HMC203

MICROWAVE CORPORATION v01.0801 HMC203 GaAs MMIC DOUBLE-BALANCED MIXER, 14 - 23 GHz Features Conversion Loss: 10 dB LO / RF Isolation: 38 dB Passive: No DC Bias Required Small Size: 0.87 mm x 1.48 mm Typical Applications The HMC203 is ideal for: • 18 GHz TVRO • 23 GHz Telecom Radios • Military Systems Functional Diagram General Description The HMC203 chip is a miniature double-balanced mixer which can be used as an upconverter or downconverter. Excellent isolations are provided by on-chip baluns, which require no external components and no DC bias. The mixer chip can be integrated directly into MMIC hybrid applications. Unless otherwise stated, all data was measured with the mixer mounted in a MMIC test fixture. The MMIC was connected to thinfilm 50 ohm transmission lines with 1 mil diameter wirebonds of ± 250V ESD strikes. Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment. Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. 5 MIXERS - CHIP 5 - 31 Wire Bonding RF bonds made with 0.003” x 0.0005” ribbon are recommended. These bonds should be thermosonically bonded with a force of 4060 grams. DC bonds of 0.001” (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All bonds should be made with a nominal stage temperature of 150 °C. A minimum amount of ultrasonic energy should be applied to achieve reliable bonds. All bonds should be as short as possible, less than 12 mils (0.31 mm). For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com