 Conn-2 X-Ray Image Typical Solder Joint 100 micron Cross-section Target PCB 10 micron 10 micron Pin No.5 /IT3D-300S-BGA(57) / Reworked / Initial SnPb_DC_027 Conn-1 X-Ray Image Typical Solder Joint 100 micron Cross-section Target PCB 10 micron 10 micron Pin Post L2 ATC Analysis 3500 Cycles January 18, 2008 No.6 /IT3M-300S-BGA(57) / Virgin / Post 3500 cycles SnPb_MB_027 Conn-2 X-Ray Image Typical Solder Joint 100 micron Cross-section Target IMC - PCB 10 micron 10 micron IMC - Pin No.7 /IT3M-300S-BGA(57) / Reworked / Post 3500 cycles SnPb_MB_027 Conn-1 X-Ray Image Typical Solder Joint 100 micron Cross-section Target IMC - Pin 110miXron 0 00 c IMC - PCB 11000X ron 0 mic No.8 /IT3D-300S-BGA(57) / Virgin / Post 3500 cycles SnPb_DC_026 Conn-2 X-Ray Image Typical Solder Joint 100 micron Cross-section Target IMC - PCB 10 micron 10 micron IMC - Pin No.9 /IT3D-300S-BGA(57) / Reworked / Post 3500 cycles SnPb_DC_026 Conn-1 X-Ray Image Typical Solder Joint 100 micron Cross-section Target IMC - PCB 10 micron 10 micron IMC - Pin