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HMC365S8G

HMC365S8G

  • 厂商:

    HITTITE

  • 封装:

  • 描述:

    HMC365S8G - SMT GaAs HBT MMIC DIVIDE-BY-4, DC - 13.0 GHz - Hittite Microwave Corporation

  • 详情介绍
  • 数据手册
  • 价格&库存
HMC365S8G 数据手册
HMC365S8G / 365S8GE v04.0506 SMT GaAs HBT MMIC DIVIDE-BY-4, DC - 13.0 GHz Features Ultra Low SSB Phase Noise: -151 dBc/Hz Wide Bandwidth Output Power: 5 dBm Single DC Supply: +5V S8G SMT Package Typical Applications 6 FREQUENCY DIVIDERS & DETECTORS - SMT Prescaler for DC to Ku Band PLL Applications: • Satellite Communication Systems • Fiber Optic • Point-to-Point and Point-to-Multi-Point Radios • VSAT Functional Diagram General Description The HMC365S8G & HMC365S8GE are low noise Divide-by-4 Static Dividers with InGaP GaAs HBT technology in 8 lead surface mount plastic packages. This device operates from DC (with a square wave input) to 13.0 GHz input frequency with a single +5.0V DC supply. The low additive SSB phase noise of -151 dBc/Hz at 100 kHz offset helps the user maintain good system noise performance. Electrical Specifications, TA = +25° C, 50 Ohm System, Vcc = 5V Parameter Maximum Input Frequency Minimum Input Frequency Input Power Range Sine Wave Input. [1} Fin = 1 to 8 GHz Fin = 8 to 11 GHz Fin = 11 to 13 GHz Output Power Reverse Leakage SSB Phase Noise (100 kHz offset) Output Transition Time Supply Current (Icc) 1. Divider will operate down to DC for square-wave input signal. Fin = 13 GHz Both RF Outputs Terminated Pin = 0 dBm, Fin = 6 GHz Pin = 0 dBm, Fout = 882 MHz -15 -10 -5 2 Conditions Min. 13 Typ. 14 0.2 >-20 >-15 >-8 5 45 -151 100 110 0.5 +10 +3 +3 Max. Units GHz GHz dBm dBm dBm dBm dB dBc/Hz ps mA 6 - 44 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC365S8G / 365S8GE v04.0506 SMT GaAs HBT MMIC DIVIDE-BY-4, DC - 13.0 GHz Input Sensitivity Window, T= 25 °C 20 Input Sensitivity Window vs. Temperature 20 6 Min Pin +25 C Max Pin +25 C Min Pin +85 C Max Pin +85 C Min Pin -40 C Max Pin -40 C 10 INPUT POWER (dBm) INPUT POWER (dBm) 10 0 Recommended Operating Window 0 -10 -10 -20 -20 -30 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 INPUT FREQUENCY (GHz) -30 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 INPUT FREQUENCY (GHz) Output Power vs. Temperature 10 9 8 7 6 5 4 3 2 1 0 -1 -2 -3 -4 -5 0 1 2 3 4 5 6 7 8 SSB Phase Noise Performance, Pin= 0 dBm, T= 25 °C 0 -20 SSB PHASE NOISE (dBc/Hz) -40 -60 -80 -100 -120 -140 -160 2 10 +25 C +85 C -40 C 9 10 11 12 13 14 15 10 3 10 4 10 5 10 6 10 7 INPUT FREQUENCY (GHz) OFFSET FREQUENCY (Hz) Output Harmonic Content, Pin= 0 dBm, T= 25 °C 0 Reverse Leakage, Pin= 0 dBm, T= 25 °C 0 -10 POWER LEVEL (dBm) Both Output Ports Terminated One Output Port Terminated -10 OUTPUT LEVEL (dBm) Pfeedthru 2nd Harmonic 3rd Harmonic -20 -30 -40 -50 -60 -20 -30 -40 -50 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 INPUT FREQUENCY (GHz) 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 INPUT FREQUENCY (GHz) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 6 - 45 FREQUENCY DIVIDERS & DETECTORS - SMT OUTPUT POWER (dBm) HMC365S8G / 365S8GE v04.0506 SMT GaAs HBT MMIC DIVIDE-BY-4, DC - 13.0 GHz Output Voltage Waveform, Pin= 0 dBm, Fout= 882 MHz, T= 25 °C Absolute Maximum Ratings RF Input (Vcc = +5V) Vcc Junction Temperature Continuous Pdiss (T= 85°C) (derate 15 mW/°C above 85°C) Thermal Resistance (RTH) (junction to ground paddle) Storage Temperature Operating Temperature +13 dBm +5.5V 135 °C 760 mW 65.8 °C/W -65 to +150 °C -40 to to +85 °C 6 FREQUENCY DIVIDERS & DETECTORS - SMT AMPLITUDE (mV) 700 600 500 400 300 200 100 0 -100 -200 -300 -400 -500 -600 -700 22.7 22.9 23.1 23.3 23.5 23.7 23.9 24.1 24.3 24.5 24.7 TIME (nS) Typical Supply Current vs. Vcc Vcc (V) 4.75 Icc (mA) 94 110 118 ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS 5.0 5.25 Note: Divider will operate over full voltage range shown above Outline Drawing NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE. 5. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. Package Information Part Number HMC365S8G HMC365S8GE Package Body Material Low Stress Injection Molded Plastic RoHS-compliant Low Stress Injection Molded Plastic Lead Finish Sn/Pb Solder 100% matte Sn MSL Rating MSL1 MSL1 [1] Package Marking [3] HMC365 XXXX HMC365 XXXX [2] [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX 6 - 46 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC365S8G / 365S8GE v04.0506 SMT GaAs HBT MMIC DIVIDE-BY-4, DC - 13.0 GHz Pin Description Pin Number Function Description Interface Schematic 6 FREQUENCY DIVIDERS & DETECTORS - SMT 6 - 47 1 OUT Divided output 180° out of phase with pin 3. 2, 6 N/C No connection. These pins must not be grounded. 3 OUT Divided Output. 4 Vcc Supply voltage 5V ± 0.25V. 5 IN RF Input must be DC blocked. 7 IN RF Input 180° out of phase with pin 5 for differential operation. A/C ground for single ended operation 8 GND Ground Backside of package has exposed metal ground paddle which must be connected to ground. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC365S8G / 365S8GE v04.0506 SMT GaAs HBT MMIC DIVIDE-BY-4, DC - 13.0 GHz Evaluation PCB 6 FREQUENCY DIVIDERS & DETECTORS - SMT List of Materials for Evaluation PCB 104631 Item J1 - J3 C1 - C4 C5 C6 U1 PCB [2] Description PCB Mount SMA RF Connector 100 pF Capacitor, 0402 Pkg. 1000 pF Capacitor, 0603 Pkg. 10 μF Tantalum Capacitor HMC365S8G / HMC365S8GE Divide-by-4 104627 Eval Board [1] [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 4350 The circuit board used in the final application should use RF circuit design techniques. Signal lines should have 50 ohm impedance while the package ground leads and backside ground slug should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon request. This evaluation board is designed for single ended input testing. J2 and J3 provide differential output signals. 6 - 48 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC365S8G / 365S8GE v04.0506 SMT GaAs HBT MMIC DIVIDE-BY-4, DC - 13.0 GHz Application Circuit 6 FREQUENCY DIVIDERS & DETECTORS - SMT For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 6 - 49
HMC365S8G
1. 物料型号: - HMC365S8G:低应力注塑塑料封装,Sn/Pb焊料,MSL等级为MSL1,最大峰值再流温度235°C。 - HMC365S8GE:符合RoHS标准的低应力注塑塑料封装,100%亚光Sn焊料,MSL等级为MSL1,最大峰值再流温度260°C。

