2SK2795
Silicon N Channel MOS FET UHF Power Amplifier
ADE-208-466 A (Z) 2nd. Edition November. 1996 Features
• • High power output, High gain, High effeciency PG = 11dB, Pout = 24dBm, ηD = 40 %min. (f = 836.5MHz) Compact package capable of surface mounting
Outline
UPAK
3
2
1
4 1. Gate 2. Source 3. Drain 4. Source
This Device is sensitive to Electro Static Discharge. An Adequate handling procedure is requested.
2SK2795
Absolute Maximum Ratings (Ta = 25°C)
Item Drain to source voltage Gate to source voltage Drain current Drain peak current Channel dissipation Channel temperature Storage temperature Note: Symbol VDSS VGSS ID ID(pulse)*1 Pch*2 Tch Tstg Ratings 10 ±6 0.17 0.3 1 150 –45 to +150 Unit V V A A W °C °C
1. PW ≤ 10ms, duty cycle ≤ 50 % 2. Value at Tc = 25°C
Electrical Characteristics (Ta = 25°C)
Item Zero gate voltege drain current Gate to source leak current Symbol IDSS IGSS Min — — 0.3 — Typ — — — 9.5 Max 10 ±5.0 1.0 — Unit µA µA V pF Test Conditions VDS = 10 V, VGS = 0 VGS = ±6V, VDS = 0 ID = 1mA, VDS = 5V VGS = 2V, VDS = 0 f = 1MHz Output capacitance Coss — 4.5 — pF VDS = 5, VGS = o f = 1MHz Output Power Pout 24 — — dBm VDS = 4.7V f =836.5MHz Pin = 13dBm Drain Rational ηD 40 — — % VDS = 4.7V f =836.5MHz Pin = 13dBm Note: 3. Marking is “ DX “.
Gate to source cutoff voltage VGS(off) Input capacitance Ciss
2SK2795
Main Characteristics
Maximum Channel Power Dissipation Curve
Pch (W)
Typical Output Characteristics 1.0 6V 5V 0.8 4.5 V 4V 0.6
3.5 V
2.0
3V
2.5 V
Channel Power Dissipation
Drain Current
1.0
I D (A)
1.5
0.4
2V
0.5
0.2 Pulse Test
1.5 V V GS = 1 V
0
50
100
150 Tc (°C)
200
0
Case Temperature
2 3 4 5 6 1 Drain to Source Voltage V DS (V)
Typical Transfer Characteristics V DS = 5 V Pulse Test
(A) Forward Transfer Admittance |y fs | (S)
0.20
1 0.5 0.2 0.1
Forward Transfer Admittance vs. Drain Current
0.16
25°C Tc = –25°C
ID Drain Current
0.12 Tc = –25°C 75°C 25°C
0.08
0.05
75°C
0.04
0.02 0.01
0.001 0.003 0.01 0.3
V DS = 5 V Pulse Test
0.1 0.3 1
0
0.4
0.8
1.2
1.6 V GS (V)
2.0
Gate to Source Voltage
Drain Current I D (A)
2SK2795
Drain to Source Saturation Voltage vs. Drain Current 1.0
Gate to Source Cutoff Voltage VGS(off) (V)
Drain to Source Saturation Voltage VDS(sat) (V)
10 3 1
Gate to Source Cutoff Voltage vs. Ambient Temperature
0.8
10 mA
1 mA 0.1 m A
25°C 75°C
0.6
ID=
0.3 0.1 Tc = –25°C V DS = 6 V Pulse Test 1 3 10 30 100 300 1000
0.4
0.03 0.01
0.2 0 –25 V DS = 5 V 0 25 50 75 100 125
Drain Current I D (mA)
Ambient Temperature Ta (°C)
Input Capacitance vs. Gate to Source Voltage 10
Output Capacitance Coss (pF) Input Capacitance Ciss (pF)
Output Capacitance vs. Drain to Source Voltage 100 50 V GS = 0 f = 1 MHz
9
20 10 5
8
7 V DS = 0 f = 1 MHz 6 –6 –2 0 2 4 6 –4 Gate to Source Voltage VGS (V)
2 1 0.1
0.2
0.5
1
2
5
10
Drain to Source V DS (V)
2SK2795
Reverse Transfer Capacitance vs. Gate to Source Votage 100 500 V GS = 0 f = 1 MHz Output Power, Drain Rational vs. Input Power 100 Po ηD
Reverse Transfer Capacitance Crss (pF)
Output Power Po (mW)
50
20 10 5
300
60
200 V DS = 4.7 V I DO = 50 mA f = 836.5MHz 10 20 30 40
40
2 1 0.1
100
20 0 50
0.2
0.5
1
2
5 (V)
10
0
Gate to Source Voltege V GS
Input power Pin (mW)
Drain Rational η D (%)
400
80
2SK2795
Package Dimensions
Unit: mm
4.5 ± 0.1
φ 1.0
1.5 1.5 3.0
0.8 min
0.53 max 0.48 max
1
2
3
2.5 ± 0.1 4.25 max
4
0.4
1.8 max
1.5 ± 0.1 0.44 max
0.44 max
Hitachi Code EIAJ JEDEC
UPAK SC–62 —
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