BS801C

BS801C/02C/04C/06C/08C Touch Key Features · Operating voltage: 2.2V~5.5V · Ultra low current: 3.0mA at 3V · Auto-calibration · High reliability touch detections · High PSRR · Output type: Level-hold or Toggle · One-key or Any-key State · Key State Mode set by pins or serial command · Open drain NMOS output · Key status monitored using pins or serial bus General Description The BS801C/02C/04C/06C/08C are a range of 1 to 8 key touch key devices which can detect human body contact using external touch pads. The high level of device integration enable applications to be implemented with a minimum number of external components. The BS804C and BS808C are equipped with a One-line serial interface to allow easy communication with an external MCU for device setup and for touch pin monitoring purposes. Special internal circuitry is also employed to ensure excellent power noise rejection to reduce the possibility of false detections, increasing the touch switch application reliability under adverse environmental conditions. With auto-calibration, low operating current and a low power one-key operating state, this range of touch key devices provides a simple and effective means of implementing touch switches in a wide variety of applications. Selection Table Operating Current at 3V Part. No. Touch Keys One-Key State 3.0mA ¾ Any-key State ¾ 5.0mA Key Output Type Level-Hold or Toggle Level-Hold or Toggle ¾ BS804C 4-Key 3.0mA 3.0mA 3.0mA 8.0mA 14.0mA 18.0mA Level-Hold or Toggle Level-Hold ¾ Level-Hold Package Serial Interface ¾ ¾ Auto Calibration BS801C BS802C 1-Key 2-Key SOT23-6 8SOP 8SOP 16NSOP 16NSOP 16NSOP 20SOP/SSOP Ö ¾ Ö ¾ Ö BS806C BS808C 6-Key 8-Key Rev. 1.00 1 December 2, 2009 BS801C/02C/04C/06C/08C Pin Assignment K ey0 1 2 3 4 5 6 7 8 B S804C 1 6 N S O P -A K ey1 LH F 6 VDD 5 C re f 4 T o p V ie w 1 2 3 K ey0 1 8 2 7 3 6 4 5 B S802C 8 S O P -A K o u t1 K o u t0 VSS C re f K ey1 VDD LHF K ey1 1 8 2 7 3 6 4 5 B S804C 8 S O P -A K ey2 K ey3 C re f K ey0 SCD VDD VSS K ey2 K ey3 C re f VSS NC NC 16 15 14 13 12 11 10 9 K o u t0 K o u t1 K o u t2 K o u t3 SCD VDD OKW LHF Kout VSS Key B S801C S O T 2 3 -6 -A K ey0 1 2 3 4 5 6 7 8 9 K ey1 K ey0 1 2 3 4 5 6 7 8 B S806C 1 6 N S O P -A K ey1 K ey2 K ey3 K ey4 K ey5 C re f VSS 16 15 14 13 12 11 10 9 K o u t0 K o u t1 K o u t2 K o u t3 K o u t4 K o u t5 VDD OKW K ey0 1 2 3 4 5 6 7 8 B S808C 1 6 N S O P -A K ey1 K ey4 K ey5 K ey6 K ey7 C re f NC 16 15 14 13 12 11 10 9 K ey2 K ey3 NC NC NC SCD VDD VSS K ey2 K ey3 K ey4 K ey5 K ey6 K ey7 C re f VSS 20 19 18 17 16 15 14 13 12 10 11 K o u t0 K o u t1 K o u t2 K o u t3 K o u t4 K o u t5 K o u t6 K o u t7 VDD OKW B S808C 2 0 S O P -A /S S O P -A Pin Description The pins in the following table are common to all devices. Pin Name Key0~Keyn Kout0~Koutn Cref VSS VDD I/O Input Output Touch key n output pin. Input ¾ ¾ Touch key reference capacitor input - value range of 0pF to 10pF - higher capacitance values result in higher sensitivities. Negative power supply, ground Positive power supply Description Touch key n input. These pins are connected to the external touch key. The following table shows device specific pins. Pin Name I/O Device Description Selects One-key State or Any-key State. Pin condition is read during power-up. The logic status of this pin must not be changed after power-on. After power-on this pin¢s function can be overridden by a serial command on relevant devices. Pin connected to an internal pull-high resistor. Internal circuitry ensures that this pull high resistor will not consume current even if the input is low. Open: One-key State using key0 only Low: Any-Key State Serial bus pin used to communicate with an external MCU. The external MCU can read the BS804C or BS808C touch key status and also send commands to the device via this pin. Selects Key Output Type Pin condition is read during power-up. The logic status of this pin must not be changed after power-on. After power-on this pin¢s function can be overridden by a serial command on relevant devices. Pin connected to an internal pull-high resistor. Internal circuitry ensures that this pull high resistor will not consume current even if the input is low. Open: Level-Hold output Low: Toggle output OKW Input BS804C BS806C BS808C SCD Input/ Output BS804C BS808C LHF Input BS801C BS802C BS804C Note: It is important that the logic level of the OKW and LHF pins do not change state after power-on. 2 December 2, 2009 Rev. 1.00 BS801C/02C/04C/06C/08C Absolute Maximum Ratings Supply Voltage ..........................VSS-0.3V to VSS+6.0V Input Voltage .............................VSS-0.3V to VDD+0.3V IOL Total ................................................................80mA Total Power Dissipation .....................................500mW Storage Temperature ...........................-50°C to 125°C Operating Temperature ..........................-40°C to 85°C IOH Total..............................................................-80mA Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. D.C. Characteristics BS801C Test Conditions Symbol VDD IDD VIH VIL IOL RPH BS802C Test Conditions Symbol VDD IDD VIH VIL IOL RPH Parameter VDD Operating Voltage Operating Current Input High Voltage Input Low Voltage Sink Current Pull-high Resistance ¾ 3V ¾ ¾ 3V 3V No load ¾ ¾ VOL=0.1VDD ¾ Conditions ¾ 2.2 ¾ 0.7VDD 0 4 20 ¾ 5 ¾ ¾ 8 60 5.5 10 VDD 0.3VDD ¾ 100 V mA V V mA kW Min. Typ. Max. Unit Parameter VDD Operating Voltage Operating Current Input High Voltage Input Low Voltage Sink Current Pull-high Resistance ¾ 3V ¾ ¾ 3V 3V No load ¾ ¾ VOL=0.1VDD ¾ Conditions ¾ 2.2 ¾ 0.7VDD 0 4 20 ¾ 3 ¾ ¾ 8 60 5.5 6 VDD 0.3VDD ¾ 100 V mA V V mA kW Ta=25°C Min. Typ. Max. Unit Ta=25°C Rev. 1.00 3 December 2, 2009 BS801C/02C/04C/06C/08C BS804C Symbol VDD IDD1 IDD2 VIH VIL IOL RPH BS806C Symbol VDD IDD1 IDD2 VIH VIL IOL RPH BS808C Symbol VDD IDD1 IDD2 VIH VIL IOL RPH Parameter Operating Voltage Operating Current One-key State Operating Current Any-Key State Input High Voltage Input Low Voltage Sink Current Pull-high Resistance Test Conditions VDD ¾ 3V 3V ¾ ¾ 3V 3V No load No load ¾ ¾ VOL=0.1VDD ¾ 0.7VDD 0 4 20 Conditions ¾ Min. 2.2 ¾ Typ. ¾ 3.0 18.0 ¾ ¾ 8 60 Max. 5.5 6.0 36.0 VDD 0.3VDD ¾ 100 Parameter Operating Voltage Operating Current One-key State Operating Current Any-Key State Input High Voltage Input Low Voltage Sink Current Pull-high Resistance Test Conditions VDD ¾ 3V 3V ¾ ¾ 3V 3V No load No load ¾ ¾ VOL=0.1VDD ¾ 0.7VDD 0 4 20 Conditions ¾ Min. 2.2 ¾ Typ. ¾ 3.0 14.0 ¾ ¾ 8 60 Max. 5.5 6.0 28.0 VDD 0.3VDD ¾ 100 Parameter Operating Voltage Operating Current One-key State Operating Current Any-Key State Input High Voltage Input Low Voltage Sink Current Pull-high Resistance Test Conditions VDD ¾ 3V 3V ¾ ¾ 3V 3V No load No load ¾ ¾ VOL=0.1VDD ¾ 0.7VDD 0 4 20 Conditions ¾ Min. 2.2 ¾ Typ. ¾ 3.0 8.0 ¾ ¾ 8 60 Max. 5.5 6.0 16.0 VDD 0.3VDD ¾ 100 Ta=25°C Unit V mA mA V V mA kW Ta=25°C Unit V mA mA V V mA kW Ta=25°C Unit V mA mA V V mA kW Rev. 1.00 4 December 2, 2009 BS801C/02C/04C/06C/08C A.C. Characteristics Test Conditions Symbol fSCD fKRT tKH tCAL Parameter VDD SCD Clock Key Response Time Maximum Key Hold Time Auto-Calibration Period 3V 3V 3V 3V Conditions ¾ ¾ ¾ ¾ 10.4 75 30 1.8 13.0 100 40 2.5 15.6 125 50 3.2 kHz ms s s Min. Typ. Max. Unit Ta=25°C Functional Description Introduction This range of BS80xC touch key devices offer an easy and reliable means of implementing touch switch functions in a range of applications. A single external capacitor is the only external component required for most applications while a single line serial bus offers convenient communication with an external MCU. Device Operation State There are two operating states known as the One-key State and the Any-key State. Devices with an OKW pin, namely the BS804C, BS806C and BS808C, can operate in either the One-key State or the Any-key State. When these devices are powered up, the condition of the OKW pin will be automatically read. If the OKW pin is low then the device will enter the Any-key State and if the pin is floating the device will enter the One-key State. As the BS801C and BS802C devices do not have an OKW pin they will always operate in the Any-key State. In the Any-key State, as the name suggests all of the Keyn touch inputs will be active, however in the One-key State only Key0 will be active. After power up if the BS804C, BS806C and BS808C device enters the One-key State then touching any Key other than Key0 will have no effect. If a touch action is however detected on Key0, then the device will enter the Any-key State and operate normally with all keys active. However, within a timer period of around 20 seconds, if no touch actions are detected on any Key input, then the device will revert to the One-key State. The advantage of choosing the One-key State over the Any-key State is that it will result in lower power consumption as only one key remains active. The logic status of the OKW pin is only read when the device powers up and will determine the operating state of the device after power-on. For the BS804C and BS808C devices, this power-on state can be overridden later by sending the appropriate command to the device on its SCD pin. The logic level on the OKW pin must not be changed after power on. Internal circuitry ensures that the internal pull-high resistor on the OKW pin will not consume current after power-on. Part No. BS804C BS806C BS808C OKW Open One-key State OKW Low Any-key State The logic status of the OKW pin is read when the device powers up. The logic level on this pin must not be changed after power on. Internal circuitry ensures that the internal pull-high resistor on the OKW pin will not consume current. Part No. BS804C BS806C BS808C Any-key On Time in One-key State Approx 20 secs Rev. 1.00 5 December 2, 2009 BS801C/02C/04C/06C/08C Touch Key Outputs All Kout pins have NMOS structures to allow easy interfacing to external devices with different operating voltages. The BS801C, BS802 and BS804C devices can have their outputs configured to operate with either Level-Hold or Toggle type. The output type is determined by the status of the LHF pin which is read during power-on. The logic level on this pin must not be changed after power on. Internal circuitry ensures that the internal pull-high resistor on the LHF pin will not consume current. The BS806C and BS808C only have Level-Hold output types. Part No. BS801C BS802C BS804C BS806C BS808C LHF Open Low ¾ Kout Type Level-Hold Toggle Level-Hold mands to the touch key device. The serial interface allows three functions to be implemented, two are initiated by the external MCU and one by the BS80xC. SCD Command Wake-up or Interrupt MCU Read Touch Key Status Send command to BS804C/BS808C Direction BS804C/BS808C ® MCU Step1: MCU send command MCU ® BS804C/BS808C Step2: MCU read key status BS804C/BS808C ® MCU MCU ® BS804C/BS808C SCD Function Summary · BS804C/BS808C Wakes-up or Interrupts MCU Serial Interface - SCD Both the BS804C and BS808C are equipped with a single line serial interface on the SCD pin, allowing for easy interfacing to an external MCU. This single line interface allows communication in both directions between the touch key device and the external MCU. Using this interface, the external MCU can serially read the status of the touch keys at any time. The Serial interface also allows the external MCU to send com- When any of the touch keys change state, a pulse will be generated by the BS804C/BS808C device which can be used to wake up or to interrupt an external MCU. The MCU must ensure that its pin connected to the SCD pin is setup as an input to receive this pulse. The pulse width generated by the device is equal to a tSCD/2 period where tSCD is about 76ms. tS O /P CD /2 IN T or I/O B S804C B S808C SCD I/P MCU Wake-up/Interrupt Pulse to MCU PowerO n O n e -K e y S ta te Y OKW O pen ? OKW N lo w A n y -K e y S ta te K ey0 O n ? N R e tu rn to O n e -K e y S ta te A n y -K e y On? Y E n a b le K e y n O u tp u t N E n a b le K e y 0 O u tp u t Y A n y -K e y o n w ith in 2 0 s e c . ? N Y E n a b le K e y n O u tp u t BS804C, BS806C and BS808C Operating Flow Rev. 1.00 6 December 2, 2009 BS801C/02C/04C/06C/08C · MCU reads the touch key status The MCU can send a command to the BS804C/ BS808C device to request the touch key status. The protocol for reading the touch key status is as follows: ¨ command from the MCU. Any command sent to the device from the MCU will override the original power on configuration setup. N u m b e r o f p u ls e s w ith in 4 tS C D s e ts o p e r a tin g m o d e S C D L in e fro m M C U 1 TA N o te : T A > 8 tS CD The external MCU takes control of the SCD line and first sends three rising edge pulses or more to the BS804C/BS808C within a time of about 152ms. The MCU then changes its I/O pin to an input. The BS804C/BS808C device will then pull the SCD line low, then high, the timings are given by synchronise period. This allows the MCU to synchronise itself for the data transfer. The BS804C/BS808C device will then transmit its key status, given by D0~Dn - ¨ ¨ 2 n 4 tS P e r io d s CD SCD Device Setup The desired Operating Mode to be setup depends upon the number of pulses received by BS804C/ BS808C within a time period, 4 tSCD, as shown in the table. After the programming clock cycles have been transmitted and the SCD line returns high, the device will return to normal operation. Clock Pulses 0~2 3~6 7~10 11~14 >15 Operating Mode Set by external pin For test purposes One-Key state For test purposes Any-Key state BS804C and BS808C SCD Commands Note that the MCU must transmits these pulses within 4 tSCD. Maximum Key On Duration Time To minimise the possibility of unintentional switch detections, such as undesired objects covering the sense electrodes, the devices includes a Maximum Key-On duration time function. To implement this function the devices include an internal timer, which starts running after each switch detection. If the key on time of a touch key exceeds a value of about 40 seconds, then the device will be reset to its power-on condition and initiate a new auto calibration. The output will then remain inactive until the next switch detection. Auto-calibration Function ¨ For the BS804C, the data format is D0~D3. For the BS808C, the data format is D0~D7. ¨ The MCU can then read the key status taking care to read the data in the centre of the transmitted data pulse. After the last data bit is transferred the BS804C/ BS808C device will return its SCD pin to an input state. ¨ The timings associated with the above protocol can be described in multiples of the SCD clock periods. The SCD clock period is about about 76ms. A certain time is required for the MCU to transmit three or more pulses to inform the device that it desires to read the key status. After this time has elapsed the device will then transmit the data bits, D0~Dn. Device BS804C BS808C Time 22 tSCD 38 tSCD Key Status Read Total Time Each bit of transmitted data corresponds directly to a touch input key. Therefore the status of touch key Key0 is represented by D0, Key1 by D1 and so on. A ²low² bit means that a touch has been detected, a ²high² bit means no touch has been detected. Pin Key0 Key1 : : Keyn Data Bit D0 D1 : : Dn 1: Key Off 0: Key On Dn Value · MCU sends commands to BS804C/BS808C device The MCU can send commands along the SCD line to setup the device in different Operating State. To do this the externally connected MCU takes control of the SCD line, first forcing it low and holding it low for a time of greater than 8 tSCD cycles. This action will temporarily disable the device and enable it to receive the The devices include a full auto-calibration function which will be initiated after the device is powered-on. In addition to the power-on calibration, if no switch detection has been made for more than about 2.5 seconds then a further calibration procedure will be carried out. The calibration is applied independently to each channel on the devices. By implementing this feature, changes in the touch key environmental conditions are automatically catered for dynamically. Rev. 1.00 7 December 2, 2009 BS801C/02C/04C/06C/08C M C U a s In p u t, d e v ic e a s In p u t M C U a s O u tp u t, d e v ic e a s In p u t SCD 2 tS CD MCU a s In p u t, d e v ic e a s O u tp u t S y n c h r o n is e D0 tS CD D1 CD Dn CD 2 tS CD 2 tS CD tS CD 2 tS tS CD tS CD 2 tS tS CD L e a d C lo c k S y n c P e r io d K e y S ta tu s D e v ic e BS804C BS808C T o u c h S w itc h D a ta L e n g th 4 b its 8 b its D a ta F o rm a t D0~D3 D0~D7 SCD Pin Touch Key Status Request Sensitivity Adjustment The sensitivity of the switch is a very important consideration in most applications whose requirements will vary according to the user application. The user should therefore be aware of the factors which will affect the overall sensitivity of their touch key application. Factors to take into consideration include the electrode size and the capacitance of the connection lines from the electrode to the BS80xC device. Therefore the sensitivity will vary according to the actual PCB layout and design. An external capacitor, Cs, connected to the Cref pin, is used to set the overall sensitivity of all pins. Some of the most important factors affecting sensitivity are the following: · Cref capacitor value - Cs · Touch key pad size Larger touch key sizes will increase sensitivity and of course vice-versa, small electrode sizes will decrease sensitivity. · Touch key pad insulating panel thickness A thinner panel will result in higher sensitivity and of course thicker panels will result in a lower sensitivities. · Touch key pad insulating panel material The choice of the dielectric material for the panel will influence the sensitivity. Materials with higher dielectric constants will result in higher sensitivities and lower dielectric constants will result in lower sensitivities. The purpose of the Cs capacitor is to allow for adjustment of touch key sensitivity and power noise rejection. The optimal choice of sensitivity and power noise rejection will be obtained when the value of the Cs capacitor is equivalent to the touch pad capacitance, however the value can still be changed to obtain the required sensitivity value. Higher Cs values will result in higher levels of sensitivity. Recommended values for Cs are between 0pF and 10pF. Touch Key Cs 0pF~ 10pF Key Cref Rev. 1.00 8 December 2, 2009 BS801C/02C/04C/06C/08C Application Circuit VDD Touch Key Cs 0pF~ 10pF Key Cref R VDD Kout LHF VSS BS801C VDD 0.1uF VDD Touch Key0 Touch Key1 Cs 0pF~ 10pF Key0 VDD 0.1uF Key1 R Cref Kout0 R VDD LHF VSS BS802C Kout1 VDD VDD Touch Key0 Touch Key3 Cs 0pF~ 10pF Key0 . . . Key3 Cref VDD 0.1uF MCU . . . SCD R VDD Kout0 INTB or Port LHF OKW VSS . . . Kout3 R VDD BS804C Note: If the output is connected to an MCU input with an internal pull high resistor then the pull high resistor on the application circuit is not required. Rev. 1.00 9 December 2, 2009 BS801C/02C/04C/06C/08C VDD Touch Key0 Key0 . . . Key5 Cs 0pF~ 10pF Cref Kout0 . . . Kout5 OKW VSS BS806C VDD 0.1uF R VDD R VDD Touch Key5 . . . VDD Touch Key0 Key0 . . . Key7 Cs 0pF~ 10pF Cref Kout0 . . OKW VSS BS808C Kout7 R VDD VDD 0.1uF SCD R VDD Touch Key7 . . . MCU INTB or Port Note: If the output is connected to an MCU input with an internal pull high resistor then the pull high resistor on the application circuit is not required. Rev. 1.00 10 December 2, 2009 BS801C/02C/04C/06C/08C Package Information 8-pin SOP (150mil) Outline Dimensions A 1 8 5 B 4 C C' G D E F H a · MS-012 Symbol A B C C¢ D E F G H a Dimensions in mil Min. 228 150 12 188 ¾ ¾ 4 16 7 0° Nom. ¾ ¾ ¾ ¾ ¾ 50 ¾ ¾ ¾ ¾ Max. 244 157 20 197 69 ¾ 10 50 10 8° Rev. 1.00 11 December 2, 2009 BS801C/02C/04C/06C/08C 16-pin NSOP (150mil) Outline Dimensions A 1 16 9 8 B C C' G H D E F a · MS-012 Symbol A B C C¢ D E F G H a Dimensions in mil Min. 228 150 12 386 ¾ ¾ 4 16 7 0° Nom. ¾ ¾ ¾ ¾ ¾ 50 ¾ ¾ ¾ ¾ Max. 244 157 20 394 69 ¾ 10 50 10 8° Rev. 1.00 12 December 2, 2009 BS801C/02C/04C/06C/08C 20-pin SOP (300mil) Outline Dimensions 20 A 11 B 1 C C' 10 G H D E F a · MS-013 Symbol A B C C¢ D E F G H a Dimensions in mil Min. 393 256 12 496 ¾ ¾ 4 16 8 0° Nom. ¾ ¾ ¾ ¾ ¾ 50 ¾ ¾ ¾ ¾ Max. 419 300 20 512 104 ¾ 12 50 13 8° Rev. 1.00 13 December 2, 2009 BS801C/02C/04C/06C/08C 20-pin SSOP (150mil) Outline Dimensions 20 A 11 B 1 C C' 10 G H D E F a Symbol A B C C¢ D E F G H a Dimensions in mil Min. 228 150 8 335 49 ¾ 4 15 7 0° Nom. ¾ ¾ ¾ ¾ ¾ 25 ¾ ¾ ¾ ¾ Max. 244 158 12 347 65 ¾ 10 50 10 8° Rev. 1.00 14 December 2, 2009 BS801C/02C/04C/06C/08C 6-pin SOT23-6 Outline Dimensions D C L E H e A2 b A1 A Symbol A A1 A2 b C D E e H L q Dimensions in mm Min. 1.0 ¾ 0.7 0.35 0.1 2.7 1.4 ¾ 2.6 0.37 1° Nom. ¾ ¾ ¾ ¾ ¾ ¾ ¾ 1.9 ¾ ¾ ¾ Max. 1.3 0.1 0.9 0.50 0.25 3.1 1.8 ¾ 3.0 ¾ 9° Rev. 1.00 15 q December 2, 2009 BS801C/02C/04C/06C/08C Product Tape and Reel Specifications Reel Dimensions T2 D A B C T1 SOP 8N Symbol A B C D T1 T2 Description Reel Outer Diameter Reel Inner Diameter Spindle Hole Diameter Key Slit Width Space Between Flange Reel Thickness Dimensions in mm 330.0±1.0 100.0±1.5 13.0 +0.5/-0.2 2.0±0.5 12.8 +0.3/-0.2 18.2±0.2 SOP 16N (150mil) Symbol A B C D T1 T2 Description Reel Outer Diameter Reel Inner Diameter Spindle Hole Diameter Key Slit Width Space Between Flange Reel Thickness Dimensions in mm 330.0±1.0 100.0±1.5 13.0 +0.5/-0.2 2.0±0.5 16.8 +0.3/-0.2 22.2±0.2 Rev. 1.00 16 December 2, 2009 BS801C/02C/04C/06C/08C SOP 20W Symbol A B C D T1 T2 Description Reel Outer Diameter Reel Inner Diameter Spindle Hole Diameter Key Slit Width Space Between Flange Reel Thickness Dimensions in mm 330.0±1.0 100.0±1.5 13.0 +0.5/-0.2 2.0±0.5 24.8 +0.3/-0.2 30.2±0.2 SSOP 20S (150mil) Symbol A B C D T1 T2 Description Reel Outer Diameter Reel Inner Diameter Spindle Hole Diameter Key Slit Width Space Between Flange Reel Thickness Dimensions in mm 330.0±1.0 100.0±1.5 13.0 +0.5/-0.2 2.0±0.5 16.8 +0.3/-0.2 22.2±0.2 SOT23-6 Symbol A B C D T1 T2 Description Reel Outer Diameter Reel Inner Diameter Spindle Hole Diameter Key Slit Width Space Between Flange Reel Thickness Dimensions in mm 178.0±1.0 62.0±1.0 13.0±0.2 2.50±0.25 8.4 11.4 +1.5/-0.0 +1.5/-0.0 Rev. 1.00 17 December 2, 2009 BS801C/02C/04C/06C/08C Carrier Tape Dimensions D E F W C P0 P1 t B0 D1 P A0 K0 R e e l H o le IC p a c k a g e p in 1 a n d th e r e e l h o le s a r e lo c a te d o n th e s a m e s id e . SOP 8N Symbol W P E F D D1 P0 P1 A0 B0 K0 t C Cavity Pitch Perforation Position Cavity to Perforation (Width Direction) Perforation Diameter Cavity Hole Diameter Perforation Pitch Cavity to Perforation (Length Direction) Cavity Length Cavity Width Cavity Depth Carrier Tape Thickness Cover Tape Width Description Carrier Tape Width Dimensions in mm 12.0 +0.3/-0.1 8.0±0.1 1.75±0.1 5.5±0.1 1.55±0.1 1.50 +0.25/-0.00 4.0±0.1 2.0±0.1 6.4±0.1 5.2±0.1 2.1±0.1 0.30±0.05 9.3±0.1 SOP 16N (150mil) Symbol W P E F D D1 P0 P1 A0 B0 K0 t C Description Carrier Tape Width Cavity Pitch Perforation Position Cavity to Perforation (Width Direction) Perforation Diameter Cavity Hole Diameter Perforation Pitch Cavity to Perforation (Length Direction) Cavity Length Cavity Width Cavity Depth Carrier Tape Thickness Cover Tape Width Dimensions in mm 16.0±0.3 8.0±0.1 1.75±0.1 7.5±0.1 1.55 1.50 +0.10/-0.00 +0.25/-0.00 4.0±0.1 2.0±0.1 6.5±0.1 10.3±0.1 2.1±0.1 0.30±0.05 13.3±0.1 18 December 2, 2009 Rev. 1.00 BS801C/02C/04C/06C/08C SOP 20W Symbol W P E F D D1 P0 P1 A0 B0 K0 t C Description Carrier Tape Width Cavity Pitch Perforation Position Cavity to Perforation (Width Direction) Perforation Diameter Cavity Hole Diameter Perforation Pitch Cavity to Perforation (Length Direction) Cavity Length Cavity Width Cavity Depth Carrier Tape Thickness Cover Tape Width Dimensions in mm 24.0 +0.3/-0.1 12.0±0.1 1.75±0.10 11.5±0.1 1.5 1.50 +0.1/-0.0 +0.25/-0.00 4.0±0.1 2.0±0.1 10.8±0.1 13.3±0.1 3.2±0.1 0.30±0.05 21.3±0.1 SSOP 20S (150mil) Symbol W P E F D D1 P0 P1 A0 B0 K0 t C Description Carrier Tape Width Cavity Pitch Perforation Position Cavity to Perforation (Width Direction) Perforation Diameter Cavity Hole Diameter Perforation Pitch Cavity to Perforation (Length Direction) Cavity Length Cavity Width Cavity Depth Carrier Tape Thickness Cover Tape Width Dimensions in mm 16.0 +0.3/-0.1 8.0±0.1 1.75±0.10 7.5±0.1 1.5 1.50 +0.1/-0.0 +0.25/-0.00 4.0±0.1 2.0±0.1 6.5±0.1 9.0±0.1 2.3±0.1 0.30±0.05 13.3±0.1 Rev. 1.00 19 December 2, 2009 BS801C/02C/04C/06C/08C SOT23-6 Symbol W P E F D D1 P0 P1 A0 B0 K0 t C Description Carrier Tape Width Cavity Pitch Perforation Position Cavity to Perforation (Width Direction) Perforation Diameter Cavity Hole Diameter Perforation Pitch Cavity to Perforation (Length Direction) Cavity Length Cavity Width Cavity Depth Carrier Tape Thickness Cover Tape Width Dimensions in mm 8.0±0.3 4.0±0.1 1.75±0.10 3.50±0.05 1.5 1.5 +0.1/-0.0 +0.1/-0.0 4.0±0.1 2.00±0.05 3.15±0.10 3.2±0.1 1.4±0.1 0.20±0.03 5.3±0.1 Rev. 1.00 20 December 2, 2009 BS801C/02C/04C/06C/08C Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shenzhen Sales Office) 5F, Unit A, Productivity Building, No.5 Gaoxin M 2nd Road, Nanshan District, Shenzhen, China 518057 Tel: 86-755-8616-9908, 86-755-8616-9308 Fax: 86-755-8616-9722 Holtek Semiconductor (USA), Inc. (North America Sales Office) 46729 Fremont Blvd., Fremont, CA 94538, USA Tel: 1-510-252-9880 Fax: 1-510-252-9885 http://www.holtek.com Copyright Ó 2009 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw. Rev. 1.00 21 December 2, 2009