HMC657

HMC650 TO HMC658 v01.0308 WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658 Typical Applications Features Wide Bandwidth: DC - 50 GHz 9 Attenuator Products: 0, 2, 3, 4, 6, 10, 15, & 20 dB Fixed Levels Power Handling: +25 dBm HMC651 & HMC658 Die Size: 0.57 x 0.45 x 0.1 mm HMC650, HMC652, HMC653, HMC654 HMC655, HMC656 & HMC657 Die Size: 0.42 x 0.45 x 0.1 mm Included in the HMC-DK006 Designer’s Kit 2 PASSIVES - CHIP The HMC650 through HMC658 are ideal for: • Fiber Optics • Microwave Radio • Military & Space Hybrids • Test & Measurement • Scientific Instruments • RF / Microwave Circuit Prototyping Functional Diagrams General Description The HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658 are a line of wideband fixed value 50 Ohm matched attenuator chips which offer relative attenuation levels of 0, 2, 3, 4, 6, 10, 15 and 20 dB. These passive though-lines and attenuators are ideal for microstrip, hybrid, and multi-chip module applications where extremely flat attenuation, and excellent VSWR vs. frequency are required. HMC650, HMC652, HMC653, HMC654, HMC655, HMC656 & HMC657 These wideband attenuators feature low inductance on-chip vias, and require no additional ground connections. The HMC650 through HMC658 are backside metallized with gold, and are suitable for eutectic or epoxy die attach. Each of the 9 products can be purchased individually by their respective part number or in a set of 10 each in the HMC-DK006 Fixed Attenuator Chip Designer’s Kit. HMC651, HMC658 2-2 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC650 TO HMC658 v01.0308 WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658 Electrical Specifi cations, TA = +25° C, 50 Ohm system [1] Return Loss Part Number HMC650 HMC651 HMC652 HMC653 HMC654 HMC655 HMC656 HMC657 HMC658 Attenuator Value DC - 25 Thru Line (short) Thru Line (long) 2 dB 3 dB 4 dB 6 dB 10 dB 15 dB 20 dB 20.3 19.0 22.0 23.0 20.5 16.5 16.9 20.0 17.5 ±0.2 ±0.3 ±0.2 ±0.2 ±0.2 ±0.2 ±0.1 ±0.4 ±0.5 12.4 12.3 15.3 22.1 22.4 17.0 18.8 19.7 16.2 25 - 50 ±0.8 ±0.9 ±0.6 ±0.5 ±0.5 ±0.6 ±0.7 ±1.3 ±1.6 GHz dB dB dB dB dB dB dB dB dB Attenuation Tolerance Return Loss Attenuation Tolerance Units 2 PASSIVES - CHIP 2-3 RF Data with Wire Bonds [1] Attenuation vs. Temperature HMC652, HMC653, HMC654, HMC655 0 HMC652 Attenuation vs. Temperature HMC656, HMC657, HMC658 0 -2 ATTENUATION (dB) ATTENUATION (dB) HMC653 -5 HMC656 -4 HMC654 -10 HMC657 -6 HMC655 -15 -8 -20 HMC658 -10 0 5 10 15 20 25 30 35 40 45 50 FREQUENCY (GHz) -25 0 5 10 15 20 25 30 35 40 45 50 FREQUENCY (GHz) Return Loss HMC652, HMC653, HMC654, HMC655 0 -5 RETURN LOSS (dB) -10 -15 -20 -25 -30 0 10 20 30 40 50 FREQUENCY (GHz) HMC655 HMC654 HMC653 HMC652 Return Loss HMC656, HMC657, HMC658 0 -5 RETURN LOSS (dB) -10 -15 -20 HMC657 HMC656 HMC658 -25 -30 0 10 20 30 40 50 FREQUENCY (GHz) [1] Data taken with die mounted to plate and RF probed through two 1 mil diameter wire bonds. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC650 TO HMC658 v01.0308 WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658 RF Data with Ribbon Bonds [2] 2 PASSIVES - CHIP Attenuation vs. Temperature HMC652, HMC653, HMC654, HMC655 0 HMC652 Attenuation vs. Temperature HMC656, HMC657, HMC658 0 -2 ATTENUATION (dB) HMC653 -5 ATTENUATION (dB) HMC656 -4 HMC654 -10 -6 HMC655 -15 HMC657 -8 -20 HMC658 -10 0 5 10 15 20 25 30 35 40 45 50 FREQUENCY (GHz) -25 0 5 10 15 20 25 30 35 40 45 50 FREQUENCY (GHz) Return Loss HMC652, HMC653, HMC654, HMC655 0 -5 RETURN LOSS (dB) -10 -15 -20 -25 -30 0 10 20 30 40 50 FREQUENCY (GHz) HMC655 HMC654 HMC653 HMC652 Return Loss HMC656, HMC657, HMC658 0 -5 RETURN LOSS (dB) -10 -15 -20 -25 -30 0 10 20 30 40 50 FREQUENCY (GHz) HMC658 HMC657 HMC656 [2] Data taken with die mounted to plate and RF probed through two 3 x 0.5 mil ribbon bonds. 