HMC576LC3B
v01.1208
SMT GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 18 - 29 GHz OUTPUT
Typical Applications
Features
High Output Power: +15 dBm Low Input Power Drive: 0 to +6 dBm Fo Isolation: >20 dBc @ Fout= 24 GHz 100 KHz SSB Phase Noise: -132 dBc/Hz Single Supply: +5V@ 82 mA RoHS Compliant 3x3 mm SMT Package
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FREQ. MULTIPLIERS - ACTIVE - SMT
The HMC576LC3B is suitable for: • Clock Generation Applications: SONET OC-192 & SDH STM-64 • Point-to-Point & VSAT Radios • Test Instrumentation • Military & Space
Functional Diagram
General Description
The HMC576LC3B is a x2 active broadband frequency multiplier utilizing GaAs PHEMT technology in a leadless RoHS compliant SMT package. When driven by a +3 dBm signal, the multiplier provides +15 dBm typical output power from 18 to 29 GHz. The Fo and 3Fo isolations are >20 dBc at 24 GHz. The HMC576LC3B is ideal for use in LO multiplier chains for Pt to Pt & VSAT Radios yielding reduced parts count vs. traditional approaches. The low additive SSB Phase Noise of -132 dBc/Hz at 100 kHz offset helps maintain good system noise performance. The RoHS packaged HMC576LC3B eliminates the need for wire bonding, and allows the use of surface mount manufacturing techniques.
Electrical Specifi cations, TA = +25° C, Vdd1, Vdd2 = +5V, 3 dBm Drive Level
Parameter Frequency Range, Input Frequency Range, Output Output Power Fo Isolation (with respect to output level) 3Fo Isolation (with respect to output level) Input Return Loss Output Return Loss SSB Phase Noise (100 kHz Offset) Supply Current (Idd1 & Idd2) 10 Min. Typ. 9 - 14.5 18 - 29 15 20 20 10 10 -132 82 Max. Units GHz GHz dBm dBc dBc dB dB dBc/Hz mA
7 - 100
F or price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
HMC576LC3B
v01.1208
SMT GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 18 - 29 GHz OUTPUT
Output Power vs. Temperature @ 3 dBm Drive Level
20 18 OUTPUT POWER (dBm)
Output Power vs. Drive Level
25 20 OUTPUT POWER (dBm) 15 10 5 0 -5 -10 -15 -20 -25 -30
-6 dBm -4 dBm -2 dBm 0 dBm 2 dBm 4 dBm 6 dBm
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FREQ. MULTIPLIERS - ACTIVE - SMT
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16 14 12 10 8 6 4 2 0 17 18 19 20 21 22 23 24 25 26 27 28 29 30 FREQUENCY (GHz)
+25C +85C -40C
17
18 19 20
21 22 23
24
25 26 27
28 29
30
FREQUENCY (GHz)
Output Power vs. Supply Voltage @ 3 dBm Drive Level
20 18 OUTPUT POWER (dBm)
Isolation @ 3 dBm Drive Level
20
14 12 10 8 6 4 2 0 17 18 19 20 21 22 23 24 25 26 27 28 29 30 FREQUENCY (GHz)
4.5V 5.0V 5.5V
OUTPUT POWER (dBm)
16
10
0
-10
Fo 2Fo 3Fo
-20
-30 17 18 19 20 21 22 23 24 25 26 27 28 29 30 FREQUENCY (GHz)
Output Power vs. Input Power
20 15 OUTPUT POWER (dBm) 10 5 0 -5 -10 -15 -20 -10
18GHz 24GHz 29GHz
-8
-6
-4
-2
0
2
4
6
8
10
INPUT POWER (dBm)
F or price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
HMC576LC3B
v01.1208
SMT GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 18 - 29 GHz OUTPUT
Input Return Loss vs. Temperature
Output Return Loss vs. Temperature
0 OUTPUT RETURN LOSS (dB)
+25C +85C -40C
INPUT RETURN LOSS (dB)
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FREQ. MULTIPLIERS - ACTIVE - SMT
0 -5 -10 -15 -20 -25 -30 8 9 10 11 12 13 14 15 FREQUENCY (GHz)
-5
-10
-15
+25C +85C -40C
-20
-25 17 18 19 20 21 22 23 24 25 26 27 28 29 30 FREQUENCY (GHz)
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F or price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
HMC576LC3B
v01.1208
SMT GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 18 - 29 GHz OUTPUT
Typical Supply Current vs. Vdd
Vdd (Vdc) 4.5 5.0 5.5 Idd (mA) 82 82
Absolute Maximum Ratings
RF Input (Vdd = +5V) Supply Voltage (Vdd) Channel Temperature Continuous Pdiss (T= 85 °C) (derate 7.5 mW/°C above 85 °C) Thermal Resistance (channel to ground paddle) Storage Temperature Operating Temperature +13 dBm +6.0 Vdc 175 °C 676 mW 133 °C/W -65 to +150 °C -40 to +85 °C
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FREQ. MULTIPLIERS - ACTIVE - SMT
7 - 103
83
Note: Multiplier will operate over full voltage range shown above.
ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS
Outline Drawing
NOTES: 1. PACKAGE BODY MATERIAL: ALUMINA 2. LEAD AND GROUND PADDLE PLATING: 30-80 MICROINCHES GOLD OVER 50 MICROINCHES MINIMUM NICKEL. 3. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM -C6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. CLASSIFIED AS MOISTURE SENSITIVITY LEVEL (MSL) 1.
F or price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
HMC576LC3B
v01.1208
SMT GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 18 - 29 GHz OUTPUT
Pin Description
7
FREQ. MULTIPLIERS - ACTIVE - SMT
Pin Number 1, 3, 7, 9
Function GND
Description Package bottom must also be connected to RF/DC ground. Pin is AC coupled and matched to 50 Ohms. These pins are internally not connected; however, this product was specified with these pins connected to RF/ DC ground. Pin is AC coupled and matched to 50 Ohms.
Interface Schematic
2
RFIN
4 - 6, 11
N/C
8
RFOUT
10, 12
Vdd2, Vdd1
Supply voltage 5V ± 0.5V. External bypass capacitors of 100 pF, 1,000 pF and 2.2 μF are required.
Application Circuit
Component C1, C2 C3, C4 C5, C6 Value 100 pF 1,000 pF 2.2 μF
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F or price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
HMC576LC3B
v01.1208
SMT GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 18 - 29 GHz OUTPUT
Evaluation PCB
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FREQ. MULTIPLIERS - ACTIVE - SMT
List of Materials for Evaluation PCB 112409 [1]
Item J1, J2 J3 - J5 C1, C2 C3, C4 C5, C6 U1 PCB [2] Description PCB Mount SRI K Connector DC Pin 100 pF Capacitor, 0402 Pkg. 1,000 pF Capacitor, 0603 Pkg. 2.2 μF Tantalum Capacitor HMC576LC3B x2 Active Multiplier 111173 Eval Board [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 4350
The circuit board used in the final application should be generated with proper RF circuit design techniques. Signal lines should have 50 ohm impedance while the package ground leads and exposed paddle should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon request.
F or price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
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