HMC670LC3C

HMC670LC3C v02.1209 13 Gbps, 1:2 Fanout Buffer Typical Applications The HMC670LC3C is ideal for: • RF ATE Applications Features Inputs Terminated Internally in 50 Ohms Differential Inputs are DC Coupled Propagation Delay: 55 ps Fast Rise and Fall Times: 24 / 22 ps Programmable Differential Output Voltage Swing: 400 - 1100 mV Power Dissipation: 240 mW 16 Lead Ceramic 3x3mm SMT Package: 9mm 2 7 HIGH SPEED LOGIC - SMT • Broadband Test & Measurement • Serial Data Transmission up to 13 Gbps • Clock Buffering up to 13 GHz Functional Diagram General Description The HMC670LC3C is a 1:2 Fanout Buffer designed to support data transmission rates up to 13 Gbps, and clock frequencies as high as 13 GHz. All differential inputs and outputs are DC coupled and terminated on chip with 50 Ohm resistors to ground. The outputs may be used in either single-ended or differential modes, and should be AC or DC coupled into 50 Ohm resistors connected to ground. The HMC670LC3C also features an output level control pin, VR which allows for loss compensation or for signal level optimization. The HMC670LC3C operates from a single -3.3V DC supply and is available in a ceramic RoHS compliant 3x3 mm SMT package. Electrical Specifi cations, TA = +25 ºC, Vee = -3.3V Parameter Power Supply Voltage Power Supply Current Maximum Data Rate Maximum Clock Rate Clock Bandwidth, 3 dB Input High Voltage Input Low Voltage Input Return Loss Output Amplitude Differential, peak-to-peak Output High Voltage Output Low Voltage 1100 -10 -570 mVpp mV mV Frequency