2-4 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC650 TO HMC658 v01.0308 WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658 RF Data Die Only [3] Attenuation vs. Temperature HMC652, HMC653, HMC654, HMC655 0 HMC652 Attenuation vs. Temperature HMC656, HMC657, HMC658 0 2 PASSIVES - CHIP 2-5 -2 ATTENUATION (dB) ATTENUATION (dB) HMC653 -5 HMC656 -4 HMC654 -10 HMC657 -6 HMC655 -15 -8 -20 HMC658 -10 0 5 10 15 20 25 30 35 40 45 50 FREQUENCY (GHz) -25 0 5 10 15 20 25 30 35 40 45 50 FREQUENCY (GHz) Return Loss HMC652, HMC653, HMC654, HMC655 0 -5 RETURN LOSS (dB) -10 -15 -20 -25 -30 0 10 20 30 40 50 FREQUENCY (GHz) HMC655 HMC654 HMC653 HMC652 Return Loss HMC656, HMC657, HMC658 0 -5 RETURN LOSS (dB) -10 -15 -20 -25 -30 0 10 20 30 40 50 FREQUENCY (GHz) HMC658 HMC657 HMC656 Absolute Maximum Ratings Part Number RF Input Power (CW) DC Voltage Terminated DC Voltage Open Storage Temperature Operating Temperature HMC650 N/A N/A N/A HMC651 N/A N/A N/A HMC652 27 5.6 5.6 HMC653 26 5.2 5.1 HMC654 25 4.9 4.6 -65 to +150 -55 to +85 HMC655 26 5.2 6.0 HMC656 25 4.9 5.3 HMC657 25 4.4 4.6 HMC658 25 4.8 4.9 Units dBm V V °C °C ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS [3] Data taken with die mounted to a plate and RF probed directly on die. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC650 TO HMC658 v01.0308 WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658 Outline Drawing HMC650, HMC652, HMC653, HMC654, HMC655, HMC656 HMC657 2 PASSIVES - CHIP Die Packaging Information Standard GP-5 (Gel Pack) [2] [1] Alternate [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. NOTES: 1. ALL DIMENSIONS ARE IN INCHES (MILLIMETERS). 2. TYPICAL BOND PAD IS .004” SQUARE. 3. TYPICAL BOND PAD SPACING IS .006” CENTER TO CENTER EXCEPT AS NOTED. 4. BACKSIDE METALIZATION: GOLD 5. BACKSIDE METAL IS GROUND 6. BOND PAD METALIZATION: GOLD 7. DO NOT BOND ON TOP OF GROUND VIAS 8. OVERALL DIE SIZE ±0.002” Outline Drawing HMC651 & HMC658 2-6 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC650 TO HMC658 v01.0308 WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658 Pad Descriptions Pad Number Function Description This pad is DC coupled and matched to 50 Ohms. Use DC Blocking capacitors if the input / output signals have non-zero DC potential Interface Schematic 1, 2 RF1, RF2 2 PASSIVES - CHIP 2-7 GND Die bottom must be connected to RF ground. Assembly Diagram For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC650 TO HMC658 v01.0308 WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658 Mounting & Bonding Techniques for Millimeterwave GaAs MMICs 2 PASSIVES - CHIP The die should be attached directly to the ground plane eutectically or with conductive epoxy (see HMC general Handling, Mounting, Bonding Note). 50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the surface of the substrate. One way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should brought as close to the die as possible in order to minimize bond wire length. Typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). 0.102mm (0.004”) Thick GaAs MMIC Wire Bond 0.076mm (0.003”) RF Ground Plane 0.127mm (0.005”) Thick Alumina Thin Film Substrate Figure 1. Handling Precautions Follow these precautions to avoid permanent damage. Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: strikes. Follow ESD precautions to protect against ESD 0.150mm (0.005”) Thick Moly Tab 0.254mm (0.010”) Thick Alumina Thin Film Substrate Figure 2. 0.102mm (0.004”) Thick GaAs MMIC Wire Bond 0.076mm (0.003”) RF Ground Plane Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment. Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible