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2SA1171

2SA1171

  • 厂商:

    HITACHI(日立)

  • 封装:

  • 描述:

    2SA1171 - Silicon PNP Epitaxial - Hitachi Semiconductor

  • 详情介绍
  • 数据手册
  • 价格&库存
2SA1171 数据手册
2SA1171 Silicon PNP Epitaxial Application Low frequency small signal amplifier Outline MPAK 3 1 2 1. Emitter 2. Base 3. Collector 2SA1171 Absolute Maximum Ratings (Ta = 25°C) Item Collector to base voltage Collector to emitter voltage Emitter to base voltage Collector current Collector power dissipation Junction temperature Storage temperature Symbol VCBO VCEO VEBO IC PC Tj Tstg Ratings –90 –90 –5 –50 150 150 –55 to +150 Unit V V V mA mW °C °C Electrical Characteristics (Ta = 25°C) Item Symbol Min –90 — 1 Typ — — — — — 200 1.6 Max — –0.5 800 –0.75 –0.5 — — Unit V µA Test conditions I C = –1 mA, RBE = ∞ VCB = –75 V, IE = 0 VCE = –12 V, IC = –2 mA Collector to emitter breakdown V(BR)CEO voltage Collector cutoff current DC current transfer ratio Base to emitter voltage Collector to emitter saturation voltage Gain bandwidth product Collector output capacitance Note: Grade Mark hFE D PD 250 to 500 E PE 400 to 800 I CBO hFE* VBE VCE(sat) fT Cob 250 — — — — V V MHz pF VCE = –12 V, IC = –2 mA I C = –10 mA, IB = –1 mA VCE = –12 V, IC = –2 mA VCB = –25 V, IE = 0, f = 1 MHz 1. The 2SA1171 is grouped by hFE as follows. See characteristic curves of 2SA872. 2 2SA1171 Maximum Collector Dissipation Curve Collector power dissipation Pc (mW) 150 100 50 0 50 100 150 Ambient Temperature Ta (°C) 3 Unit: mm 0.65 0.10 3 – 0.4 + 0.05 – 0.16 – 0.06 + 0.10 1.5 ± 0.15 + 0.2 – 0.6 0 – 0.1 0.95 0.95 1.9 ± 0.2 2.95 ± 0.2 0.3 + 0.2 1.1 – 0.1 0.65 2.8 Hitachi Code JEDEC EIAJ Weight (reference value) MPAK — Conforms 0.011 g Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to: Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: (408) 433-1990 Fax: (408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Stra§e 3 D-85622 Feldkirchen, Munich Germany Tel: (89) 9 9180-0 Fax: (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: (1628) 585000 Fax: (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: (2) 2718-3666 Fax: (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: (2) 735 9218 Fax: (2) 730 0281 Telex: 40815 HITEC HX Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
2SA1171
物料型号: - 型号:2SA1171

器件简介: - 2SA1171是一款低频小信号放大器用硅PNP外延三极管。

引脚分配: - 1. 发射极(Emitter) - 2. 基极(Base) - 3. 集电极(Collector)

参数特性: - 绝对最大额定值(Ta=25°C): - 集电极-基极电压(VCBO):-90V - 集电极-发射极电压(VCEO):-90V - 集电极电流(Ic):-50mA - 集电极功耗(Pc):150mW - 结温(Tj):150°C - 存储温度(Tstg):-55至+150°C

功能详解: - 电气特性(Ta=25°C): - 集电极-发射极击穿电压(BR)CEO):-90V - 集电极截止电流(ICBO):-0.5A - DC电流传输比(hFE1):250至800 - 基极-发射极电压(VBE):-0.75V - 集电极-发射极饱和电压(VcE(sal)):-0.5V - 增益带宽积(fT):200MHz - 集电极输出电容(Cob):1.6pF

应用信息: - 2SA1171主要应用于低频小信号放大器。

封装信息: - 封装形式:MPAK - 重量:0.011g,符合JEDEC参考值EIAJ标准。
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