BB404M

BB404M Build in Biasing Circuit MOS FET IC UHF/VHF RF Amplifier ADE-208-717A (Z) 2nd. Edition Dec. 1998 Features • Build in Biasing Circuit; To reduce using parts cost & PC board space. • High gain; (PG = 29 dB typ. at f = 200 MHz) • Low noise characteristics; (NF = 1.2 dB typ. at f = 200 MHz) • Wide supply voltage range; Applicable with 5V to 9V supply voltage. • Withstanding to ESD; Build in ESD absorbing diode. Withstand up to 200V at C=200pF, Rs=0 conditions. • Provide mini mold packages; MPAK-4R(SOT-143 var.) Outline MPAK-4R 3 4 2 1 1. Source 2. Drain 3. Gate2 4. Gate1 Notes: 1. Marking is “DX–”. 2. BB404M is individual type number of HITACHI BBFET. BB404M Absolute Maximum Ratings (Ta = 25°C) Item Drain to source voltage Gate1 to source voltage Gate2 to source voltage Drain current Channel power dissipation Channel temperature Storage temperature Symbol VDS VG1S VG2S ID Pch Tch Tstg Ratings 12 ±10 –0 Å}10 25 150 150 –55 to +150 Unit V V V mA mW °C °C Electrical Characteristics (Ta = 25°C) Item Symbol Min 12 +10 ±10 — — 0.4 0.5 2.3 0.9 0.003 9 — 22 — 24 — — — Typ — — — — — 0.7 0.7 2.8 1.3 0.02 15 13 27 27 29 29 1.2 1.2 Max — — — +100 ±100 1.0 1.0 3.6 2.0 0.05 19 — 34 — 32 — 1.9 — Unit V V V nA nA V V pF pF pF mA mA mS mS dB dB dB dB Test Conditions I D = 200µA, VG1S = VG2S = 0 I G1 = +10 µA, VG2S = VDS = 0 I G2 = ±10µA, VG1S = VDS = 0 VG1S = +9V, V G2S = VDS = 0 VG2S = ±9V, VG1S = VDS = 0 VDS = 5V, VG2S = 4V, ID = 100µA VDS = 5V, VG1S = 5V, ID = 100µA VDS = 5V, VG1 = 5V VG2S =4V, RG = 180kΩ f = 1MHz VDS = 5V, VG1 = 5V VG2S = 4V, RG = 180kΩ VDS = 9V, VG1 = 9V VG2S =6V, RG = 470kΩ VDS = 5V, VG1 = 5V, VG2S =4V RG = 180kΩ, f = 1kHz VDS = 9V, VG1 = 9V, VG2S =6V RG = 470kΩ, f = 1kHz VDS = 5V, VG1 = 5V, VG2S =4V RG = 180kΩ, f = 200MHz VDS = 9V, VG1 = 9V, VG2S =6V RG = 470kΩ, f = 200MHz VDS = 5V, VG1 = 5V, VG2S =4V RG = 180kΩ, f = 200MHz VDS = 9V, VG1 = 9V, VG2S =6V RG = 470kΩ, f = 200MHz Drain to source breakdown voltage V(BR)DSS Gate1 to source breakdown voltage V(BR)G1SS Gate2 to source breakdown voltage V(BR)G2SS Gate1 to source cutoff current Gate2 to source cutoff current Gate1 to source cutoff voltage Gate2 to source cutoff voltage Input capacitance Output capacitance Reverse transfer capacitance Drain current I G1SS I G2SS VG1S(off) VG2S(off) c iss c oss c rss I D(op) 1 I D(op) 2 Forward transfer admittance |yfs|1 |yfs|2 Power gain PG1 PG2 Noise figure NF1 NF2 2 BB404M Main Characteristics Test Circuit for Operating Items (I D(op) , |yfs|, Ciss, Coss, Crss, NF, PG) VG1 RG Gate 1 VG2 Gate 2 Source A ID Drain Power Gain, Noise Figure Test Circuit VT 1000p VG2 1000p VT 1000p 47k Input (50Ω) 1000p 36p L1 1000p 47k BBFET L2 1000p 47k Output (50Ω) 10p max 1000p 1SV70 RG 180k (VD=5V) 470k (VD=9V) 1000p V D = V G1 Unit Resistance (Ω) Capacitance (F) RFC 1SV70 L1 :φ1mm Enameled Copper Wire,Inside dia 10mm, 2Turns L2 :φ1mm Enameled Copper Wire,Inside dia 10mm, 2Turns RFC :φ1mm Enameled Copper Wire,Inside dia 5mm, 2Turns . 3 BB404M Maximum Channel Power Dissipation Curve Pch (mW) 200 I D (mA) 25 Ω 39 33 0 0 kΩ k Ω 82 Typical Output Characteristics 27 0k V G2S = 6 V V G1 = VDS 20 150 Channel Power Dissipation 15 100 Drain Current 10 kΩ 70 4 kΩ 60 k Ω 5 0 68 0 kΩ 50 5 RG Ω 1M Ω = 1.5 M 0 50 100 150 Ta (°C) 200 0 Ambient Temperature 2 4 6 Drain to Source Voltage 8 10 V DS (V) Drain Current vs. Gate2 to Source Voltage 25 V DS = V G1 = 9 V I D (mA) 20 25 Drain Current vs. Gate1 Voltage 270 k Ω I D (mA) 20 V DS = 9 V R G = 390 k Ω 6V 15 5V 4V 3V 2V 5 V G2S = 1 V 0 2 4 6 8 Gate1 Voltage V G1 (V) 10 330 15 kΩ Drain Current 390 k Ω 10 5 RG 560 k Ω 680 k Ω 820 k Ω 1M Ω 1.5 M Ω = 470 k Ω Drain Current 10 0 1.2 2.4 3.8 Gate2 to Source Voltage 4.8 6.0 VG2S (V) 4 BB404M Drain Current vs. Gate1 Voltege 25 I D (mA) I D (mA) V DS = 9 V R G = 470 k Ω 25 V DS = 9 V R G = 560 k Ω Drain Current vs. Gate1 Voltege 20 20 15 Drain Current 10 Drain Current 6V 5V 4V 3V 2V 15 10 6V 5V 4V 3V 2V V G2S = 1 V 5 V G2S = 1 V 0 2 4 6 8 Gate1 Voltage VG1 (V) 10 5 0 2 4 6 8 Gate1 Voltage VG1 (V) 10 Forward Transfer Admittance |y fs | (mS) 30 Forward Transfer Admittance |y fs | (mS) Forward Transfer Admittance vs. Gate1 Voltage Forward Transfer Admittance vs. Gate1 Voltage 30 V DS = 9 V R G = 470 k Ω 24 f = 1 kHz 18 5V 4V 3V 2V 6V 6V V DS = 9 V R G = 390 k Ω 5V 4V 24 f = 1 kHz 2V 18 3V 12 12 6 V G2S = 1 V 0 2 4 6 8 Gate1 Voltage VG1 (V) 10 6 V G2S = 1 V 0 2 4 6 8 Gate1 Voltage VG1 (V) 10 5 BB404M Forward Transfer Admittance vs. Gate1 Voltage Forward Transfer Admittance |y fs | (mS) 30 V DS = 9 V R G = 560 k Ω f = 1 kHz 40 Power Gain vs. Gate Resistance 6V 5V 4V 35 Power Gain PG (dB) 30 25 20 15 V G2S = 1 V 10 0.1 V DS = 9 V V G1 = 9 V V G2S = 6 V f = 200 MHz 0.2 0.5 1 2 5 Gate Resistance R G (M Ω ) 10 24 18 3V 2V 12 6 0 2 4 6 8 Gate1 Voltage VG1 (V) 10 Noise Figure vs. Gate Resistance 4 Noise Figure NF (dB) V DS = 9 V V G1 = 9 V V G2S = 6 V f = 200 MHz 40 35 Power Gain PG (dB) 30 25 20 15 0 0.1 10 0 Power Gain vs. Drain Current 3 2 1 V DS = 9 V V G1 = 9 V V G2S = 6 V R G = variable f = 200 MHz 5 10 15 20 25 30 0.2 0.5 1 2 5 10 Gate Resistance R G (M Ω) Drain Current ID (mA) 6 BB404M Noise Figure vs. Drain Current 4 V DS = 9 V V G1 = 9 V V G2S = 6 V R G = variable f = 200 MHz 30 25 20 15 10 5 0 0.1 V DS = 9 V V G1 = 9 V V G2S = 6 V 0.2 0.5 1 2 5 10 Gate Resistance R G (M Ω ) Drain Current vs. Gate Resistance 3 2 1 0 5 10 15 20 25 30 Drain Current I D (mA) Gain Reduction vs. Gate2 to Source Voltage 60 Gain Reduction GR (dB) 50 40 30 20 10 Input Capacitance Ciss (pF) V DS = 9 V V G1 = 9 V V G2S = 6 V R G = 470 k Ω f = 200 MHz 6 5 4 3 2 1 0 6 7 1 2 3 4 5 Gate2 to Source Voltage V G2S (V) 1 Drain Current I D (mA) Noise Figure NF (dB) Input Capacitance vs. Gate2 to Source Voltage V DS = 9 V V G1 = 9 V R G = 470 k Ω f = 1 MHz 2 3 4 5 6 0 Gate2 to Source Voltage V G2S (V) 7 BB404M S11 Parameter vs. Frequency .8 .6 .4 3 .2 4 5 10 0 .2 .4 .6 .8 1 1.5 2 3 45 10 –10 –.2 –5 –4 –3 –.4 –.6 –.8 –1.5 –2 –120° –90° –60° –1 180° 0° 150° 30° 1 1.5 2 S21 Parameter vs. Frequency 90° 120° Scale: 1 / div. 60° –150° –30° Test Condition : V DS = 9 V , V G1 = 9 V V G2S = 6 V , R G = 470 k Ω 50—1000 MHz (50 MHz step) Test Condition : V DS = 9 V , V G1 = 9 V V G2S = 6 V , R G = 470 k Ω 50—1000 MHz (50 MHz step) S12 Parameter vs. Frequency 90° 120° S22 Parameter vs. Frequency .8 .6 .4 3 1 1.5 2 Scale: 0.002 / div. 60° 150° 30° .2 4 5 10 180° 0° 0 .2 .4 .6 .8 1 1.5 2 3 45 10 –10 –.2 –150° –30° –.4 –120° –90° –60° –.6 –.8 –1.5 –2 –1 –5 –4 –3 Test Condition : V DS = 9 V , V G1 = 9 V V G2S = 6 V , R G = 470 k Ω 50—1000 MHz (50 MHz step) Test Condition : V DS = 9 V , V G1 = 9 V V G2S = 6 V , R G = 470 k Ω 50—1000 MHz (50 MHz step) 8 BB404M Sparameter (VDS = VG1 = 9V, VG2S = 6V, RG = 470kΩ, Zo = 50Ω) S11 f (MHz) MAG 50 100 150 200 250 300 350 400 450 500 550 600 650 700 750 800 850 900 950 1000 0.996 0.993 0.987 0.978 0.972 0.954 0.943 0.925 0.910 0.893 0.880 0.861 0.847 0.829 0.816 0.804 0.791 0.779 0.764 0.753 ANG –5.3 –10.9 –16.6 –21.9 –27.4 –33.2 –38.2 –43.2 –48.0 –52.5 –57.4 –62.1 –66.1 –69.9 –74.1 –78.2 –82.4 –86.1 –89.5 –92.4 S21 MAG 2.74 2.73 2.68 2.66 2.63 2.57 2.50 2.43 2.37 2.30 2.24 2.17 2.10 2.02 1.96 1.91 1.85 1.79 1.73 1.68 ANG 174.0 168.0 162.3 156.3 150.4 144.3 138.7 133.3 128.0 122.6 117.5 112.7 108.1 103.6 99.1 94.8 80.4 86.3 82.2 78.3 S12 MAG 0.00096 0.00130 0.00203 0.00285 0.00335 0.00385 0.00455 0.00488 0.00526 0.00522 0.00498 0.00512 0.00497 0.00455 0.00418 0.00372 0.00329 0.00275 0.00233 0.00258 ANG 98.6 84.4 83.6 72.3 69.7 68.3 63.2 55.4 59.8 56.1 53.2 49.1 53.4 53.6 51.6 55.7 62.4 73.0 82.4 105.1 S22 MAG 0.985 0.991 0.990 0.988 0.985 0.982 0.979 0.975 0.971 0.967 0.962 0.957 0.952 0.947 0.943 0.937 0.933 0.928 0.921 0.918 ANG –1.9 –4.5 –6.5 –9.4 –11.6 –14.0 –16.2 –18.4 –21.0 –23.0 –25.2 –27.3 –29.4 –31.6 –33.7 –35.8 –38.0 –40.0 –42.1 –44.2 9 BB404M Package Dimensions Unit: mm 2.95 ±0.2 0.65 ± 0.1 1.9 ±0.2 0.95 0.95 0.4 — 0.05 + 0.1 + 0.1 0.4 — 0.05 0.16 — 0.06 + 0.1 4 3 1.5 ± 0.15 2.8 ± 0.2 0 0.1 1 0.6 — 0.05 0.85 + 0.1 2 0.4 — 0.05 0.95 0.65 ± 0.1 1.1± 0.1 + 0.1 1.8 0.8 Hitachi Code EIAJ JEDEC MPAK—4R 10 BB404M Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & IC Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to: Hitachi Semiconductor (America) Inc. 2000 Sierra Point Parkway Brisbane, CA 94005-1897 Tel: (800) 285-1601 Fax: (303) 297-0447 Hitachi Europe GmbH Electronic components Group Dornacher Straße 3 D-85622 Feldkirchen, Munich Germany Tel: (89) 9 9180-0 Fax: (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: (1628) 585000 Fax: (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: (2) 2718-3666 Fax: (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: (2) 735 9218 Fax: (2) 730 0281 Telex: 40815 HITEC HX Copyright © Hitachi, Ltd., 1998. All rights reserved. Printed in Japan. 11