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2SK2553

2SK2553

  • 厂商:

    HITACHI(日立)

  • 封装:

  • 描述:

    2SK2553 - Silicon N Channel MOS FET High Speed Power Switching - Hitachi Semiconductor

  • 详情介绍
  • 数据手册
  • 价格&库存
2SK2553 数据手册
2SK2553(L), 2SK2553(S) Silicon N Channel MOS FET High Speed Power Switching ADE-208-357H (Z) 9th. Edition February 1999 Application High speed power switching Features • • • • Low on-resistance R DS(on) = 7 mΩ typ. High speed switching 4 V gate drive device can be driven from 5 V source Outline LDPAK 4 4 12 1 D G 2 3 3 S 1. Gate 2. Drain 3. Source 4. Drain 2SK2553(L), 2SK2553(S) Absolute Maximum Ratings (Ta = 25°C) Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body to drain diode reverse drain current Avalanche current Avalanche energy Channel dissipation Channel temperature Storage temperature Notes 1. PW ≤ 10 µs, duty cycle ≤ 1 % 2. Value at Tc = 25 °C 3. Value at Tch = 25 °C, Rg ≥ 50 Ω Symbol VDSS VGSS ID I D(pulse) I DR I AP Note 3 Note 3 Note 2 Note 1 Ratings 60 ±20 50 200 50 45 174 75 150 –55 to +150 Unit V V A A A A mJ W °C °C EAR Pch Tch Tstg 2 2SK2553(L), 2SK2553(S) Electrical Characteristics (Ta = 25°C) Item Drain to source breakdown voltage Gate to source breakdown voltage Gate to source leak current Symbol V(BR)DSS V(BR)GSS I GSS Min 60 ±20 — — 1.0 — — Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Body to drain diode forward voltage Body to drain diode reverse recovery time Note 1. Pulse Test |yfs| Ciss Coss Crss t d(on) tr t d(off) tf VDF t rr 35 — — — — — — — — — Typ — — — — — 7 10 55 3550 1760 500 35 230 470 360 0.85 135 Max — — ±10 10 2.0 10 16 — — — — — — — — — — Unit V V µA µA V mΩ mΩ S pF pF pF ns ns ns ns V ns I F = 50 A, VGS = 0 I F = 50 A, VGS = 0 diF / dt = 50 A / µs Test Conditions I D = 10 mA, VGS = 0 I G = ±100 µA, VDS = 0 VGS = ±16 V, VDS = 0 VDS = 60 V, VGS = 0 I D = 1 mA, VDS = 10 V I D = 25 A VGS = 10 V Note 1 I D = 25 A VGS = 4 V Note 1 I D = 25 A VDS = 10 V Note 1 VDS = 10 V VGS = 0 f = 1 MHz I D = 25 A VGS = 10 V RL = 1.2 Ω Zero gate voltage drain current I DSS Gate to source cutoff voltage Static drain to source on state resistance VGS(off) RDS(on) See characteristic curves of 2SK2529. 3 2SK2553(L), 2SK2553(S) Maximum Safe Operation Area 10 PW C D O Power vs. Temperature Derating 100 Pch (W) I D (A) 500 200 100 50 20 10 5 2 10 = µs 75 0 1 10 m s µs m Channel Dissipation Drain Current s sh ot pe tio ra 50 (1 n Operation in this area is limited by R DS(on) c (T = ) 25 ) °C 25 0 50 100 150 Tc (°C) 200 Case Temperature 1 Ta = 25 °C 0.5 3 30 0.1 0.3 1 10 100 Drain to Source Voltage V DS (V) Normalized Transient Thermal Impedance vs. Pulse Width 3 Normalized Transient Thermal Impedance γ s (t) Tc = 25°C 1 D=1 0.5 0.3 0.2 0.1 0.1 0.05 θ ch – c(t) = γ s (t) • θ ch – c θ ch – c = 1.67 °C/W, Tc = 25 °C PDM PW T 0.03 0.02 1 lse 0.0 t pu o h 1s D= PW T 0.01 10 µ 100 µ 1m 10 m Pulse Width 100 m PW (S) 1 10 4 2SK2553(L), 2SK2553(S) Avalanche Test Circuit Avalanche Waveform 1 2 • L • I AP • 2 VDSS VDSS – V DD V DS Monitor L I AP Monitor EAR = V (BR)DSS I AP VDD ID V DS Rg Vin 15 V D. U. T 50 Ω 0 VDD Switching Time Test Circuit Vin Monitor D.U.T. RL Vin Vin 10 V 50 Ω V DD = 30 V Vout 10% 10% Vout Monitor Waveform 90% 10% 90% td(off) tf 90% td(on) tr 5 2SK2553(L), 2SK2553(S) Package Dimensions Unit: mm (1.4) 10.2 ± 0.3 4.44 ± 0.2 1.3 ± 0.2 11.3 ± 0.5 8.6 ± 0.3 10.0 +0.3 –0.5 (1.4) 10.2 ± 0.3 4.44 ± 0.2 1.3 ± 0.2 (1.5) 11.0 ± 0.5 (1.5) 0.76 ± 0.1 (1.5) 8.6 ± 0.3 10.0 +0.3 –0.5 1.2 ± 0.2 0.86 +0.2 –0.1 1.27 ± 0.2 2.59 ± 0.2 1.27 ± 0.2 0.4 ± 0.1 1.2 ± 0.2 2.54 ± 0.5 0.86 +0.2 –0.1 2.54 ± 0.5 3.0 +0.3 –0.5 0.1 +0.2 –0.1 2.59 ± 0.2 0.4 ± 0.1 2.54 ± 0.5 2.54 ± 0.5 L type S type Hitachi Code EIAJ JEDEC LDPAK — — 6 Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to: Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: (408) 433-1990 Fax: (408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Stra§e 3 D-85622 Feldkirchen, Munich Germany Tel: (89) 9 9180-0 Fax: (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: (1628) 585000 Fax: (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: (2) 2718-3666 Fax: (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: (2) 735 9218 Fax: (2) 730 0281 Telex: 40815 HITEC HX Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
2SK2553
### 物料型号 - 型号:2SK2553(L), 2SK2553(S)

