HMC673LC3C

HMC673LC3C v02.1209 13 Gbps, D-Type Flip-Flop Typical Applications The HMC673LC3C is ideal for: • RF ATE Applications Features Supports High Data Rates: up to 13 Gbps Differential & Singe-Ended Operation Fast Rise and Fall Times: 24 / 22 ps Low Power Consumption: 210 mW typ. Programmable Differential Output Voltage Swing: 400 - 1100 mV Propagation Delay: 55 ps Single Supply: -3.3V 16 Lead Ceramic 3x3mm SMT Package: 9mm 2 7 HIGH SPEED LOGIC - SMT • Broadband Test & Measurement • Serial Data Transmission up to 13 Gbps • Digital Logic Systems up to 13 GHz Functional Diagram General Description The HMC673LC3C is a D-type Flip Flop designed to support data transmission rates of up to 13 Gbps, and clock frequencies as high as 13 GHz. During normal operation, data is transferred to the outputs on the positive edge of the clock. Reversing the clock inputs allows for negative-edge triggered applications. All input signals to the HMC673LC3C are terminated with 50 Ohms to ground on-chip, and maybe either AC or DC coupled. The differential outputs of the HMC673LC3C may be either AC or DC coupled. Outputs can be connected directly to a 50 Ohm to ground terminated system, while DC blocking capacitors may be used if the terminating system is 50 Ohms to a non-ground DC voltage. The HMC673LC3C operates from a single -3.3V DC supply and is available in a ceramic RoHS compliant 3x3 mm SMT package. Electrical Specifi cations, TA = +25°C, Vee = -3.3V Parameter Power Supply Voltage Power Supply Current Maximum Data Rate Maximum Clock Rate Input High Voltage Input Low Voltage Input Return Loss Output Amplitude Differential, peak-to-peak Output High Voltage Output Low Voltage Output Rise / Fall Time Differential, 20% - 80% 1100 -10 -570 24 / 22 mVpp mV mV ps Frequency H H - Positive voltage level L - Negative voltage level Outputs Q L H F or price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC673LC3C v02.1209 13 Gbps, D-Type Flip-Flop Absolute Maximum Ratings Power Supply Voltage (Vee) Input Signals Output Signals -3.75V to +0.5V -2V to +0.5V -1.5V to +1V -65°C to +150°C -40°C to +85°C ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS 7 HIGH SPEED LOGIC - SMT Storage Temperature Operating Temperature Outline Drawing NOTES: 1. PACKAGE BODY MATERIAL: ALUMINA 2. LEAD AND GROUND PADDLE PLATING: 30-80 MICROINCHES GOLD OVER 50 MICROINCHES MINIMUM NICKEL. 3. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM -C6. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND. 7. GROUND PADDLE MUST BE SOLDERED TO Vee. 7 - 30 F or price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC673LC3C v02.1209 13 Gbps, D-Type Flip-Flop Pin Descriptions Pin Number 1, 4, 5, 8, 9, 12 Function GND Description Signal Grounds Interface Schematic 7 HIGH SPEED LOGIC - SMT 7 - 31 2, 3 DN, DP Data Inputs 6, 7 CP, CN Clock Inputs 10, 11 QN, QP Data Outputs 13, 16 GND Supply Ground Output level control. Output level may be adjusted by either applying a voltage to VR per “Output Differential vs. VR” plot, or by tying VR to GND with a resistor per the following equation: V0 (R) = 1.2 / (2.1 + R), R in kΩ Negative Supply 14 VR 15, Package Base Vee F or price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC673LC3C v02.1209 13 Gbps, D-Type Flip-Flop Evaluation PCB 7 HIGH SPEED LOGIC - SMT Item J1 J2 J3 J4 J5 J6 J7, J8, J12 - J14 J10 J11 Description DN DP CP CN QP QN GND VR Vee List of Materials for Evaluation PCB 118777 [1] Item J1 - J6 J7 - J14 C1 - C3 C4 - C5 R1 U1 PCB [2] Description PCB Mount SMA RF Connectors DC Pin 100 pF Capacitor, 0402 Pkg. 4.7 μF Capacitor, Tantalum 10 Ohm Resistor, 0603 Pkg. HMC673LC3C High Speed Logic, D-Type Flip-Flop 118775 Evaluation Board [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 4350 The circuit board used in the application should use RF circuit design techniques. Signal lines should have 50 Ohm impedance while the package ground leads should be connected directly to the ground plane similar to that shown. The exposed package base should be connected to Vee. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon request. 7 - 32 F or price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC673LC3C v02.1209 13 Gbps, D-Type Flip-Flop Application Circuit 7 HIGH SPEED LOGIC - SMT F or price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 7 - 33