HMC363S8G_09

HMC363S8G / 363S8GE v03.0705 SMT GaAs HBT MMIC DIVIDE-BY-8, DC - 12 GHz Features Ultra Low SSB Phase Noise: -153 dBc/Hz Wide Bandwidth Output Power: -6 dBm Single DC Supply: +5V S8G SMT Package 6 FREQUENCY DIVIDERS & DETECTORS - SMT Typical Applications Prescaler for DC to X Band PLL Applications: • Satellite Communication Systems • Fiber Optic • Point-to-Point and Point-to-Multi-Point Radios • VSAT Functional Diagram General Description The HMC363S8G & HMC363S8GE are low noise Divide-by-8 Static Dividers with InGaP GaAs HBT technology in 8 lead surface mount plastic packages. This device operates from DC (with a square wave input) to 12 GHz input frequency with a single +5V DC supply. The low additive SSB phase noise of -153 dBc/Hz at 100 kHz offset helps the user maintain good system noise performance. Electrical Specifi cations, TA = +25° C, 50 Ohm System, Vcc= 5V Parameter Maximum Input Frequency Minimum Input Frequency Input Power Range Sine Wave Input. [1] Fin = 1 to 7 GHz Fin = 7 to 11 GHz Fin = 11 to 12 GHz Output Power Reverse Leakage SSB Phase Noise (100 kHz offset) Output Transition Time Supply Current (Icc) 1. Divider will operate down to DC for square-wave input signal. Fin = 12 GHz Both RF Outputs Terminated Pin = 0 dBm, Fin = 6 GHz Pin = 0 dBm, Fout = 882 MHz -15 -10 -5 -9 Conditions Min. 12 Typ. 13 0.2 >-20 >-15 >-8 -6 65 -153 100 70 0.5 +10 +2 0 Max. Units GHz GHz dBm dBm dBm dBm dB dBc/Hz ps mA 6 - 20 F or price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC363S8G / 363S8GE v03.0705 SMT GaAs HBT MMIC DIVIDE-BY-8, DC - 12 GHz Input Sensitivity Window, T= 25 °C 20 Input Sensitivity Window vs. Temperature 20 6 FREQUENCY DIVIDERS & DETECTORS - SMT 6 - 21 10 INPUT POWER (dBm) INPUT POWER (dBm) 10 0 Recommended Operating Window 0 -10 -10 Min Pin +25 C Max Pin +25 C Min Pin +85 C Max Pin +85 C Min Pin -40 C Max Pin -40 C -20 -20 -30 0 3 6 9 12 15 INPUT FREQUENCY (GHz) -30 0 3 6 9 12 15 INPUT FREQUENCY (GHz) Output Power vs. Temperature 0 +25 C +85 C -40 C SSB Phase Noise Performance, Pin= 0 dBm, T= 25 °C 0 -20 SSB PHASE NOISE (dBc/Hz) -40 -60 -80 -100 -120 -140 -160 2 10 OUTPUT POWER (dBm) -2 -4 -6 -8 -10 0 3 6 9 12 15 INPUT FREQUENCY (GHz) 10 3 10 4 10 5 10 6 10 7 OFFSET FREQUENCY (Hz) Output Harmonic Content, Pin= 0 dBm, T= 25 °C 0 -10 OUTPUT LEVEL (dBm) -20 -30 -40 -50 -60 0 3 6 9 12 15 INPUT FREQUENCY (GHz) Pfeedthru 2nd Harmonic 3rd Harmonic Reverse Leakage, Pin= 0 dBm, T= 25 °C 0 Both Output Ports Terminated One Output Port Terminated POWER LEVEL (dBm) -20 -40 -60 -80 0 3 6 9 12 15 INPUT FREQUENCY (GHz) F or price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC363S8G / 363S8GE v03.0705 SMT GaAs HBT MMIC DIVIDE-BY-8, DC - 12 GHz 6 FREQUENCY DIVIDERS & DETECTORS - SMT AMPLITUDE (mV) Output Voltage Waveform, Pin= 0 dBm, Fout= 882 MHz, T= 25 °C 300 200 100 0 -100 -200 -300 22.7 23.1 23.5 23.9 24.3 24.7 TIME (nS) Absolute Maximum Ratings RF Input (Vcc = +5V) Vcc Channel Temperature Continuous Pdiss (T=85°C) (derate 13.7 mW/°C above 85°C) Thermal Resistance (channel to ground paddle) Storage Temperature Operating Temperature +13 dBm +5.5V 135 °C 680 mW 73.2 C/W -65 to +150 °C -40 to +85 °C Typical Supply Current vs. Vcc Vcc (V) 4.75 5.0 5.25 Icc (mA) 64 70 75 Note: Divider will operate over full voltage range shown above ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS 6 - 22 F or price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC363S8G / 363S8GE v03.0705 SMT GaAs HBT MMIC DIVIDE-BY-8, DC - 12 GHz Outline Drawing 6 FREQUENCY DIVIDERS & DETECTORS - SMT 6 - 23 NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE. 5. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. Package Information Part Number HMC363S8G HMC363S8GE Package Body Material Low Stress Injection Molded Plastic RoHS-compliant Low Stress Injection Molded Plastic Lead Finish Sn/Pb Solder 100% matte Sn MSL Rating MSL1 MSL1 [1] Package Marking [3] HMC363 XXXX HMC363 XXXX [2] [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX F or price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC363S8G / 363S8GE v03.0705 SMT GaAs HBT MMIC DIVIDE-BY-8, DC - 12 GHz 6 FREQUENCY DIVIDERS & DETECTORS - SMT Pin Description Pin Number Function Description Interface Schematic 1 OUT Divided output 180° out of phase with pin 3. 2, 6 N/C No connection. These pins must not be grounded. 3 OUT Divided Output. 4 VCC Supply voltage 5V ± 0.25V. 5 IN RF Input must be DC blocked. 7 IN RF Input 180° out of phase with pin 5 for differential operation. A/C ground for single ended operation 8 GND Ground Backside of package has exposed metal ground slug which must be connected to ground. Application Circuit 6 - 24 F or price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC363S8G / 363S8GE v03.0705 SMT GaAs HBT MMIC DIVIDE-BY-8, DC - 12 GHz Evaluation PCB 6 FREQUENCY DIVIDERS & DETECTORS - SMT 6 - 25 List of Materials for Evaluation PCB 104631 [1] Item J1 - J3 C1 - C4 C5 C6 U1 PCB [2] Description PCB Mount SMA RF Connector 100 pF Capacitor, 0402 Pkg. 1000 pF Capacitor, 0603 Pkg. 10 μF Tantalum Capacitor HMC363S8G / HMC363S8GE Divide-by-8 104627 Eval Board [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 4350 The circuit board used in the final application should use RF circuit design techniques. Signal lines should have 50 ohm impedance while the package ground leads and backside ground slug should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon request. This evaluation board is designed for single ended input testing. J2 and J3 provide differential output signals. F or price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com