### 器件简介 - 该器件是由日立公司(HITACHI)生产的高速功率开关MOSFET。 - 特点包括低导通电阻、高速开关能力和4V门驱动设备可以从5V电源驱动。

### 引脚分配 - 引脚1:栅极(Gate) - 引脚2:漏极(Drain) - 引脚3:源极(Source) - 引脚4:漏极(Drain)

### 参数特性 - 最大额定值: - 漏源电压(VDss):60V - 栅源电压(VGss):+20V - 漏电流(I):50A - 漏峰值电流(ID(pulse)):200A - 体-漏二极管反向漏电流(IDR):50A - 雪崩电流(IAP):45A - 雪崩能量(EAR):174mJ - 沟道耗散功率(Pch):75W - 沟道温度(Tch):150°C - 存储温度(Tstg):-55至+150°C

- 电气特性: - 漏源击穿电压(V(BR)DSS):60V - 栅源击穿电压(V(BR)GSS):+20V - 栅源漏电流(IGSS):±10μA - 零栅压漏电流(Ips):10μA - 栅源截止电压(Ves(off)):1.0至2.0V - 静态漏源导通电阻(Rds(on)):7至16mΩ - 前向传输导纳(gfs):35至55S - 输入电容(Ciss):3550pF - 输出电容(Coss):1760pF - 反向传输电容(Crss):500pF - 导通延迟时间(td(on)):35ns - 上升时间(tr):230ns - 关闭延迟时间(td(off)):470ns - 下降时间(tf):360ns - 体-漏二极管正向电压(VDF):0.85V - 体-漏二极管反向恢复时间(te):135ns

### 功能详解 - 该器件适用于高速功率开关应用,具有低导通电阻和高速开关特性。

### 应用信息 - 主要应用于高速功率开关领域。

### 封装信息 - 封装类型:LDPAK4
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