2SK3211S

2SK3211(L), 2SK3211(S) Silicon N Channel MOS FET High Speed Power Switching ADE-208-761A (Z) 2nd. Edition February 1999 Features • • • Low on-resistance RDS = 60 mΩ typ. High speed switching 4 V gate drive device can be driven from 5 V source 2SK3211 Outline LDPAK 4 4 D 1 1 2 3 G 2 3 1. Gate 2. Drain 3. Source 4. Drain S Absolute Maximum Ratings (Ta = 25°C) Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body-drain diode reverse drain current Avalanche current Avalanche energy Channel dissipation Channel temperature Storage temperature Note: Symbol VDSS VGSS ID ID(pulse)*1 IDR IAP * 3 3 2 Ratings 200 ±20 25 100 25 25 41 100 150 –55 to +150 Unit V V A A A A mJ W °C °C EAR* Tch Pch * Tstg 1. PW ≤ 10 µs, duty cycle ≤ 1% 2. Value at Tc = 25°C 3. Value at Tch = 25°C, Rg ≥ 50 Ω 2 2SK3211 Electrical Characteristics (Ta = 25°C) Item Symbol Min 200 ±20 — — 1.0 — — 18 — — — — — — — — — Typ — — — — — 60 65 30 2420 790 340 20 230 590 330 0.95 230 Max — — ±10 10 2.5 75 85 — — — — — — — — — — Unit V V µA µA V mΩ mΩ S pF pF pF ns ns ns ns V ns IF = 25 A, VGS = 0 IF = 25 A, VGS = 0 diF/ dt = 50 A/ µs Test Conditions ID = 10 mA, VGS = 0 IG = ±100 µA, VDS = 0 VGS = ±16 V, VDS = 0 VDS = 200 V, VGS = 0 ID = 1 mA, VDS = 10 V ID = 15 A, VGS = 10 V*4 ID = 15 A, VGS = 4 V*4 ID = 15 A, VDS = 10 V *4 VDS = 10 V VGS = 0 f = 1 MHz ID = 15 A, VGS = 10 V RL = 2 Ω Drain to source breakdown voltage V(BR)DSS Gate to source breakdown voltage Gate to source leak current Zero gate voltege drain current Gate to source cutoff voltage Static drain to source on state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Body–drain diode forward voltage Body–drain diode reverse recovery time Note: 4. Pulse test V(BR)GSS IGSS IDSS VGS(off) RDS(on) RDS(on) |yfs| Ciss Coss Crss td(on) tr td(off) tf VDF trr 3 2SK3211 Main Characteristics Power vs. Temperature Derating 40 Maximum Safe Operation Area PW DC Op 100 Pch (W) I D (A) 30 10 3 1 0.3 0.1 0.03 30 =1 ati 10 0m 10 0µ µs s 1m s( 1s s t) ) er Channel Dissipation Drain Current on (T ho 20 c= 25 Operation in this area is limited by R DS(on) °C 10 0 0.01 50 100 150 Tc (°C) 200 1 Case Temperature Ta = 25 °C 2 5 10 20 50 100 200 V DS (V) 500 Drain to Source Voltage Typical Output Characteristics 50 10 V 4V Pulse Test 6V 3.5 V 20 Typical Transfer Characteristics V DS = 10 V Pulse Test I D (A) 30 3V 20 ID Drain Current (A) 40 16 12 Drain Current 8 Tc = 75°C –25°C 10 VGS =2.5 V 4 25°C 0 2 4 6 Drain to Source Voltage 8 10 V DS (V) 0 1 2 3 Gate to Source Voltage 4 5 V GS (V) 4 2SK3211 Drain to Source Saturation Voltage vs. Gate to Source Voltage Drain to Source Saturation Voltage V DS(on) (V) Pulse Test 2.0 Drain to Source On State Resistance R DS(on) (m Ω ) 2.5 Static Drain to Source on State Resistance vs. Drain Current 500 Pulse Test 200 100 50 VGS = 4 V 10 V 1.5 1.0 I D = 15 A 10 A 0.5 5A 20 10 1 2 10 5 Drain Current 50 20 I D (A) 100 0 12 4 8 Gate to Source Voltage 16 20 V GS (V) Static Drain to Source on State Resistance R DS(on) (m Ω) Forward Transfer Admittance |y fs | (S) Static Drain to Source on State Resistance vs. Temperature 250 Pulse Test 200 Forward Transfer Admittance vs. Drain Current 50 