2SK1070

2SK1070

  • 厂商:

    HITACHI(日立)

  • 封装:

  • 描述:

    2SK1070 - Silicon N-Channel Junction FET - Hitachi Semiconductor

  • 详情介绍
  • 数据手册
  • 价格&库存
2SK1070 数据手册
2SK1070 Silicon N-Channel Junction FET Application Low frequency / High frequency amplifier Outline MPAK 3 1 2 1. Drain 2. Source 3. Gate 2SK1070 Absolute Maximum Ratings (Ta = 25°C) Item Gate to drain voltage Gate to source voltage Drain current Gate current Channel power dissipation Channel temperature Storage temperature Symbol VGDO VGSO ID IG Pch Tch Tstg Ratings –22 –22 50 10 150 150 –55 to +150 Unit V V mA mA mW °C °C Electrical Characteristics (Ta = 25°C) Item Gate cutoff current Gate to source breakdown voltage Drain current Gate to source cutoff voltage Forward transfer admittance Input capacitance Note: Grade Mark I DSS B PIB 6 to 14 C PIC 12 to 22 Symbol I GSS V(BR)GSS I DSS*1 VGS(off) y fs Ciss Min — –22 6 0 20 — D PID 18 to 30 Typ — — — — 30 9 E PIE 27 to 40 Max –10 — 40 –2.5 — — Unit nA V mA V mS pF Test conditions VGS = –15 V, VDS = 0 I G = –10 µA, VDS = 0 VDS = 5 V, VGS = 0, Pulse test VDS = 5 V, ID = 10 µA VDS = 5 V, VGS = 0, f = 1 kHz VDS = 5 V, VGS = 0, f = 1 MHz 1. The 2SK1070 is grouped by I DSS as follows. See characteristic curves of 2SK435. 2 2SK1070 Maximum Channel Dissipation Curve Channel Power Dissipation Pch (mW) 150 100 50 0 50 100 150 Ambient Temperature Ta (°C) 3 Unit: mm 0.65 0.10 3 – 0.4 + 0.05 – 0.16 – 0.06 + 0.10 1.5 ± 0.15 + 0.2 – 0.6 0 – 0.1 0.95 0.95 1.9 ± 0.2 2.95 ± 0.2 0.3 + 0.2 1.1 – 0.1 0.65 2.8 Hitachi Code JEDEC EIAJ Weight (reference value) MPAK — Conforms 0.011 g Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to: Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: (408) 433-1990 Fax: (408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Stra§e 3 D-85622 Feldkirchen, Munich Germany Tel: (89) 9 9180-0 Fax: (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: (1628) 585000 Fax: (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: (2) 2718-3666 Fax: (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: (2) 735 9218 Fax: (2) 730 0281 Telex: 40815 HITEC HX Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
2SK1070
1. 物料型号:2SK1070,是由Hitachi生产的Silicon N-Channel Junction FET(硅N沟道结型场效应晶体管)。

2. 器件简介: - 应用:适用于低频/高频放大器。 - 封装:MPAK。

3. 引脚分配: - 1. Drain(漏极) - 2. Source(源极) - 3. Gate(栅极)

4. 参数特性: - 绝对最大额定值(在25°C下): - 栅-漏电压:-22V - 栅-源电压:-22V - 漏电流:50mA - 栅电流:10mA - 沟道功率耗散:150mW - 沟道最高温度:150°C - 存储温度范围:-55°C至+150°C - 电气特性(在25°C下): - 栅截止电流:-10nA(Vas=-15V, Vos=0) - 栅-源击穿电压:-22V(Ig=-10μA, Vos=0) - 漏电流(Dss):6mA至40mA(Vos=5V, Vas=0, 脉冲测试) - 栅-源截止电压:-2.5V(Vos=5V, I=10μA) - 前向传输电导:20mS至30mS(Vos=5V, Vcs=0, f=1kHz) - 输入电容:9pF至-(Vos=5V, Vas=0, f=1MHz)

5. 功能详解:2SK1070场效应晶体管适用于放大应用,具有不同的漏电流等级(B、C、D、E),对应不同的漏电流范围。具体特性曲线可以参考2SK435。

6. 应用信息:在设计时需确保产品在Hitachi保证的范围内使用,特别是在最大额定值、工作电源电压范围、散热特性、安装条件等方面。

7. 封装信息:封装类型为MPAK,重量参考值为0.011g。
2SK1070 价格&库存

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