HMC727LC3C

HMC727LC3C v03.1010 14 Gbps, FAST RISE TIME D-TYPE FLIP-FLOP Features Supports High Data Rates: up to 14 Gbps Differential or Single-Ended Operation Fast Rise and Fall Times: 19 / 17 ps Low Power Consumption: 260 mW typ. Propagation Delay: 105 ps Single Supply: -3.3 V 16 Lead Ceramic 3x3 mm SMT Package: 9 mm 2 Typical Applications The HMC727LC3C is ideal for: • 16 G Fiber Channel 3 HIGH SPEED LOGIC - SMT • RF ATE Applications • Broadband Test & Measurement • Serial Data Transmission up to 14 Gbps • Digital Logic Systems up to 14 GHz Functional Diagram General Description The HMC727LC3C is a D-Type Flip-Flop designed to support data transmission rates of up to 14 Gbps, and clock frequencies as high as 14 GHz. During normal operation, data is transferred to the outputs on the positive edge of the clock. Reversing the clock inputs allows for negative-edge triggered applications. All differential inputs to the HMC727LC3C are CML and terminated on-chip with 50 Ohms to the positive supply, GND, and may be DC or AC coupled. The differential CMl outputs are source terminated to to 50 Ohms and may also be AC or DC coupled. Outputs can be connected directly to a 50 Ohm ground-terminated system or drive devices with CML logic input. The HMC727LC3C operates from a single -3.3 V supply and is available in ROHS-compliant 3x3 mm SMT package. Electrical Specifications, TA = +25 °C, Vee = -3.3 V Parameter Power Supply Voltage Power Supply Current Maximum Data Rate Maximum Clock Rate Input Voltage Range Input Differential Range Input Return Loss Output Amplitude Output High Voltage Output Low Voltage Output Rise / Fall Time Differential, 20% - 80% Frequency H H - Positive voltage level L - Negative voltage level Outputs Q L H F or price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com 3-4 HMC727LC3C v03.1010 14 Gbps, FAST RISE TIME D-TYPE FLIP-FLOP Absolute Maximum Ratings Power Supply Voltage (Vee) Input Signals Output Signals Continuous Pdiss (T = 85 °C) (derate 17 mW/°C above 85 °C) Thermal Resistance (Rth j-p) Worst case junction to package paddle Maximum Junction Temperature Storage Temperature Operating Temperature ESD Sensitivity (HBM) -3.75 V to +0.5 V -2 V to +0.5 V -1.5 V to +1 V 0.68 W 59 °C/W 125 °C -65 °C to +150 °C -40 °C to +85 °C Class 1C 3 HIGH SPEED LOGIC - SMT ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Outline Drawing NOTES: 1. PACKAGE BODY MATERIAL: ALUMINA 2. LEAD AND GROUND PADDLE PLATING: 30-80 MICROINCHES GOLD OVER 50 MICROINCHES MINIMUM NICKEL. 3. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE. 5. PACKAGE WARP SHALL NOT EXCEED 0.05 mm DATUM -C6. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND. 7. PADDLE MUST BE SOLDERED TO GND. 3-5 F or price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com HMC727LC3C v03.1010 14 Gbps, FAST RISE TIME D-TYPE FLIP-FLOP Pin Descriptions Pin Number 1, 4, 5, 8, 9, 12 Function GND Description Signal Grounds Interface Schematic 3 HIGH SPEED LOGIC - SMT 3-6 2, 3 6, 7 DN, DP CP, CN Differential Data Inputs: Common Mode Logic (CML) referenced to positive supply. 10, 11 QN, QP Differential Data Outputs: Common Mode Logic (CML) referenced to positive supply. 13, 16 14, Package Base 15 Vee G Negative Supply GND No Connection required. This pin may be connected to RF/DC ground without affecting performance. N/C F or price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com HMC727LC3C v03.1010 14 Gbps, FAST RISE TIME D-TYPE FLIP-FLOP Evaluation PCB 3 HIGH SPEED LOGIC - SMT List of Materials for Evaluation PCB 122520 [1] Item J1 - J6 J7, J9 C1 C5 U1 PCB [2] Description PCB Mount SMA RF Connectors DC Pin 4.7 µF Capacitor, Tantalum 100 pF Capacitor, 0402 Pkg. HMC727LC3C High Speed Logic, D-Type Flip-Flop 122518 Evaluation Board [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Arlon 25FR or Rogers 4350 The circuit board used in the application should use RF circuit design techniques. Signal lines should have 50 Ohm impedance while the package ground leads should be connected directly to the ground plane similar to that shown. The exposed package base should be connected to GND. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon request. 3-7 F or price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com HMC727LC3C v03.1010 14 Gbps, FAST RISE TIME D-TYPE FLIP-FLOP Application Circuit 3 HIGH SPEED LOGIC - SMT F or price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com 3-8