HT7340-3

HT73xx-3 30V, 250mA TinyPowerTM LDO Features General Description • Low power consumption The HT73xx-3 device series are low power high voltage regulators implemented in CMOS technology which have the advantages of low voltage drop and low quiescent current. They allow input voltages as high as 30V. They are available with several fixed output voltages ranging from 2.1V to 5.0V. The softstart function inhibits the problem of output overshoot during power on. • Low voltage drop • Low temperature coefficient • High input voltage - up to 30V • Output voltage accuracy: tolerance ±2% • Over current protection • Package types: 3-pin TO92, 3-pin SOT89 and 8-pin SOP-EP Although designed primarily as fixed voltage regulators, these devices can be used with external components to obtain variable voltages and currents. Applications • Battery-powered equipment • Communication equipment • Audio/Video equipment Selection Table Part No. Output Voltage HT7321-3 2.1V HT7323-3 2.3V HT7325-3 2.5V HT7327-3 2.7V HT7330-3 3.0V HT7333-3 3.3V HT7336-3 3.6V HT7340-3 4.0V HT7344-3 4.4V HT7350-3 5.0V Package Marking TO92 SOT89 8SOP-EP 73xx-3 (for TO92, SOT89) HT73xx-3 (for 8SOP-EP) Note: ″xx″ stands for output voltages. Rev. 1.10 1 August 06, 2018 HT73xx-3 Block Diagram VIN OUT Vref Soft Start GND Pin Assignment SOT89 TO92 73xx-3 73xx-3 1 2 3 GND VIN OUT OUT 1 NC 2 NC 3 NC 4 9 VIN 8 VIN 7 NC 6 NC 5 GND HT73xx-3 8 SOP-EP-A 1 2 3 GND VIN VOUT Pin Descriptions Pin No. TO92 SOT89 1 1 2 2 3 3 — — Rev. 1.10 Pin Name Pin Description 5 GND Ground pin 8, 9 VIN Input pin 1 OUT Output pin 2, 3, 4, 6, 7 NC No connection 8SOP-EP 2 August 06, 2018 HT73xx-3 Absolute Maximum Ratings Parameter Value Unit VIN -0.3 to +33 Operating Temperature Range, Ta -40 to +85 o C +150 o C -65 to +165 o C Maximum Junction Temperature, TJ(MAX) Storage Temperature Range Junction-to-Ambient Thermal Resistance, θJA Power Dissipation, PD(MAX) V TO92 200 °C/W SOT89 200 °C/W 8SOP-EP 125 °C/W TO92 0.50 W SOT89 0.50 W 8SOP-EP 0.80 W Value Unit VOUT+2 to 30 V Note: PD(MAX) is measured at Ta = 25°C Recommended Operating Range Parameter VIN Electrical Characteristics Symbol VIN=(VOUT+2V), Ta=+25oC and CIN=COUT=10μF, unless otherwise specified Test Conditions Min. Typ. Max. Unit VIN Input Voltage Parameter — — — 30 V VOUT Output Voltage Range — 2.1 — 5.0 V VO Output Voltage Accuracy –2 — 2 % IOUT Output Current — 250 — — mA ∆VOUT Load Regulation 1mA ≤ IOUT ≤ 100mA — 45 90 mV IOUT=1mA, VOUT Change=2% (Note) — 6 15 IOUT=30mA, VOUT Change=2% (Note) — 120 300 VDIF Dropout Voltage ISS Quiescent Current IOUT=10mA mV IOUT=0mA — 1.0 1.5 uA ∆VOUT Line Regulation ∆VIN × VOUT (VOUT+2V) ≤ VIN ≤ 30V, IOUT=40mA — 0.2 0.4 %/V ∆VOUT Temperature Coefficient ∆Ta × VOUT IOUT=40mA, -40°C < Ta < 85°C — ±100 — ppm/°C IOCP VIN=12V — 350 700 mA Over Current Protection Note: Dropout voltage is defined as the input voltage minus the output voltage that produces a 2% change in the output voltage from the value at VIN=VOUT+2V with a fixed load. Rev. 1.10 3 August 06, 2018 HT73xx-3 Typical Performance Characteristic Test Condition: VIN=VOUT+2V, IOUT=10mA, CIN=10μF, COUT=10μF and Ta=25ºC, unless otherwise noted 3.31 5.02 VOUT(V) 3.3 VOUT(V) 5.04 -40°C +25°C +85°C 3.32 3.29 5 4.98 3.28 4.96 3.27 4.94 -40°C +25°C +85°C 4.92 3.26 4 7 10 13 16 19 22 25 28 5 31 8 11 14 17 Line Regulation: HT7333-3 (IOUT=10mA) 2.5 1 1 0 7 10 13 16 19 22 25 28 -40°C +25°C +85°C 0 31 5 VIN(V) 10 200 200 160 160 120 120 80 -40°C +25°C +85°C 40 100 150 200 VIN(V) 20 25 80 30 -40°C +25°C +85°C 40 0 50 15 ISS vs VIN: HT7350-3 (IOUT=0mA) ISS(uA) ISS(uA) ISS vs VIN: HT7333-3 (IOUT=0mA) 0 32 1.5 0.5 4 29 2 0.5 0 250 0 50 100 IOUT(mA) 150 200 250 IOUT(mA) ISS vs IOUT: HT7333-3 (VIN=5.3V) ISS vs IOUT: HT7350-3 (VIN=7.0V) 1000 1400 -40°C +25°C +85°C 1000 800 -40°C +25°C +85°C 800 VDIF(V) 1200 VDIF(mV) 26 2.5 ISS (uA) ISS (uA) 1.5 23 Line Regulation: HT7350-3 (IOUT=10mA) -40°C +25°C +85°C 2 20 VIN(V) VIN(V) 600 400 600 400 200 200 0 0 50 100 150 200 0 250 0 IOUT(mA) 100 150 200 250 IOUT(mA) Dropout Voltage: HT7333-3 Rev. 1.10 50 Dropout Voltage: HT7350-3 4 August 06, 2018 HT73xx-3 Test Condition: VIN=VOUT+2V, IOUT=10mA, CIN=10μF, COUT=10μF and Ta=25ºC, unless otherwise noted Load Transient Response: HT7333-3 (VIN=5.3V, IOUT=0mA to 40mA) Load Transient Response: HT7350-3 (VIN=7.0V, IOUT=0mA to 40mA) Load Transient Response: HT7333-3 (VIN=5.3V, IOUT=40mA to 0mA) Load Transient Response: HT7350-3 (VIN=7.0V, IOUT=40mA to 0mA) Line Trasient Response: HT7333-3 (IOUT=10mA) Line Trasient Response: HT7350-3 (IOUT=10mA) Rev. 1.10 5 August 06, 2018 HT73xx-3 Test Condition: VIN=VOUT+2V, IOUT=10mA, CIN=10μF, COUT=10μF and Ta=25ºC, unless otherwise noted Rev. 1.10 Line Trasient Response: HT7333-3 (IOUT=10mA) Line Trasient Response: HT7350-3 (IOUT=10mA) Line Trasient Response: HT7333-3 (IOUT=10mA) Line Trasient Response: HT7350-3 (IOUT=10mA) Line Trasient Response: HT7333-3 (IOUT=10mA) Line Trasient Response: HT7350-3 (IOUT=10mA) Power On Response: HT7333-3 (IOUT=0mA, TRISE=0.1ms) Power On Response: HT7350-3 (IOUT=0mA, TRISE=0.1ms) 6 August 06, 2018 HT73xx-3 Test Condition: VIN=VOUT+2V, IOUT=10mA, CIN=10μF, COUT=10μF and Ta=25ºC, unless otherwise noted Power On Response: HT7333-3 (IOUT=0mA, TRISE=100ms) Power On Response: HT7350-3 (IOUT=0mA, TRISE=100ms) Power On Response: HT7333-3 (IOUT=250mA, TRISE=0.1ms) Power On Response: HT7350-3 (IOUT=250mA, TRISE=0.1ms) Power On Response: HT7333-3 (IOUT=250mA, TRISE=100ms) Power On Response: HT7350-3 (IOUT=250mA, TRISE=100ms) Power Off Response: HT7333-3 (IOUT=0mA, TFALL=0.1ms) Power Off Response: HT7350-3 (IOUT=0mA, TFALL=0.1ms) Rev. 1.10 7 August 06, 2018 HT73xx-3 Test Condition: VIN=VOUT+2V, IOUT=10mA, CIN=10uF, COUT=10uF and Ta=25ºC, unless otherwise noted Power Off Response: HT7333-3 (IOUT=0mA, TFALL=100ms) Power Off Response: HT7350-3 (IOUT=0mA, TFALL=100ms) Power Off Response: HT7333-3 (IOUT=250mA, TFALL=0.1ms) Power Off Response: HT7350-3 (IOUT=250mA, TFALL=0.1ms) Power Off Response: HT7333-3 (IOUT=250mA, TFALL=100ms) Power Off Response: HT7350-3 (IOUT=250mA, TFALL=100ms) Rev. 1.10 8 August 06, 2018 HT73xx-3 Application Information Power Dissipation Calculation The devices are 3-terminal low dropout series linear voltage regulators. It is important the following application points are noted if correct operation is to be achieved. In order to keep the device within its operating limits and to maintain a regulated output voltage, the power dissipation of the device, given by P D, must not exceed the Maximum Power Dissipation, given by PD(MAX). Therefore PD ≤ PD(MAX). From the diagram it can be seen that almost all of this power is generated across the pass transistor which is acting like a variable resistor in series with the load to keep the output voltage constant. This generated power which will appear as heat, must never allow the device to exceed its maximum junction temperature. External Circuit It is important that external capacitors are connected to both the input and output pins. For the input pin suitable bypass capacitors as shown in the application circuits should be connected especially in situations where a battery power source is used which may have a higher impedence. For the output pin, a suitable capacitor should also be connected especially in situations where the load is of a transient nature, in which case larger capacitor values should be selected to limit any output transient voltages. Common The maximum power dissipation depends on the thermal resistance of the IC package, the PCB layout, the rate of the surrounding airflow and the difference between the junction and ambient temperature. The maximum power dissipation can be calculated by the following formula: PD(MAX) = (TJ(MAX) – Ta) / θJA θJA Value °C/W 200 °C/W SOT89 200 °C/W 8SOP-EP 125 °C/W Maximum Power Dissipation (W) Time As the quiescent current of the device is very small it can generally be ignored and as a result the input current can be assumed to be equal to the output current. Therefore the power dissipation of the device, PD, can be calculated as the voltage drop across the input and output multiplied by the current, given by the equation, PD = (VIN – VOUT) × IIN. As the input current is also equal to the load current the power dissipation PD = (VIN – VOUT) × ILOAD. However, with transient load currents, PD = (VIN – VOUT) × ILOAD(AVG) as shown in the figure. 8SOP-EP 0.5W 0.6 0.4 SOT89, TO92 0.2 0 0 Rev. 1.10 25 50 75 100 Ambient Temperature (oC) Common ILOAD(AVG) 0.8W 0.8 ILOAD ILOAD For maximum operating rating conditions, the maximum junction temperature is 150°C. However, it is recommended that the maximum junction temperature does not exceed 125°C during normal operation to maintain an adequate margin for device reliability. The derating curves of different packages for maximum power dissipation are as follows: 1.0 Vref Vfb VOUT In practical applications the regulator may be called upon to provide both steady state and transient currents due to the transient nature of the load. Although the device may be working well within its limits with its steady state current, care must be taken with transient loads which may cause the current to rise close to its maximum current value. Care must be taken with transient loads and currents as this will result in device junction temperature rises which must not exceed the maximum junction temperature. With both steady state and transient currents, the important current to consider is the average or more precisely the RMS current which is the value of current that will appear as heat generated in the device. The following diagram shows how the average current relates to the transient currents. where TJ(MAX) is the maximum junction temperature, Ta is the ambient temperature and θJA is the junctionto-ambient thermal resistance of the IC package in degrees per watt. The following table shows the θJA values for various package types. TO92 OUT VIN GND Thermal Considerations Package IIN VIN 125 150 9 August 06, 2018 HT73xx-3 Application Circuits Basic Circuits VIN VIN VOUT HT73xx-3 Series C3 C1 0.1uF 10uF GND VOUT C2 C4 10uF 0.1uF Common Common High Output Current Positive Voltage Regulator TR1 R1 VIN VIN VOUT HT73xx-3 Series C3 C1 0.1uF 10uF GND VOUT C2 C4 10uF 0.1uF Common Common Circuit for Increasing Output Voltage VIN VIN C1 0.1uF 10uF GND ISS VOUT = Vxx×(1+R2/R1) + ISS×R2 Common Rev. 1.10 VOUT C2 10uF C4 0.1uF Vxx C3 VOUT HT73xx-3 Series R1 R2 Common 10 August 06, 2018 HT73xx-3 Circuit for Increasing Output Voltage VIN VIN VOUT HT73xx-3 Series C1 0.1uF 10uF GND ISS C2 C4 10uF 0.1uF R1 Vxx C3 VOUT D1 VOUT = Vxx + VD1 Common Common Constant Current Regulator VIN VIN C1 0.1uF 10uF GND ISS VOUT C2 C4 10uF 0.1uF RA Vxx C3 VOUT HT73xx-3 Series IOUT IOUT = Vxx / RA + ISS RL Common Common Dual Supply VOUT VIN VIN HT73xx-3 Series C5 10uF GND VOUT VIN C3 0.1uF C1 10uF HT73xx-3 Series GND Common Rev. 1.10 VOUT C6 0.1uF D1 VOUT C2 C4 10uF 0.1uF R1 Common 11 August 06, 2018 HT73xx-3 Package Information Note that the package information provided here is for consultation purposes only. As this information may be updated at regular intervals users are reminded to consult the Holtek website for the latest version of the Package/ Carton Information. Additional supplementary information with regard to packaging is listed below. Click on the relevant section to be transferred to the relevant website page. • Package Information (include Outline Dimensions, Product Tape and Reel Specifications) • The Operation Instruction of Packing Materials • Carton information Rev. 1.10 12 August 06, 2018 HT73xx-3 3-pin TO92 Outline Dimensions         Symbol Nom. Max. A 0.173 0.180 0.205 B 0.170 — 0.210 C 0.500 0.580 — D — 0.015 BSC — E — 0.010 BSC — F — 0.050 BSC — G — 0.035 BSC — H 0.125 0.142 0.165 Symbol Rev. 1.10 Dimensions in inch Min. Dimensions in mm Min. Nom. Max. A 4.39 4.57 5.21 B 4.32 — 5.33 C 12.70 14.73 — D — 0.38 BSC — E — 2.54 BSC — F — 1.27 BSC — G — 0.89 BSC — H 3.18 3.61 4.19 13 August 06, 2018 HT73xx-3 3-pin SOT89 Outline Dimensions          Symbol Dimensions in inch Min. Nom. Max. A 0.173 — 0.185 B 0.053 — 0.072 C 0.090 — 0.106 D 0.031 — 0.047 E 0.155 — 0.173 F 0.014 — 0.019 G 0.017 — 0.022 H — 0.059 BSC — I 0.055 — 0.063 J 0.014 — 0.017 Symbol Rev. 1.10  Dimensions in mm Min. Nom. Max. A 4.40 — 4.70 B 1.35 — 1.83 C 2.29 — 2.70 D 0.80 — 1.20 E 3.94 — 4.40 F 0.36 — 0.48 G 0.44 — 0.56 H — 1.50 BSC — I 1.40 — 1.60 J 0.35 — 0.44 14 August 06, 2018 HT73xx-3 8-pin SOP-EP (150mil) Outline Dimensions              Symbol Dimensions in inch Min. Nom. Max. — A — 0.236 BSC B — 0.154 BSC — C 0.012 — 0.020 C’ — 0.193 BSC — D — — 0.069 D1 0.059 — — — E — 0.050 BSC E2 0.039 — — F 0.004 — 0.010 G 0.016 — 0.050 H 0.004 — 0.010 a 0° — 8° Symbol Rev. 1.10   Dimensions in mm Min. Nom. Max. A — 6.00 BSC — B — 3.90 BSC — C 0.31 — 0.51 C’ — 4.90 BSC — D — — 1.75 D1 1.50 — — E — 1.27 BSC — E2 1.00 — — F 0.10 — 0.25 G 0.40 — 1.27 H 0.10 — 0.25 a 0° — 8° 15 August 06, 2018 HT73xx-3 Copyright© 2018 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holtek's products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw. Rev. 1.10 16 August 06, 2018