HMC913

HMC913 v01.0810 SUCCESSIVE DETECTION LOG VIDEO AMPLIFIER (SDLVA), 0.6 - 20 GHz Typical Applications The HMC913 is ideal for: • EW, ELINT & IFM Receivers • DF Radar Systems • ECM Systems • Broadband Test & Measurement • Power Measurement & Control Circuits • Military & Space Applications Features High Logging Range: 59 dB (-54 to +5 dBm) @ 18 GHz Output Frequency Flatness: ±1.5 dB Log Linearity: ±1 dB Fast Rise/Fall Times: 5/10 ns Single Positive Supply: +3.3V ESD Sensitivity (HBM): Class 1A 5 SDLVAs - CHIP Functional Diagram General Description The HMC913 is a Successive Detection Log Video Amplifier (SDLVA) which operates from 0.6 to 20 GHz. The HMC913 provides a logging range of 59 dB. This device offers typical fast rise/fall times of 5/10 ns and a superior delay time of only 14 ns. The HMC913 log video output slope is typically 14 mV/dB. Maximum recovery times are less than 30 ns. Ideal for high speed channelized receiver applications, the HMC913 operates from a single +3.3 V supply, and consumes only 80 mA. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes. Electrical Specifications, TA = +25 °C, Vcc1 = Vcc2 = 3.3V [1] Parameter Input Frequency Range [1] Frequency Flatness Log Linearity Log Linearity over Temperature (-55 °C to +85 °C) Minimum Logging Range Maximum Logging Range Input Return Loss Log Video Minimum Output Voltage Log Video Maximum Output Voltage Log Video Output Rise Time Log Video Output Fall Time Log Video Recovery Time Log Video Output Slope Log Video Output Slope Variation over Temperature Log Video Propagation Delay Supply Current (Icc1 + Icc2) [1] Electrical specs and performance plots are given for single-ended operation @ Pin = -30 dBm @ 10 GHz 10% to 90% 90% to 10% Pin = -25 dBm Pin = -50 to +3 dBm Pin = -25 dBm to ±3 dB error @ 18 GHz to ±3 dB error @ 18 GHz Conditions Typ. 0.6 - 20 ±1.5 ±1 ±1.5 -54 @ 18 GHz +5 @ 18 GHz 5.5 1 1.8 5 10 25 14 5 14 80 Units GHz dB dB dB dBm dBm dB V V ns ns ns mV/dB µV/dB°C ns mA 5-1 For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com HMC913 v01.0810 SUCCESSIVE DETECTION LOG VIDEO AMPLIFIER (SDLVA), 0.6 - 20 GHz VIDEO OUT & Error vs. Input Power, Fin = 500 MHz [1] 2 3 ERR +25C ERR +85C ERR -55C Error Flatness vs. Input Power Over Frequency [1][2] 6 5 4 3 ERROR (dB) 2 1 0 -1 -2 -3 -4 -5 -6 -70 -60 -50 -40 -30 -20 -10 0 10 20 INPUT POWER (dBm) 2 GHz 6 GHz 10 GHz 14 GHz 18 GHz 20 GHz 2 1 ERROR (dB) 0 VIDEO OUT (V) 1.5 1 Ideal Video Out +25C Video Out +85C Video Out -55C -1 -2 -3 -60 -50 -40 -30 -20 -10 0 10 20 INPUT POWER (dBm) 0.5 -70 5 SDLVAs - CHIP 5-2 VIDEO OUT & Error vs. Input Power, Fin = 1 GHz [1] 2 ERR +25C ERR +85C ERR -55C VIDEO OUT & Error vs. Input Power, Fin = 2 GHz [1] 3 2 VIDEO OUT (V) 1 ERROR (dB) 0 1.5 2 ERR +25C ERR +85C ERR -55C 3 2 1 ERROR (dB) 0 VIDEO OUT (V) 1.5 1 Ideal Video Out +25C Video Out +85C Video Out -55C -1 -2 -3 -60 -50 -40 -30 -20 -10 0 10 20 INPUT POWER (dBm) 1 Ideal Video Out +25C Video Out +85C Video Out -55C -1 -2 -3 -60 -50 -40 -30 -20 -10 0 10 20 INPUT POWER (dBm) 0.5 -70 0.5 -70 VIDEO OUT & Error vs. Input Power, Fin = 6 GHz [1] 2 ERR +25C ERR +85C ERR -55C VIDEO OUT & Error vs. Input Power, Fin = 10 GHz [1] 3 2 VIDEO OUT (V) 1 ERROR (dB) 0 1.5 2 ERR +25C ERR +85C ERR -55C 3 2 1 ERROR (dB) 0 VIDEO OUT (V) 1.5 1 Ideal Video Out +25C Video Out +85C Video Out -55C -1 -2 -3 -60 -50 -40 -30 -20 -10 0 10 20 INPUT POWER (dBm) 1 Ideal Video Out +25C Video Out +85C Video Out -55C -1 -2 -3 -60 -50 -40 -30 -20 -10 0 10 20 INPUT POWER (dBm) 0.5 -70 0.5 -70 [1] Electrical specs and performance plots are given for single-ended operation [2] An average ideal line is used to calculate error curves. For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com HMC913 v01.0810 SUCCESSIVE DETECTION LOG VIDEO AMPLIFIER (SDLVA), 0.6 - 20 GHz VIDEO OUT vs. Error vs. Input Power, Fin = 18 GHz [1] 3 2 ERR +25C ERR +85C ERR -55C VIDEO OUT & Error vs. Input Power, Fin = 14 GHz [1] 2 ERR +25C ERR +85C ERR -55C 3 2 1 ERROR (dB) 0 2 VIDEO OUT (V) 1 ERROR (dB) 0 1.5 VIDEO OUT (V) 1.5 1 Ideal Video Out +25C Video Out +85C Video Out -55C -1 -2 -3 -60 -50 -40 -30 -20 -10 0 10 20 INPUT POWER (dBm) 1 Ideal Video Out +25C Video Out +85C Video Out -55C -1 -2 -3 20 5 SDLVAs - CHIP 0.5 -70 0.5 -70 -60 -50 -40 -30 -20 -10 0 10 INPUT POWER (dBm) VIDEO OUT & Error vs. Input Power, Fin = 20 GHz [1] 2 ERR +25C ERR +85C ERR -55C 3 2 1 ERROR (dB) 0 VIDEO OUT (V) 1.5 1 Ideal Video Out +25C Video Out +85C Video Out -55C -1 -2 -3 -60 -50 -40 -30 -20 -10 0 10 20 INPUT POWER (dBm) 0.5 -70 VIDEO OUT vs. Frequency Over Input Power & Temperature [1] 1.8 1.7 1.6 VIDEO OUT (V) 1.5 1.4 1.3 1.2 1.1 1 0 2 4 6 8 10 12 14 16 18 20 22 -40 dBm -25 dBm -10 dBm +25C +85C -55C VIDEO OUT vs. Frequency Over Input Power & Bias Voltage [1] 1.8 1.7 1.6 VIDEO OUT (V) 1.5 1.4 1.3 1.2 1.1 1 0 2 4 6 8 10 12 14 16 18 20 22 -40 dBm -25 dBm -10 dBm 3.15V 3.30V 3.45V FREQUENCY (GHz) FREQUENCY (GHz) [1] Electrical specs and performance plots are given for single-ended operation 5-3 For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com HMC913 v01.0810 SUCCESSIVE DETECTION LOG VIDEO AMPLIFIER (SDLVA), 0.6 - 20 GHz Fall Time for Various Frequencies @ 0 dBm [1] 1.8 Rise Time for Various Frequencies @ 0 dBm [1] 1.8 1.6 VIDEO OUT (V) VIDEO OUT (V) 1.6 1.4 2 GHz 10 GHz 18 GHz 1.4 1.2 1.2 2 GHz 10 GHz 18 GHz 1 1 0.8 0 20 40 60 TIME (ns) 80 100 0.8 0 20 40 60 TIME (ns) 80 100 5 SDLVAs - CHIP 5-4 Input Return Loss vs. Frequency [1] 0 RETURN LOSS (dB) -5 -10 -15 -20 0 5 10 15 20 25 30 FREQUENCY (GHz) [1] Electrical specs and performance plots are given for single-ended operation For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com HMC913 v01.0810 SUCCESSIVE DETECTION LOG VIDEO AMPLIFIER (SDLVA), 0.6 - 20 GHz Die Packaging Information Standard WP-3 (Waffle Pack) Absolute Maximum Ratings Vcc ENBL RF Input Power Channel Temperature Continuous Pdiss (T=85°C) Derate 12.63 mW/°C above 85°C Thermal Resistance Rth (Junction to die bottom) +3.6V +3.6V +15 dBm 125 °C 0.51 W 79.2 °C/W -65 to +150 °C -55 to +85 °C Class 1A [1] Alternate [2] [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. NOTES: 1. ALL DIMENSIONS IN INCHES [MILLIMETERS] 2. DIE THICKNESS IS 0.011 (0.279) 3. TYPICAL BOND PAD IS 0.0024 SQUARE 4. BOND PAD METALLIZATION: ALUMINUM 5. NO BACKSIDE METAL 6. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS 7. OVERALL DIE SIZE IS ±.002 5 SDLVAs - CHIP Storage Temperature Operating Temperature ESD Sensitivity (HBM) ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Outline Drawing 5-5 For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com HMC913 v01.0810 SUCCESSIVE DETECTION LOG VIDEO AMPLIFIER (SDLVA), 0.6 - 20 GHz Pad Descriptions Pad Number Function Description Interface Schematic 1-5 VCC1 Bias Supply. Connect Supply Voltage to these pins with appropriate filtering. 5 SDLVAs - CHIP 5-6 6 VCC2 Bias Supply. Connect supply voltage to these pins with appropriate filtering. 7 EN Enable pin connected to VCC1 or VCC2 for normal operation. Total supply current reduced to less than 3mA when EN is set to 0V. 8, 11 - 18, 21, 22 Die Bottom GND These pins and the die bottom must be connected to a high quality RF/DC ground. 9, 10 VIDEO OUT, VIDEO FB Video out and feedback. For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com HMC913 v01.0810 SUCCESSIVE DETECTION LOG VIDEO AMPLIFIER (SDLVA), 0.6 - 20 GHz Pad Descriptions (Continued) Pad Number Function Description Interface Schematic 19, 20 RFINN, RFINP RF Input pins Connect RF to RFINP and AC couple RFINN to ground via 50 Ohm for single ended operation. 5 SDLVAs - CHIP 5-7 Application Circuit For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com HMC913 v01.0810 SUCCESSIVE DETECTION LOG VIDEO AMPLIFIER (SDLVA), 0.6 - 20 GHz Assembly Diagram 5 SDLVAs - CHIP List of Materials for Assembly Diagram Item C1, C2 C3 - C6 C7 - C8 R1 U1 Description 33 pF Capacitor, 0402 Pkg. 100 pF SLC Capacitor, SA1212BX101M16VHXF 10 nF SLC Capacitor, MVB3030X103ZGH5N 50 Ohm Resistor, 0402 Pkg. HMC913 Die ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com 5-8 HMC913 v01.0810 SUCCESSIVE DETECTION LOG VIDEO AMPLIFIER (SDLVA), 0.6 - 20 GHz Mounting & Bonding Techniques for MMICs The die should be attached directly to the ground plane with epoxy (see HMC general Handling, Mounting , Bonding Note). 50 Ohm Microstrip transmission lines on 0.254mm (10 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). Microstrip substrates should be placed as close to the die as possible in order to minimize bond wire length. Typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). 0.279mm (0.011”) Thick MMIC Wire Bond 0.076mm (0.003”) Handling Precautions RF Ground Plane 5 SDLVAs - CHIP Follow these precautions to avoid permanent damage. Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: Follow ESD precautions to protect against ESD strikes. Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. General Handling: The chip may be handled by a vacuum collet or with a sharp pair of tweezers. 0.254mm (0.010”) Thick Alumina Thin Film Substrate Figure 1. Mounting Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. 5-9 For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com HMC913 v01.0810 SUCCESSIVE DETECTION LOG VIDEO AMPLIFIER (SDLVA), 0.6 - 20 GHz Notes: 5 SDLVAs - CHIP For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com 5 - 10