HMC142

HMC141 / HMC142 v03.1007 GaAs MMIC DOUBLE-BALANCED MIXER, 6 - 18 GHz Typical Applications The HMC141 & HMC142 is ideal for: • UNII & HiperLAN • Microwave & MMW Radios • Military, Space & Test Equipment Features Input IP3: +21 dBm LO / RF Isolation: 25 to 40 dB IF Bandwidth: DC to 6 GHz Small Size: 1.48 x 1.48 x 0.1 mm (HMC141) Small Size: 1.52 x 1.52 x 0.1 mm (HMC142) 4 MIXERS - DOUBLE-BALANCED - CHIP Functional Diagram General Description The HMC141 chip is a minature double-balanced mixer which can be used as an upconverter or downconverter. The HMC142 is identical to the HMC141 except that the layout is a mirror image designed to ease integration into image-reject mixer modules. Broadband operation and excellent isolations are provided by on-chip baluns, which require no external components and no DC bias. The design is similar to the HMC143/144 mixers but without an IF combiner, providing a broad DC to 6 GHz IF bandwidth. These devices are much smaller and more reliable than hybrid diode mixers for VSAT and point-to-point radios. Electrical Specifi cations, TA = +25° C, LO Drive = +20 dBm Parameter Min. Frequency Range, RF & LO Frequency Range, IF Conversion Loss Noise Figure (SSB) LO to RF Isolation LO to IF Isolation IP3 (Input) IP2 (Input) 1 dB Compression (Input) 20 Typ. 6 - 16 DC - 6 9 9 33 30 22 40 15 13 11 11 IF = 100 MHz LO = 20 dBm Max. Min. Typ. 16 - 18 DC - 6 10 10 28 20 22 42 15 12 12 Max. GHz GHz dB dB dB dB dBm dBm dBm Units * Unless otherwise noted, all measurements performed as downconverter, IF= 100 MHz. 4 - 20 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC141 / HMC142 v03.1007 GaAs MMIC DOUBLE-BALANCED MIXER, 6 - 18 GHz Isolation @ LO = +20 dBm 0 Conversion Gain vs. Temperature @ LO = +20 dBm 0 CONVERSION GAIN (dB) -5 ISOLATION (dB) -10 -20 -10 -30 -15 +25C +85C -55C -40 RF to IF LO to RF LO to IF 4 20 5 8 11 14 17 20 5 8 11 14 17 FREQUENCY (GHz) FREQUENCY (GHz) Conversion Gain vs. LO Drive 0 Return Loss @ LO = +20 dBm 0 RF Return Loss LO Return Loss CONVERSION GAIN (dB) RETURN LOSS (dB) -5 -5 -10 -10 LO = +13 dBm LO = +15 dBm LO = +17 dBm LO = +20 dBm -15 -15 -20 -20 5 8 11 14 17 20 FREQUENCY (GHz) -25 5 8 11 14 17 20 FREQUENCY (GHz) IF Bandwidth @ LO = +20 dBm 0 Upconverter Performance Conversion Gain @ LO = +20 dBm 0 CONVERSION GAIN (dB) RESPONSE (dB) -5 -5 -10 -10 -15 IF Bandwidth IF Return Loss -15 -20 0 1 2 3 4 5 6 7 8 9 FREQUENCY (GHz) -20 5 8 11 14 17 20 FREQUENCY (GHz) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 4 - 21 MIXERS - DOUBLE-BALANCED - CHIP -20 -50 HMC141 / HMC142 v03.1007 GaAs MMIC DOUBLE-BALANCED MIXER, 6 - 18 GHz Input IP3 vs. Temperature @ LO = +20 dBm* 30 Input IP3 vs. LO Drive* 30 25 IP3 (dBm) IP3 (dBm) LO = +13 dBm LO = +15 dBm LO = +17 dBm LO = +20 dBm 25 20 20 4 MIXERS - DOUBLE-BALANCED - CHIP 15 15 +25C +85C -55C 10 5 8 11 14 17 20 FREQUENCY (GHz) 10 5 8 11 14 17 20 FREQUENCY (GHz) Input IP2 vs. LO Drive * 80 70 60 IP2 (dBm) 50 40 30 20 5 8 11 14 17 20 FREQUENCY (GHz) LO = +13 dBm LO = +15 dBm LO = +17 dBm LO = +20 dBm Input P1dB vs. Temperature @ LO = +20 dBm 20 +25C +85C -55C 18 P1dB (dBm) 16 14 12 10 6 8 10 12 14 16 18 20 FREQUENCY (GHz) MxN Spurious @ IF Port nLO mRF 0 1 2 3 4 0 XX 3 72 76 74 1 3 0 64 76 76 2 7 17 59 71 77 3 3 25 59 72 77 4 35 32 74 76 77 Harmonics of LO nLO Spur @ RF Port LO Freq. (GHz) 6 8 10 12 14 16 18 1 38 44 36 33 32 30 27 2 34 29 25 23 28 27 32 3 44 46 46 47 XX XX XX 4 39 43 53 XX XX XX XX RF = 6 GHz @ -10 dBm LO = 6.1 GHz @ +20 dBm All values in dBc relative to the IF power level. Measured as downconverter. LO = +20 dBm All values in dBc below input LO level @ RF port. * Two-tone input power = 0 dBm each tone, 1 MHz spacing. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 4 - 22 HMC141 / HMC142 v03.1007 GaAs MMIC DOUBLE-BALANCED MIXER, 6 - 18 GHz Absolute Maximum Ratings RF / IF Input LO Drive Channel Temperature (Tc) Thermal Resistance +20 dBm +27 dBm 150 °C 101.7 °C/W ±2 mA -65 to +150 °C -55 to +85 °C Outline Drawings (See HMC141/142 Operation Application Note) IF DC Current Storage Temperature Operating Temperature HMC141 4 MIXERS - DOUBLE-BALANCED - CHIP 4 - 23 ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM]. 2. DIE THICKNESS IS .004”. 3. TYPICAL BOND PAD IS .004” SQUARE. 4. BACKSIDE METALLIZATION: GOLD. 5. BOND PAD METALLIZATION: GOLD. 6. BACKSIDE METAL IS GROUND. 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. HMC142 Die Packaging Information [1] Standard WP-3 (Waffle Pack) Alternate [2] [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC141 / HMC142 v03.1007 GaAs MMIC DOUBLE-BALANCED MIXER, 6 - 18 GHz Pad Descriptions HMC141 (HMC142) Pad Number Function Description Interface Schematic 1 (2) RF This pin is AC coupled and matched to 50 Ohms. 4 MIXERS - DOUBLE-BALANCED - CHIP 2 (1) LO This pin is AC coupled and matched to 50 Ohms. 3 IF This pin is DC coupled. For applications not requiring operation to DC, this port should be DC blocked externally using a series capacitor whose value has been chosen to pass the necessary IF frequency range. For operation to DC, this pin must not source/sink more than 2 mA of current or die non-function and possible die failure will result. 4 - 24 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC141 / HMC142 v03.1007 GaAs MMIC DOUBLE-BALANCED MIXER, 6 - 18 GHz Mounting & Bonding Techniques for Millimeterwave GaAs MMICs The die should be attached directly to the ground plane eutectically or with conductive epoxy (see HMC general Handling, Mounting, Bonding Note). 50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the surface of the substrate. One way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should be brought as close to the die as possible in order to minimize ribbon bond length. Typical die-to-substrate spacing is 0.076mm (3 mils). Gold ribbon of 0.075 mm (3 mil) width and minimal length