HMC364S8G

HMC364S8G

  • 厂商:

    HITTITE

  • 封装:

  • 描述:

    HMC364S8G - SMT GaAs HBT MMIC DIVIDE-BY-2, DC - 12.5 GHz - Hittite Microwave Corporation

  • 详情介绍
  • 数据手册
  • 价格&库存
HMC364S8G 数据手册
MICROWAVE CORPORATION v02.1202 HMC364S8G SMT GaAs HBT MMIC DIVIDE-BY-2, DC - 12.5 GHz Features Ultra Low SSB Phase Noise: -145 dBc/Hz Wide Bandwidth Output Power: 4 dBm Single DC Supply: +5V S8G SMT Package Typical Applications Prescaler for DC to X Band PLL Applications: • Satellite Communication Systems • Fiber Optic 10 FREQ. DIVIDER & DETECTORS - SMT • Pt-Pt and Pt-MPt Radios • VSAT Functional Diagram General Description The HMC364S8G is a low noise Divide-by-2 Static Divider with InGaP GaAs HBT technology in an 8 lead surface mount plastic package. This device operates from DC (with a square wave input) to 12.5 GHz input frequency with a single +5.0V DC supply. The low additive SSB phase noise of -145 dBc/Hz at 100 kHz offset helps the user maintain good system noise performance. Electrical Specifications, TA = +25° C, 50 Ohm System, Vcc= 5V Parameter Maximum Input Frequency Minimum Input Frequency Input Power Range Sine Wave Input. [1] Fin = 1 to 10 GHz Fin = 10 to 12 GHz Fin = 12 to 12.5 GHz Output Power Fin = 6 GHz Fin = 9 GHz Fin = 11 GHz Fin = 12.5 GHz Reverse Leakage SSB Phase Noise (100 kHz offset) Output Transition Time Supply Current (Icc) Both RF Outputs Terminated Pin = 0 dBm, Fin = 6 GHz Pin = 0 dBm, Fout = 882 MHz -15 -10 -4 2 -2 -5 -8 40 -145 100 105 Conditions Min. 12.5 Typ. 13.5 0.2 >-20 >-15 >-8 5 0.5 +10 +5 +2 Max. Units GHz GHz dBm dBm dBm dBm dBm dBm dBm dB dBc/Hz ps mA 1. Divider will operate down to DC for square-wave input signal. 10 - 38 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com MICROWAVE CORPORATION v02.1202 HMC364S8G SMT GaAs HBT MMIC DIVIDE-BY-2, DC - 12.5 GHz GaAs MMIC SUB-HARMONICALLY Input Sensitivity Window17 Temperature PUMPED MIXER vs. - 25 GHz Input Sensitivity Window, T= 25 °C 20 20 10 10 INPUT POWER (dBm) 0 Recommended Operating Window INPUT POWER (dBm) 0 -10 -10 Min Pin +25 C Max Pin +25 C Min Pin +85 C Max Pin +85 C Min Pin -40 C Max Pin -40 C 10 10 11 12 13 14 15 -20 -20 -30 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 INPUT FREQUENCY (GHz) -30 0 1 2 3 4 5 6 7 8 9 INPUT FREQUENCY (GHz) Output Power vs. Temperature 10 9 8 7 6 5 4 3 2 1 0 -1 -2 -3 -4 -5 0 1 2 3 4 5 6 7 8 9 INPUT FREQUENCY (GHz) SSB Phase Noise Performance, Pin= 0 dBm, T= 25 °C 0 +25 C +85 C -40 C -20 -40 -60 -80 -100 -120 -140 -160 2 10 10 11 12 13 14 15 10 3 10 4 10 5 10 6 10 7 OFFSET FREQUENCY (Hz) Output Harmonic Content, Pin= 0 dBm, T= 25 °C 0 Pfeedthru 3rd Harmonic Reverse Leakage, Pin= 0 dBm, T= 25 °C 0 Both Output Ports Terminated One Output Port Terminated -10 -10 OUTPUT LEVEL (dBm) -20 POWER LEVEL (dBm) -20 -30 -30 -40 -40 -50 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 INPUT FREQUENCY (GHz) -50 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 INPUT FREQUENCY (GHz) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com 10 - 39 FREQ. DIVIDERS & DETECTORS - SMT SSB PHASE NOISE (dBc/Hz) OUTPUT POWER (dBm) MICROWAVE CORPORATION v02.1202 HMC364S8G SMT GaAs HBT MMIC DIVIDE-BY-2, DC - 12.5 GHz Output Voltage Waveform, Pin= 0 dBm, Fout= 882 MHz, T= 25 °C 700 600 500 400 300 200 100 0 -100 -200 -300 -400 -500 -600 -700 22.7 22.9 23.1 23.3 23.5 23.7 23.9 24.1 24.3 24.5 24.7 TIME (nS) Absolute Maximum Ratings RF Input (Vcc = +5V) Vcc VLogic Storage Temperature Operating Temperature -13 dBm +5.5V Vcc -1.6V to Vcc -1.2V -65 to -150 °C -40 to +85 °C 10 FREQ. DIVIDER & DETECTORS - SMT AMPLITUDE (mV) Typical Supply Current vs. Vcc Vcc (V) 4.75 5.0 5.25 Icc (mA) 93 105 115 Note: Divider will operate over full voltage range shown above Outline Drawing NOTES: 1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC SILICA AND SILICON IMPREGNATED. 2. LEADFRAME MATERIAL: COPPER ALLOY 3. LEADFRAME PLATING: Sn/Pb SOLDER 4. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE. 7. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 10 - 40 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com MICROWAVE CORPORATION v02.1202 HMC364S8G SMT GaAs HBT MMIC DIVIDE-BY-2, DC - 12.5 GHz Pin Description Pin Number Function Description Interface Schematic 1 OUT Divided output 180° out of phase with pin 3. 10 FREQ. DIVIDERS & DETECTORS - SMT 10 - 41 2, 6 N/C No connection. These pins must not be grounded. 3 OUT Divided Output. 4 VCC Supply voltage 5V ± 0.25V. 5 IN RF Input must be DC blocked. 7 IN RF Input 180° out of phase with pin 5 for differential operation. A/C ground for single ended operation 8 GND Ground Backside of package has exposed metal ground slug which must be connected to ground. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com MICROWAVE CORPORATION v02.1202 HMC364S8G SMT GaAs HBT MMIC DIVIDE-BY-2, DC - 12.5 GHz Evaluation PCB 10 FREQ. DIVIDER & DETECTORS - SMT List of Materials Item J1 - J3 C1 - C4 C5 C6 U1 PCB* Description PC Mount SMA RF Connector 100 pF Capacitor, 0402 Pkg. 1000 pF Capacitor, 0603 Pkg. 10 µF Tantalum Capacitor HMC364S8G Divide-by-2 104627 Eval Board * Circuit Board Material: Rogers 4350 The circuit board used in the final application should use RF circuit design techniques. Signal lines should have 50 ohm impedance while the package ground leads and backside ground slug should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon request. This evaluation board is designed for single ended input testing. J2 and J3 provide differential output signals. 10 - 42 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com MICROWAVE CORPORATION v02.1202 HMC364S8G SMT GaAs HBT MMIC DIVIDE-BY-2, DC - 12.5 GHz Application Circuit 10 FREQ. DIVIDERS & DETECTORS - SMT For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com 10 - 43
HMC364S8G
1. 物料型号: - HMC364S8G,SMT GaAs HBT MMIC DIVIDE-BY-2,工作频率范围为DC至12.5 GHz。

2. 器件简介: - HMC364S8G是一款低噪声的除以2的静态分频器,采用InGaP GaAs HBT技术,8引脚表面贴装塑料封装。该器件工作频率范围从直流(方波输入)至12.5 GHz,单+5.0V直流供电。低附加SSB相位噪声为-145 dBc/Hz(在100 kHz偏移处),有助于用户保持良好的系统噪声性能。

3. 引脚分配: - 1号引脚:OUT,分频输出,与3号引脚相位差180°。 - 2号和6号引脚:N/C(无连接),这些引脚不能接地。 - 3号引脚:OUT,分频输出。 - 4号引脚:VCC,供电电压5V ± 0.25V。 - 5号引脚:IN,RF输入,与5号引脚相位差180°,用于差分操作的A/C地。 - 7号引脚:RF Input,与5号引脚相位差180°,用于差分操作。 - 8号引脚:GND,接地,封装背面有暴露的金属接地片,必须连接到地。

4. 参数特性: - 最大输入频率:12.5 GHz。 - 最小输入频率:0.2 GHz(方波输入)至0.5 GHz(正弦波输入)。 - 输入功率范围:-15 dBm至+10 dBm(1至10 GHz);-10 dBm至+5 dBm(10至12 GHz);-4 dBm至+2 dBm(12至12.5 GHz)。 - 输出功率:在不同频率下分别为2 dBm、-2 dBm、-5 dBm和-8 dBm。 - 反向泄漏:40 dB。 - SSB相位噪声(100 kHz偏移):-145 dBc/Hz。 - 供电电流(icc):105 mA。

5. 功能详解: - HMC364S8G作为低噪声分频器,适用于卫星通信系统、光纤通信、点对点及点对多点无线电和VSAT等应用。该器件有助于维持良好的系统噪声性能。

6. 应用信息: - 应用于直流至X波段PLL(相位锁定环)的预分频器,具体应用包括卫星通信系统、光纤通信、点对点及点对多点无线电和VSAT。

7. 封装信息: - HMC364S8G采用8引脚表面贴装塑料封装,封装体材料为低应力注塑塑料硅和硅浸渍,引线框架材料为铜合金,引线框架镀锡/铅焊料。封装尺寸以英寸[毫米]为单位,不包括每侧0.15mm的模具闪光。所有地线和地垫片必须焊接到PCB射频地。
HMC364S8G 价格&库存

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