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HMC143

HMC143

  • 厂商:

    HITTITE

  • 封装:

  • 描述:

    HMC143 - GaAs MMIC DOUBLE-BALANCED MIXER, 5 - 20 GHz - Hittite Microwave Corporation

  • 数据手册
  • 价格&库存
HMC143 数据手册
HMC143 / HMC144 v05.1007 GaAs MMIC DOUBLE-BALANCED MIXER, 5 - 20 GHz Features Input IP3: +25 dBm LO / RF Isolation: 30 dB IF Bandwidth: DC to 3 GHz Small Size: 2.10 x 1.45 x 0.1 mm Typical Applications The HMC143 & HMC144 is ideal for: • Microwave Point-to-Point Radios • VSAT 4 MIXERS - DOUBLE-BALANCED - CHIP Functional Diagram General Description The HMC143 chip is a minature double-balanced mixer which can be used as an upconverter or downconverter. The chip utilizes a standard 1μm GaAs MESFET process. The HMC144 is identical to the HMC143 except that the layout is a mirror image designed to ease integration into image-reject mixer modules. Broadband operation and excellent isolations are provided by on-chip baluns, which require no external components and no DC bias. The design is similar to the HMC141/142 mixers but with an IF combiner in a double-balanced design, providing improved RF/IF isolation. These devices are much smaller and more reliable replacements to hybrid diode mixers. Electrical Specifi cations, TA = +25° C, LO Drive = +20 dBm Parameter Frequency Range, RF & LO Frequency Range, IF Conversion Loss Noise Figure (SSB) LO to RF Isolation LO to IF Isolation IP3 (Input) IP2 (Input) 1 dB Gain Compression (Input) 10 26 15 Min. Typ. 5 - 10.5 DC - 3 10 10 30 18 21 50 15 10 12 12 24 12 Max. Min. Typ. 10.5 - 15.5 DC - 3 10 10 28 15 25 50 15 10 12 12 26 14 Max. Min. Typ. 15.5 - 20 DC - 3 10 10 30 17 23 50 15 12 12 Max. Units GHz GHz dB dB dB dB dBm dBm dBm 4 - 28 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC143 / HMC144 v05.1007 GaAs MMIC DOUBLE-BALANCED MIXER, 5 - 20 GHz Isolation @ LO = +20 dBm 0 RF to IF LO to RF LO to IF Conversion Gain vs. Temperature @ LO = +20 dBm 0 CONVERSION GAIN (dB) -10 -5 ISOLATION (dB) -20 -10 -30 -15 +25 C +85 C -55 C -40 4 4 6 8 10 12 14 16 18 20 22 FREQUENCY (GHz) 4 6 8 10 12 14 16 18 20 22 FREQUENCY (GHz) Conversion Gain vs. LO Drive 0 Return Loss @ LO = +20 dBm 0 RF LO CONVERSION GAIN (dB) RETURN LOSS (dB) -5 LO = +13 dBm LO = +15 dBm LO = +17 dBm LO = +20 dBm -5 -10 -10 -15 -15 -20 -20 4 6 8 10 12 14 16 18 20 22 FREQUENCY (GHz) -25 4 6 8 10 12 14 16 18 20 22 FREQUENCY (GHz) IF Bandwidth @ LO = +20 dBm 0 -5 RESPONSE (dB) -10 -15 -20 -25 -30 0 1 2 3 4 5 6 FREQUENCY (GHz) IF CONVERSION GAIN IF RETURN LOSS Upconverter Performance Conversion Gain @ LO = +20 dBm 0 CONVERSION GAIN (dB) -5 -10 -15 -20 4 6 8 10 12 14 16 18 20 22 FREQUENCY (GHz) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 4 - 29 MIXERS - DOUBLE-BALANCED - CHIP -20 -50 HMC143 / HMC144 v05.1007 GaAs MMIC DOUBLE-BALANCED MIXER, 5 - 20 GHz Input IP3 vs. Temperature @ LO = +20 dBm 35 30 25 IP3 (dBm) 20 15 10 5 0 Input IP3 vs. LO Drive* 35 30 25 IP3 (dBm) 20 15 10 5 0 4 6 8 10 12 14 16 18 20 22 FREQUENCY (GHz) LO = +13 dBm LO = +15 dBm LO = +17 dBm LO = +20 dBm 4 MIXERS - DOUBLE-BALANCED - CHIP +25 C +85 C -55 C 4 6 8 10 12 14 16 18 20 22 FREQUENCY (GHz) Input IP2 vs. LO Drive* 80 70 Input P1dB vs. Temperature @ LO = +20 dBm 25 20 60 IP3 (dBm) 50 40 30 20 10 0 4 6 8 10 12 14 16 18 20 22 FREQUENCY (GHz) LO = +13 dBm LO = +15 dBm LO = +17 dBm LO = +20 dBm P1dB (dBm) 15 10 +25C +85C -55C 5 0 4 6 8 10 12 14 16 18 20 22 FREQUENCY (GHz) * Two-tone input power = 0 dBm each tone, 1 MHz spacing. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 4 - 30 HMC143 / HMC144 v05.1007 GaAs MMIC DOUBLE-BALANCED MIXER, 5 - 20 GHz Harmonics of LO nLO Spur @ RF Port MxN Spurious @ IF Port nLO mRF 0 1 2 3 4 0 XX 43 67 77 72 1 -11 0 61 74 77 2 18 46 63 80 77 3 2 15 69 68 80 4 22 31 68 80 80 LO Freq. (GHz) 6 8 10 12 14 16 18 20 1 37 38 33 28 30 33 32 29 2 35 36 36 28 40 41 47 43 3 58 54 50 41 N/A N/A N/A N/A 4 38 46 56 N/A N/A N/A N/A LO = +20 dBm All values in dBc below input LO level @ RF port. Absolute Maximum Ratings RF / IF Input LO Drive IF DC Current Channel Temperature Continuous Pdiss (T=85 °C) (derate 14.2 mW/°C above 85 °C) Thermal Resistance (RTH) (junction to package bottom) Storage Temperature Operating Temperature ESD Sensitivity (HBM) +15 dBm +27 dBm ± 2 mA 150 °C 924 mW 70.4 °C/W -65 to +150 °C -55 to +85 °C Class 1A Die Packaging Information Standard WP-4 [1] Alternate [2] [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 4 - 31 MIXERS - DOUBLE-BALANCED - CHIP RF = 6 GHz @ -10 dBm LO = 6.1 GHz @ 20 dBm All values in dBc relative to the IF power level. Measured as downconverter. 4 N/A HMC143 / HMC144 v05.1007 GaAs MMIC DOUBLE-BALANCED MIXER, 5 - 20 GHz Outline Drawings HMC143 (See HMC143/144 Operation Application Note) 4 MIXERS - DOUBLE-BALANCED - CHIP NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM]. 2. DIE THICKNESS IS .004”. 3. TYPICAL BOND PAD IS .004” SQUARE. 4. BACKSIDE METALLIZATION: GOLD. HMC144 5. BOND PAD METALLIZATION: GOLD. 6. BACKSIDE METAL IS GROUND. 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. 4 - 32 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC143 / HMC144 v05.1007 GaAs MMIC DOUBLE-BALANCED MIXER, 5 - 20 GHz Pad Descriptions HMC143 (HMC144) Pad Number Function Description Interface Schematic 1 (2) LO This pin is AC coupled and matched to 50 Ohms. 2 (1) RF This pin is AC coupled and matched to 50 Ohms. 4 MIXERS - DOUBLE-BALANCED - CHIP 4 - 33 3 (3) IF This pin is DC coupled. For applications not requiring operation to DC, this port should be DC blocked externally using a series capacitor whose value has been chosen to pass the necessary IF frequency range. For operation to DC, this pin must not source/ sink more than 2 mA of current or die non-function and possible die failure will result. GND The backside of the die must be connected to RF ground. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC143 / HMC144 v05.1007 GaAs MMIC DOUBLE-BALANCED MIXER, 5 - 20 GHz Assembly Drawing 4 MIXERS - DOUBLE-BALANCED - CHIP 4 - 34 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC143 / HMC144 v05.1007 GaAs MMIC DOUBLE-BALANCED MIXER, 5 - 20 GHz Handling Precautions Follow these precautions to avoid permanent damage. Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: Follow ESD precautions to protect against ESD strikes. Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. 4 MIXERS - DOUBLE-BALANCED - CHIP 4 - 35 Mounting The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment. Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. Wire Bonding RF bonds made with 0.003” x 0.0005” ribbon are recommended. These bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001” (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All bonds should be made with a nominal stage temperature of 150 °C. A minimum amount of ultrasonic energy should be applied to achieve reliable bonds. All bonds should be as short as possible, less than 12 mils (0.31 mm). For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
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