189MS8E

v01.0801 MICROWAVE CORPORATION HMC189MS8 Features Conversion Loss: 13 dB Fo, 3Fo, 4Fo Isolation: 33 dB Input Drive Level: +10 to +15 dBm GaAs MMIC SMT PASSIVE FREQUENCY DOUBLER, 2 - 4 GHz INPUT Typical Applications The HMC189MS8 is suitable for: • Wireless Local Loop • LMDS, VSAT, and Pt to Pt Radios • UNII & HiperLAN • Test Equipment 11 FREQ. MULTIPLIERS - SMT Functional Diagram General Description The HMC189MS8 is a miniature passive frequency doubler in a plastic 8-lead MSOP package. The suppression of undesired fundamental and higher order harmonics is 33 dB typical with respect to input signal levels. The doubler uses the same diode/ balun technology used in Hittite MMIC mixers. The doubler is ideal for high volume applications where frequency doubling of a lower frequency is more economical than directly generating a higher frequency. The passive Schottky diode doubler technology contributes no measurable additive phase noise onto the multiplied signal. Electrical Specifications, TA = +25° C, As a Function of Drive Level Input = +10 dBm Parameter Frequency Range, Input Frequency Range, Output Conversion Loss FO Isolation (with respect to input level) 3FO Isolation (with respect to input level) 4FO Isolation (with respect to input level) 29 Min. Typ. 2.5 - 3.5 5-7 13 32 17 30 Max. Min. Input = +13 dBm Typ. 2.5 - 3.75 5 - 7.5 13 33 15 31 Max. Min. Input = +15 dBm Typ. 2-4 4-8 13 34 17 Max. Units GHz GHz dB dB 37 43 35 42 33 40 dB 32 40 33 40 31 40 dB 11 - 20 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com v01.0801 MICROWAVE CORPORATION HMC189MS8 GaAs MMIC SMT FREQUENCY DOUBLER, 2 - 4 GHz INPUT GaAs Loss @ +13 dBm Drive Level PUMPED +13 dBm 17 - Level Conversion MMIC SUB-HARMONICALLY Isolation* @ MIXER Drive 25 GHz 0 -5 CONVERSION LOSS (dB) -10 -15 -20 +85 C -25 +25 C -30 -35 2 3 4 5 6 7 8 9 10 OUTPUT FREQUENCY (GHz) -50 -60 0 2 4 6 8 10 12 14 16 18 20 FREQUENCY (GHz) -40 C -10 1Fo ISOLATION (dB) -20 3Fo -30 4Fo -40 0 11 FREQ. MULTIPLIERS - SMT 11 - 21 * With respect to input level Conversion Loss vs. Drive Level 0 +15 dBm -5 CONVERSION LOSS(dB) +13 dBm -10 -15 -20 -25 -30 -35 2 3 4 5 6 7 8 9 10 FREQUENCY (GHz) +10 dBm +7 dBm Isolation* @ +10 dBm Drive Level 0 -10 1Fo ISOLATION (dB) -20 -30 4Fo -40 -50 -60 3Fo -70 0 2 4 6 8 10 12 14 16 18 20 FREQUENCY (GHz) * With respect to input level Input Return Loss vs. Drive Level 0 Output Return Loss for Several Input Frequencies 0 Input = 2 GHz OUTPUT RETURN LOSS (dB) INPUT RETURN LOSS (dB) -5 +10 dBm -10 +7 dBm -5 -10 -15 -15 Input = 3 GHz -20 Input = 4 GHz -20 +13 dBm -25 1 2 3 FREQUENCY (GHz) 4 5 -25 2 3 4 5 6 7 8 9 10 FREQUENCY (GHz) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com v01.0801 MICROWAVE CORPORATION HMC189MS8 GaAs MMIC SMT FREQUENCY DOUBLER, 2.0 - 4.0 GHz INPUT Absolute Maximum Ratings Input Drive Storage Temperature Operating Temperature +27 dBm -65 to +150 °C -40 to +85 °C 11 FREQ. MULTIPLIERS - SMT Outline Drawing NOTES: 1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC SILICA AND SILICON IMPREGNATED. 2. LEADFRAME MATERIAL: COPPER ALLOY 3. LEADFRAME PLATING: Sn/Pb SOLDER 4. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15 mm PER SIDE. 6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25 mm PER SIDE. 7. ALL GROUND LEADS MUST BE SOLDERED TO PCB PF GROUND. 11 - 22 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com v01.0801 MICROWAVE CORPORATION HMC189MS8 GaAs MMIC SMT FREQUENCY DOUBLER, 2.0 - 4.0 GHz INPUT Evaluation PCB 11 FREQ. MULTIPLIERS - SMT 11 - 23 The circuit board used in the final application should be generated with proper RF circuit design techniques. Signal lines at the RF port should have 50 ohm impedance and the package ground leads should be connected directly to the ground plane similar to that shown above. The evaluation circuit board shown above is available from Hittite Microwave Corporation upon request. List of Materials Item J1, J2 U1 PCB* Description PC Mount SMA Connector HMC189MS8 Doubler 103311 Eval Board *Circuit Board Material: Rogers 4350 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com