HMC757_10

HMC757 v00.0409 GaAs pHEMT MMIC 1/2 WATT POWER AMPLIFIER, 16 - 24 GHz Features saturated output power: +30 dBm @ 30% pAe high output ip3: +37 dBm high Gain: 22 dB DC supply: +7V @ 395mA 50 ohm matched input/output Die size: 2.4 x 0.9 x 0.1 mm Typical Applications The hmC757 is ideal for: • point-to-point radios 3 Amplifiers - lineAr & power - Chip • point-to-multi-point radios • VsAT • military & space Functional Diagram General Description The hmC757 is a three stage GaAs phemT mmiC 1/2 watt power Amplifier which operates between 16 and 24 Ghz. The hmC757 provides 22 dB of gain, and +30 dBm of saturated output power at 30% pAe from a +7V supply. The rf i/os are DC blocked and matched to 50 ohms for ease of integration into multiChip-modules (mCms). All data is taken with the chip in a 50 ohm test fixture connected via 0.025 mm (1 mil) diameter wire bonds of length 0.31 mm (12 mils). Electrical Specifications, TA = +25° C, Vdd = +7V, Idd = 395mA[1] parameter frequency range Gain Gain Variation over Temperature input return loss output return loss output power for 1 dB Compression (p1dB) saturated output power (psat) output Third order intercept Total supply Current (idd) [1] Adjust Vgg between -2 to 0V to achieve idd= 395mA typical. [2] measurement taken at +7V @ 395mA, pout / Tone = +17 dBm (ip3)[2] 27 19 min. Typ. 16 - 20 22 0.028 10 15 29 30 38 395 27 21 max. min. Typ. 20 - 24 24 0.032 12 13 29.5 30 36 395 max. Units Ghz dB dB/ °C dB dB dBm dBm dBm mA 3-1 For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com HMC757 v00.0409 GaAs pHEMT MMIC 1/2 WATT POWER AMPLIFIER, 16 - 24 GHz Gain vs. Temperature 30 Broadband Gain & Return Loss vs. Frequency 30 20 26 RESPONSE (dB) 10 0 -10 18 -20 -30 12 14 16 18 20 22 FREQUENCY (GHz) 24 26 28 14 16 18 20 FREQUENCY (GHz) 22 24 GAIN (dB) S21 S11 S22 22 3 +25C +85C -55C Input Return Loss vs. Temperature 0 +25C +85C -55C Output Return Loss vs. Temperature 0 -4 RETURN LOSS (dB) -8 -12 -16 -20 -24 +25C +85C -55C -4 RETURN LOSS (dB) -8 -12 -16 -20 16 18 20 FREQUENCY (GHz) 22 24 16 18 20 FREQUENCY (GHz) 22 24 P1dB vs. Temperature 33 Psat vs. Temperature 35 31 P1dB (dBm) Psat (dBm) 33 29 31 27 +25C +85C -55C 29 +25C +85C -55C 25 27 23 16 18 20 FREQUENCY (GHz) 22 24 25 16 18 20 FREQUENCY (GHz) 22 24 For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com 3-2 Amplifiers - lineAr & power - Chip HMC757 v00.0409 GaAs pHEMT MMIC 1/2 WATT POWER AMPLIFIER, 16 - 24 GHz Psat vs. Current 33 P1dB vs. Current 33 P1dB (dBm) 29 Psat (dBm) 360mA 395mA 420mA 3 Amplifiers - lineAr & power - Chip 31 31 29 27 27 360mA 395mA 420mA 25 25 23 16 18 20 FREQUENCY (GHz) 22 24 23 16 18 20 FREQUENCY (GHz) 22 24 Output IP3 vs. Temperature, Pout/Tone = +17 dBm 45 Output IP3 vs. Supply Current, Pout/Tone = +17 dBm 45 40 IP3 (dBm) IP3 (dBm) +25C +85C -55C 40 35 35 30 30 360mA 395mA 420mA 25 16 18 20 FREQUENCY (GHz) 22 24 25 16 18 20 FREQUENCY (GHz) 22 24 Output IP3 vs. Supply Voltage, Pout/Tone = +17 dBm 45 Output IM3 80 70 40 IP3 (dBm) IM3(dBc) 60 50 40 30 20 10 16GHz 18GHz 20GHz 22GHz 24GHz 35 6.5V 7.0V 7.5V 30 25 16 18 20 FREQUENCY (GHz) 22 24 0 5 7 9 11 13 15 17 19 21 23 Pout/TONE (dBm) 3-3 For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com HMC757 v00.0409 GaAs pHEMT MMIC 1/2 WATT POWER AMPLIFIER, 16 - 24 GHz Reverse Isolation vs. Temperature 0 REVERSE ISOLATION (dB) -10 -20 -30 -40 -50 -60 +25C +85C -55C Power Compression @ 20 GHz 35 Pout (dBm), GAIN (dB), PAE (%) 30 25 20 15 10 5 0 -18 Pout Gain PAE 3 22 24 26 -13 -8 -3 2 7 12 14 16 18 20 INPUT POWER (dBm) FREQUENCY (GHz) Gain & Power vs. Supply Current @ 20 GHz 35 Gain(dB), P1dB(dBm), Psat(dBm) Gain & Power vs. Supply Voltage @ 20 GHz 35 Gain(dB), P1dB(dBm), Psat(dBm) 30 30 25 25 20 Gain (dB) P1dB (dBm) Psat (dBm) 20 Gain (dB) P1dB (dBm) Psat (dBm) 15 15 10 360 370 380 390 Idd (V) 400 410 420 10 5.5 6 6.5 Vdd (V) 7 7.5 Power Dissipation 3 POWER DISSIPATION (W) 2.8 2.6 2.4 2.2 16GHz 18GHz 20GHz 22GHz 24GHz 2 -18 -14 -10 -6 -2 2 6 10 INPUT POWER (dBm) For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com 3-4 Amplifiers - lineAr & power - Chip HMC757 v00.0409 GaAs