HSB83YP

HSB83YP Silicon Epitaxial Planar Diode for High Voltage Switching ADE-208-843(Z) Rev 0 Mar 2000 Features • High reverse voltage. (VR=250V) • CMPAK- 4 package which has two devices parallel connection, is suitable for high density surface mounting. Ordering Information Type No. HSB83YP Laser Mark F7 Package Code CMPAK-4 Outline 4 3 1 2 (Top View) 1 2 3 4 Anode Anode Cathode Cathode HSB83YP Absolute Maximum Ratings (Ta = 25°C) *2 Item Peak reverse voltage Reverse voltage Peak forward current Non-Repetitive peak forward surge current Average rectified current Junction temperature Storage temperature Note Note Symbol VRM VR I FM I FSM IO Tj Tstg *1 Value 300 250 300 2 100 125 -55Å`+125 Unit V V mA A mA °C °C 1. Value at duration of 10msec. 2. Two device total. Electrical Characteristics (Ta = 25°C) * 1 Item Forward voltage Reverse current Symbol VF I R1 I R2 Capacitance Reverse recovery time Note C t rr Min − − − − − Typ − − − − − Max 1.2 0.2 100 3.0 100 pF ns Unit V µA Test Condition I F = 100 mA VR = 250V VR = 300V VR = 0V, f = 1 MHz I F = IR =30 mA, Irr = 3mA, RL= 100Ω 1. Per one device. 2 HSB83YP Main Characteristic 10 10 -2 10 -5 -3 -6 10 10 -4 -5 Reverse current I R (A) 0.6 0.8 Forward current IF (A) 10 10 -7 10 -6 10 10 10 -7 10 -8 -8 -9 10 1.0 -9 0 0.2 0.4 0 50 100 150 200 250 Forward voltage V F (V) Fig.1 Forward current Vs. Forward voltage Reverse voltage V R (V) Fig.2 Reverse current Vs. Reverse voltage f=1MHz 10 Capacitance C (pF) 1.0 10 -1 10 -1 1.0 Reverse voltage V R (V) 10 Fig.3 Capacitance Vs. Reverse voltage 3 HSB83YP Package Dimensions Unit: mm 2.0 – 0.2 1.3 – 0.2 0.3 – 0.05 0.3 – 0.05 0.425 0.65 0.65 0.16— 0.06 2.1 – 0.2 + 0.1 1.25 – 0.1 0 — 0.1 0.65 0.65 1.3 – 0.2 0.9 – 0.1 0.2 0.425 0.3 – 0.05 0.3 – 0.05 Hitachi Code JEDEC EIAJ Mass CMPAK-4 Conforms 0.006 g 4 HSB83YP Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/index.htm For further information write to: Hitachi Europe GmbH Electronic components Group Dornacher Stra§e 3 D-85622 Feldkirchen, Munich Germany Tel: (89) 9 9180-0 Fax: (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: (1628) 585000 Fax: (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: (2) 2718-3666 Fax: (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: (2) 735 9218 Fax: (2) 730 0281 Telex: 40815 HITEC HX Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: (408) 433-1990 Fax: (408) 433-0223 Copyright ' Hitachi, Ltd., 2000. All rights reserved. Printed in Japan. 5 HSB83YP 6