Tc = –25 °C 20 75 °C 10 5 2 1 0.5 0.1 V DS = 10 V Pulse Test 0.3 1 3 10 30 Drain Current I D (A) 100 25 °C 150 V GS = 4 V 5,10,15 A 100 5,10,15 A 50 10 V 0 –40 0 40 80 120 160 Case Temperature Tc (°C) 5 2SK3211 Body–Drain Diode Reverse Recovery Time 1000 Reverse Recovery Time trr (ns) 500 di / dt = 50 A / µs V GS = 0, Ta = 25 °C 10000 5000 Capacitance C (pF) Ciss 2000 1000 500 200 100 50 20 10 0.1 20 10 0.3 1 3 10 30 100 Reverse Drain Current I DR (A) 0 VGS = 0 f = 1 MHz 10 20 30 40 50 Crss Coss Typical Capacitance vs. Drain to Source Voltage 200 100 50 Drain to Source Voltage V DS (V) Dynamic Input Characteristics V DS (V) I D = 20 A V DD = 150 V 100 V 50 V V GS 80 8 V GS (V) 200 20 1000 500 Switching Time t (ns) 200 100 50 Switching Characteristics t d(off) tf 160 16 Drain to Source Voltage 120 12 Gate to Source Voltage tr V GS = 10 V, V DD = 30 V PW = 5 µs, duty < 1 % 40 V DD = 150 V 100 V 50 V 4 V DS 0 200 t d(on) 20 10 0.1 0.2 0 40 80 120 160 Gate Charge Qg (nc) 2 0.5 1 5 10 Drain Current I D (A) 20 6 2SK3211 Reverse Drain Current vs. Source to Drain Voltage Pulse Test Maximun Avalanche Energy vs. Channel Temperature Derating Repetive Avalanche Energy E AR (mJ) 20 50 I AP = 25 A V DD = 50 V duty < 0.1 % Rg > 50 Ω Reverse Drain Current I DR (A) 16 40 12 10 V 8 5V V GS = 0, –5 V 0.2 0.4 0.6 0.8 1.0 30 20 4 10 0 25 0 50 75 100 125 150 Source to Drain Voltage V SD (V) Channel Temperature Tch (°C) Avalanche Test Circuit Avalanche Waveform VDSS VDSS – V DD V DS Monitor L I AP Monitor EAR = 1 2 • L • I AP • 2 V (BR)DSS I AP VDD ID V DS Rg Vin 15 V D. U. T 50 Ω 0 VDD 7 2SK3211 Normalized Transient Thermal Impedance vs. Pulse Width 3 Normalized Transient Thermal Impedance γ s (t) Tc = 25°C 1 D=1 0.5 0.3 0.2 0.1 0.1 0.05 θ ch – c(t) = γ s (t) • θ ch – c θ ch – c = 1.25 °C/W, Tc = 25 °C PDM PW T 0.03 0.02 1 lse 0.0 t pu ho 1s D= PW T 0.01 10 µ 100 µ 1m 10 m Pulse Width 100 m PW (S) 1 10 Switching Time Test Circuit Vin Monitor D.U.T. RL Vin Vin 10 V 50 Ω V DD = 30 V Vout 10% 10% Vout Monitor Waveform 90% 10% 90% td(off) tf 90% td(on) tr 8 2SK3211 Package Dimensions Unit: mm (1.4) 10.2 ± 0.3 4.44 ± 0.2 1.3 ± 0.2 11.3 ± 0.5 8.6 ± 0.3 10.0 +0.3 –0.5 (1.4) 10.2 ± 0.3 4.44 ± 0.2 1.3 ± 0.2 (1.5) 11.0 ± 0.5 (1.5) 0.76 ± 0.1 (1.5) 8.6 ± 0.3 10.0 +0.3 –0.5 1.2 ± 0.2 0.86 +0.2 –0.1 1.27 ± 0.2 2.59 ± 0.2 0.1 +0.2 –0.1 2.59 ± 0.2 0.4 ± 0.1 1.27 ± 0.2 0.4 ± 0.1 1.2 ± 0.2 2.54 ± 0.5 0.86 +0.2 –0.1 2.54 ± 0.5 2.54 ± 0.5 2.54 ± 0.5 L type S type 3.0 +0.3 –0.5 Hitachi Code EIAJ JEDEC LDPAK — — 9 2SK3211 Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & IC Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to: Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: (408) 433-1990 Fax: (408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Straße 3 D-85622 Feldkirchen, Munich Germany Tel: (89) 9 9180-0 Fax: (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: (1628) 585000 Fax: (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: (2) 2718-3666 Fax: (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: (2) 735 9218 Fax: (2) 730 0281 Telex: 40815 HITEC HX Copyright © Hitachi, Ltd., 1998. All rights reserved. Printed in Japan. 10