pHEMT MMIC 1/2 WATT POWER AMPLIFIER, 16 - 24 GHz Typical Supply Current vs. Vdd Vdd (V) +6.5 +7.0 +7.5 idd (mA) 375 395 411 Absolute Maximum Ratings Drain Bias Voltage (Vdd) rf input power (rfin) 8V +26 dBm 150 °C 2.8 w 23.4 °C/w -65 to +150 °C -55 to +85 °C 3 Amplifiers - lineAr & power - Chip Junction Temperature Continuous pdiss (T= 85 °C) (derate 43 mw/°C above 85 °C) Thermal resistance (junction to die bottom) storage Temperature operating Temperature Note: Amplifier will operate over full voltage ranges shown above Vgg adjusted to achieve Idd = 395mA at +7V eleCTrosTATiC sensiTiVe DeViCe oBserVe hAnDlinG preCAUTions Outline Drawing Die Packaging Information standard Gp-2 (Gel pack) [1] Alternate [2] [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. noTes: 1. All Dimensions Are in inChes [mm] 2. Die ThiCKness is .004” 3. TYpiCAl BonD pAD is .004” sQUAre 4. BACKsiDe meTAlliZATion: GolD 5. BonD pAD meTAlliZATion: GolD 6. BACKsiDe meTAl is GroUnD. 7. ConneCTion noT reQUireD for UnlABeleD BonD pADs. 8. oVerAll Die siZe ± .002 3-5 For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com HMC757 v00.0409 GaAs pHEMT MMIC 1/2 WATT POWER AMPLIFIER, 16 - 24 GHz Pad Descriptions pad number 1 function rfin Description This pad is AC coupled and matched to 50 ohms. interface schematic 2 Vgg Gate control for pA. Adjust Vgg to achieve recommended bias current. external bypass caps 100pf, 0.1uf and 4.7uf are required. 3 Amplifiers - lineAr & power - Chip 3-6 3 Vdd Drain bias for amplifier. external bypass caps 100pf, 0.1uf and 4.7uf are required 4 rfoUT This pad is AC coupled and matched to 50 ohms. For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com HMC757 v00.0409 GaAs pHEMT MMIC 1/2 WATT POWER AMPLIFIER, 16 - 24 GHz Assembly Diagram 3 Amplifiers - lineAr & power - Chip 3-7 For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com HMC757 v00.0409 GaAs pHEMT MMIC 1/2 WATT POWER AMPLIFIER, 16 - 24 GHz Mounting & Bonding Techniques for Millimeterwave GaAs MMICs The die should be attached directly to the ground plane eutectically or with conductive epoxy (see hmC general handling, mounting, Bonding note). 50 ohm microstrip transmission lines on 0.127mm (5 mil) thick alumina thin film substrates are recommended for bringing rf to and from the chip (figure 1). if 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the surface of the substrate. one way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (figure 2). microstrip substrates should be located as close to the die as possible in order to minimize bond wire length. Typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). 0.102mm (0.004”) Thick GaAs MMIC Wire Bond 0.076mm (0.003”) 3 Amplifiers - lineAr & power - Chip 3-8 RF Ground Plane 0.127mm (0.005”) Thick Alumina Thin Film Substrate Figure 1. Handling Precautions Follow these precautions to avoid permanent damage. Storage: All bare die are placed in either waffle or Gel based esD protective containers, and then sealed in an esD protective bag for shipment. once the sealed esD protective bag has been opened, all die should be stored in a dry nitrogen environment. Cleanliness: handle the chips in a clean environment. Do noT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: follow esD precautions to protect against > ± 250V esD strikes. Transients: suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pickup. 0.102mm (0.004”) Thick GaAs MMIC 0.076mm (0.003”) Wire Bond RF Ground Plane 0.150mm (0.005”) Thick Moly Tab 0.254mm (0.010”) Thick Alumina Thin Film Substrate Figure 2. General Handling: handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip may have fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting The chip is back-metallized and can be die mounted with Ausn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool temperature of 265 °C. when hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. Do noT expose the chip to a temperature greater than 320 °C for more than 20 seconds. no more than 3 seconds of scrubbing should be required for attachment. epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible