HMC188MS8_09

HMC188MS8_09

  • 厂商:

    HITTITE

  • 封装:

  • 描述:

    HMC188MS8_09 - GaAs MMIC SMT PASSIVE FREQUENCY - Hittite Microwave Corporation

  • 详情介绍
  • 数据手册
  • 价格&库存
HMC188MS8_09 数据手册
HMC188MS8 / 188MS8E v04.0709 GaAs MMIC SMT PASSIVE FREQUENCY DOUBLER, 1.25 - 3.0 GHz INPUT Typical Applications Features Conversion Loss: 15 dB Fo, 3Fo, 4Fo Isolation: 45 dB Input Drive Level: 10 to 20 dBm 7 FREQ. MULTIPLIERS - PASSIVE - SMT The HMC188MS8 / HMC188MS8E is suitable for: • Wireless Local Loop • LMDS, VSAT, and Point-to-Point Radios • UNII & HiperLAN • Test Equipment Functional Diagram General Description The HMC188MS8 & HMC188MS8E are miniature frequency doublers in plastic 8-lead MSOP packages. The suppression of undesired fundamental and higher order harmonics is 45 dB typical with respect to input signal levels. The doubler uses the same diode/balun technology used in Hittite MMIC mixers. The doubler is ideal for high volume applications where frequency doubling of a lower frequency is more economical than directly generating a higher frequency. The passive Schottky diode doubler technology contributes no measurable additive phase noise onto the multiplied signal. Electrical Specifi cations, TA = +25° C, As a Function of Drive Level Input = +10 dBm Parameter Frequency Range, Input Frequency Range, Output Conversion Loss FO Isolation (with respect to input level) 3FO Isolation (with respect to input level) 4FO Isolation (with respect to input level) Min. Typ. 1.75 - 2.75 3.5 - 5.5 19 22 35 43 38 Max. Min. Input = +15 dBm Typ. 1.5 - 2.5 3.0 - 5.0 15 45 50 45 18 Max. Min. Input = +20 dBm Typ. 1.25 - 3.0 2.5 - 6.0 16 19 Max. Units GHz GHz dB dB dB dB 7 - 16 F or price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC188MS8 / 188MS8E v04.0709 GaAs MMIC SMT PASSIVE FREQUENCY DOUBLER, 1.25 - 3.0 GHz INPUT Conversion Loss @ +15 dBm Drive Level 0 -40C CONVERSION LOSS (dB) -10 Isolation @ +15 dBm Drive Level* 0 -10 -20 ISOLATION (dB) -30 -40 -50 -60 -70 -80 -90 7 Fo 4Fo 3Fo -20 +25C -30 -40 -50 0 1 2 3 4 5 6 7 8 OUTPUT FREQUENCY (GHz) +85C -100 0 5 10 FREQUENCY (GHz) 15 20 *With respect to input level Input Return Loss vs. Drive Level 0 INPUT RETURN LOSS (dB) Input = +10 dBm Output Return Loss vs. Drive Level 0 OUTPUT RETURN LOSS (dB) -5 -10 -15 -20 -25 0 1 2 3 4 5 6 7 8 OUTPUT FREQUENCY (GHz) Input = +10 dBm -5 -10 -15 -20 -25 0 1 2 3 4 5 6 7 8 Input = +15 dBm Input = +20 dBm Input = +15 dBm Input = +20 dBm INPUT FREQUENCY (GHz) Note: Output return loss measured at 2fo, with +10dBm, +15 dBm, and +20 dBm drive levels on input of doubler. Conversion Loss vs. Drive Level 0 CONVERSION LOSS (dB) Input = +20 dBm Absolute Maximum Ratings Input Drive Storage Temperature +27 dBm -65 to +150 °C -40 to +85 °C Class 1A -10 -20 Input = +10 dBm Operating Temperature ESD Sensitivity (HBM) -30 Input = +13 dBm -40 Input = +15 dBm ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS -50 0 1 2 3 4 5 6 7 8 OUTPUT FREQUENCY (GHz) F or price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 7 - 17 FREQ. MULTIPLIERS - PASSIVE - SMT HMC188MS8 / 188MS8E v04.0709 GaAs MMIC SMT PASSIVE FREQUENCY DOUBLER, 1.25 - 3.0 GHz INPUT Outline Drawing 7 FREQ. MULTIPLIERS - PASSIVE - SMT NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE. 5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND. Package Information Part Number HMC188MS8 HMC188MS8E Package Body Material Low Stress Injection Molded Plastic RoHS-compliant Low Stress Injection Molded Plastic Lead Finish Sn/Pb Solder 100% matte Sn MSL Rating MSL1 MSL1 [1] Package Marking [3] H188 XXXX H188 XXXX [2] [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX Pin Description Pin Number 1, 3 - 6, 8 Function GND Description All ground leads must be soldered to PCB RF/DC ground. Interface Schematic 2 RFIN Pin is DC coupled and matched to 50 Ohms from 1.25 to 3.0 GHz 7 RFOUT Pin is DC coupled and matched to 50 Ohms from 2.5 to 6.0 GHz 7 - 18 F or price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC188MS8 / 188MS8E v04.0709 GaAs MMIC SMT PASSIVE FREQUENCY DOUBLER, 1.25 - 3.0 GHz INPUT Evaluation PCB 7 FREQ. MULTIPLIERS - PASSIVE - SMT List of Materials for Evaluation PCB 103313 [1] Item J1 - J3 C1 U1 PCB [2] Description PCB Mount SMA Connector 1,000 pF Capacitor, 0603 Pkg. HMC188MS8 / HMC188MS8E x4 Active Multiplier 104610 Eval Board [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 4350 The circuit board used in the final application should be generated with proper RF circuit design techniques. Signal lines should have 50 ohm impedance while the package ground leads and exposed paddle should be connected directly to the ground plane similar to that shown. The evaluation circuit board shown is available from Hittite upon request. F or price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 7 - 19
HMC188MS8_09
1. 物料型号: - HMC188MS8:低应力注塑成型塑料封装,Sn/Pb焊料,MSL等级1,包装标记为H188 xXXx。 - HMC188MS8E:符合RoHS标准的低应力注塑成型塑料封装,100%亚光Sn焊料,MSL等级1,包装标记为H188 XXXX。