2. 器件简介: - HMC365S8G/365S8GE是低噪声除以4的静态分频器,采用InGaP GaAs HBT技术,8引脚表面贴装塑料封装。该器件工作频率从直流(方波输入)至13.0 GHz,单+5.0V直流供电。低附加SSB相位噪声-151dBc/Hz(在100kHz偏移处)有助于用户保持良好的系统噪声性能。

3. 引脚分配: - 1号引脚:OUT,分频输出,与3号引脚相位差180°。 - 2号和6号引脚:N/C,无连接。这些引脚不得接地。 - 3号引脚:OUT,分频输出。 - 4号引脚:Vcc,供电电压5V±0.25V。 - 5号引脚:IN,RF输入必须阻断直流。 - 7号引脚:IN,与5号引脚相位差180°的RF输入,用于差分操作。单端操作时为交流地。 - 8号引脚:GND,接地。封装背面有暴露的金属接地片,必须连接到地。

4. 参数特性: - 最大输入频率:13 GHz。 - 最小输入频率:0.2 GHz(方波输入)至0.5 GHz(正弦波输入)。 - 输入功率范围:-15 dBm至+10 dBm,根据不同频率段有所变化。 - 输出功率:在13 GHz输入频率时为5 dBm。 - 反向泄漏:45 dB。 - SSB相位噪声(100 kHz偏移):-151 dBc/Hz。 - 供电电流(Icc):110 mA。

5. 功能详解: - 该器件为低噪声除以4的静态分频器,适用于卫星通信系统、光纤、点对点和点对多点无线电、VSAT等应用。具有超低的SSB相位噪声和宽频带输出功率。

6. 应用信息: - 适用于直流至Ku波段PLL应用的预分频器、卫星通信系统、光纤、点对点和点对多点无线电、VSAT等。

7. 封装信息: - 封装材料为低应力注塑塑料,引脚镀层为Sn/Pb焊料或100%亚光Sn焊料,MSL等级为MSL1。封装标记为HMC365 XXXX,其中XXXX为四位批号。
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