HMC-ALH376_09

HMC-ALH376_09

  • 厂商:

    HITTITE

  • 封装:

  • 描述:

    HMC-ALH376_09 - GaAs HEMT MMIC LOW NOISE AMPLIFIER, 35 - 45 GHz - Hittite Microwave Corporation

  • 详情介绍
  • 数据手册
  • 价格&库存
HMC-ALH376_09 数据手册
HMC-ALH376 v02.0209 GaAs HEMT MMIC LOW NOISE AMPLIFIER, 35 - 45 GHz Features Noise Figure: 2 dB Gain: 16 dB @ 40 GHz P1dB Output Power: +6 dBm Supply Voltage: +4V @ 87 mA Die Size: 2.7 x 1.44 x 0.1 mm 1 LOW NOISE AMPLIFIERS - CHIP Typical Applications This HMC-ALH376 is ideal for: • Point-to-Point Radios • Point-to-Multi-Point Radios • Test Equipment & Sensors • Military & Space Functional Diagram General Description The HMC-ALH376 is a GaAs MMIC HEMT three stages, self-biased Low Noise Amplifier die which operates between 35 and 45 GHz. The amplifier provides 16 dB of gain, a 2 dB noise figure and +6 dBm of output power at 1 dB gain compression while requiring only 87 mA from a single +4V supply. This self-biased LNA is ideal for integration into hybrid assemblies or Multi-Chip-Modules (MCMs) due to its small size (3.9 mm2). Electrical Specifi cations*, TA = +25° C, Vdd= +4V Parameter Frequency Range Gain Noise Figure Input Return Loss Output Return Loss Output Power for 1 dB Compression Supply Current (Idd) (Vdd= +4V) *Unless otherwise indicated, all measurements are from probed die 15 Min. Typ. 35 - 40 16 2 10 16 6 87 3 10 Max. Min. Typ. 40 - 45 12 2.2 17 18 6 87 3 Max. Units GHz dB dB dB dB dBm mA 1 - 168 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC-ALH376 v02.0209 GaAs HEMT MMIC LOW NOISE AMPLIFIER, 35 - 45 GHz Linear Gain vs. Frequency 25 Noise Figure vs. Frequency 5 1 LOW NOISE AMPLIFIERS - CHIP 1 - 169 20 NOISE FIGURE (dB) 35 37 39 41 43 45 GAIN (dB) 4 15 3 10 2 5 1 0 FREQUENCY (GHz) 0 35 37 39 41 43 45 FREQUENCY (GHz) Input Return Loss vs. Frequency 0 -5 RETURN LOSS (dB) -10 -15 -20 -25 -30 35 37 39 41 43 45 FREQUENCY (GHz) Output Return Loss vs. Frequency 0 -5 RETURN LOSS (dB) -10 -15 -20 -25 -30 35 37 39 41 43 45 FREQUENCY (GHz) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC-ALH376 v02.0209 GaAs HEMT MMIC LOW NOISE AMPLIFIER, 35 - 45 GHz 1 LOW NOISE AMPLIFIERS - CHIP Absolute Maximum Ratings Drain Bias Voltage RF Input Power (35 - 40 GHz) RF Input Power (40 - 45 GHz) Channel Temperature Storage Temperature Operating Temperature +5.5 Vdc -5 dBm -1 dBm 180 °C -65 to +150 °C -55 to +85 °C ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Outline Drawing Die Packaging Information [1] Standard GP-2 (Gel Pack) Alternate [2] NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM]. 2. TYPICAL BOND PAD IS .004” SQUARE. 3. BACKSIDE METALLIZATION: GOLD. 4. BACKSIDE METAL IS GROUND. 5. BOND PAD METALLIZATION: GOLD. 6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. 7. OVERALL DIE SIZE ±.002” [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. 1 - 170 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC-ALH376 v02.0209 GaAs HEMT MMIC LOW NOISE AMPLIFIER, 35 - 45 GHz Pad Descriptions Pad Number 1 Function RFIN Description This pad is AC coupled and matched to 50 Ohms. Power Supply Voltage for the amplifier. See assembly for required external components. This pad is AC coupled and matched to 50 Ohms. Die bottom must be connected to RF/DC ground. Interface Schematic 1 Vdd 2 3 RFOUT Die bottom GND For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 1 - 171 LOW NOISE AMPLIFIERS - CHIP HMC-ALH376 v02.0209 GaAs HEMT MMIC LOW NOISE AMPLIFIER, 35 - 45 GHz 1 LOW NOISE AMPLIFIERS - CHIP Assembly Diagram Note 1: Bypass caps should be 100 pF (approximately) ceramic (single-layer) placed no farther than 30 mils from the amplifier. Note 2: Best performance obtained from use of
HMC-ALH376_09
1. 物料型号: - 型号:HMC-ALH376

2. 器件简介: - HMC-ALH376是一款基于砷化镓(GaAs)的高电子迁移率晶体管(HEMT)单片微波集成电路(MMIC)低噪声放大器芯片,工作频率范围为35至45GHz。

3. 引脚分配: - Pad 1(RFIN):交流耦合,匹配至50欧姆的射频输入。 - Pad 2(Vdd):放大器的电源电压,组装时需参考外部组件要求。 - Pad 3(RFOUT):交流耦合,匹配至50欧姆的射频输出。 - Die底部(GND):必须连接至射频/直流地。

4. 参数特性: - 噪声系数:2dB - 增益:在40GHz时为16dB - 1dB压缩输出功率:+6dBm - 供电电压:+4V@87mA - 芯片尺寸:2.7 x 1.44 x 0.1 mm

5. 功能详解: - HMC-ALH376提供16dB的增益,在1dB增益压缩时输出功率为+6dBm,噪声系数为2dB,仅需87mA来自单+4V电源。 - 该自偏置低噪声放大器(LNA)适合集成到混合组件或多芯片模块(MCMs)中,因其尺寸小(3.9平方毫米)。

6. 应用信息: - 适用于点对点无线电、点对多点无线电、测试设备与传感器、军事与航天等领域。

7. 封装信息: - 标准封装:GP-2(凝胶包装) - 芯片底部金属化:金 - 背面金属:接地 - 焊盘金属化:金 - 未标记焊盘不需要连接 - 所有尺寸以英寸[毫米]为单位,典型焊盘为0.004英寸正方形,整体芯片尺寸±0.002英寸。
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