2. 器件简介: - HMC188MS8和HMC188MS8E是小型化频率倍增器,采用塑料8引脚MSOP封装。这些器件能够将输入信号的频率加倍,并且对于输入信号水平的非期望基波和谐波抑制典型值为45dB。这些倍增器使用了与Hittite MMIC混频器中相同的二极管/平衡不平衡转换技术。被动肖特基二极管倍增器技术不会对乘法信号增加可测量的附加相位噪声。

3. 引脚分配: - 引脚1、3-6、8:GND,所有地线必须焊接到PCB射频/直流地。 - 引脚2:RFIN,引脚是直流耦合的,并且在1.25至3.0GHz范围内与50欧姆匹配。 - 引脚7:RFOUT,引脚是直流耦合的,并且在2.5至6.0GHz范围内与50欧姆匹配。

4. 参数特性: - 转换损耗:15dB。 - Fo、3Fo、4Fo隔离度:45dB。 - 输入驱动电平:10至20dBm。

5. 功能详解: - 这些器件适用于无线本地环路、LMDS、VSAT和点对点无线电、UNII和HiperLAN、测试设备等应用。它们的功能是将较低频率的信号加倍,这在高产量应用中比直接产生更高频率更为经济。

6. 应用信息: - 适用于需要频率倍增的应用,如无线通信系统和测试设备。

7. 封装信息: - 封装类型为SMT(表面贴装技术)的8引脚MSOP封装。 - 引脚框材料为铜合金。 - 尺寸以英寸[毫米]为单位,不包括每侧0.15mm或0.25mm的模具闪光。 - 所有地线引脚必须焊接到PCB射频地。
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