HT7612/HT7612B
General Purpose PIR Controller
Features
· Operating voltage: 2.7V ~ 5.5V
· 40 second power-on delay
· Standby current typical:
· 10 second high speed warm-up for test mode
HT7612: 17mA
HT7612B: 19mA
· CDS input
· 1~3783 second adjustable PIR turn on time.
· CDS debounce time:
· Low voltage detector
HT7612: 15~20 seconds
HT7612B: < 3 seconds
· High noise immunity
· Override function
· Output drive for Relay, TRIAC and LED
· Output drive buzzer alarm
· 16-pin DIP/NSOP packages
Applications
· PIR light control
· Alarm system
· Motion detectors
· Auto door bells
General Description
ment and a CDS can be connected to the controller for
automatic detection. The HT7612/HT7612B is available
in low profile NSOP & DIP packages.
The HT7612/HT7612B is PIR controller specifically designed to interface to PIR sensors to implement motion
sensing application products such as intruder alarms.
The controller has the features of PIR sensitivity adjust-
Selection Table
Part No.
CDS Debounce Time
HT7612
15~20 seconds
HT7612B
< 3 seconds
Block Diagram
V D D
V S S
O P 2 O
O P 2 N
O P 1 O
O P 1 N
O P 1 P
V R E F
C o m p a ra to r
C ir c u it
A m p lifie r
C ir c u it
L D O &
R e fe r a n c e V o lta g e
B U Z /L V D
B U Z /C D S
D T
T im in g
D e la y
C o n tro l
C ir c u it
R E L A Y /L E D
T R A IC
T E S T /S C
S y s ta m
O s c illa to r
Z C
M O D E
Rev. 1.70
1
July 16, 2012
HT7612/HT7612B
Pin Assignment
O P 1 P
1
1 6
T E S T /S C
O P 1 O
3
1 4
B U Z /L V D
O P 1 N
1 5
2
O P 2 N
1 3
4
O P 2 O
1 2
5
V R E F
D T
V S S
1 1
6
1 0
7
9
8
Z C
B U Z /C D S
M O D E
R E L A Y /L E D
T R IA C
V D D
H T 7 6 1 2 /H T 7 6 1 2 B
1 6 D IP -A /N S O P -A
Pin Description
Pin Name
OP1P
I/O
Mask
Option
I
PMOS
Description
OP1 Non-inverting Input
OP1N
I
PMOS
OP1 Inverting Input
OP1O
O
CMOS
OP1 Output
OP2N
I
PMOS
OP2 Inverting Input
OP2O
O
CMOS
OP2 Output
VREF
O
NMOS
Reference Voltage
DT
I
PMOS
Delay time oscillator input. Connected to an external RC to adjust the output duration.
TEST/SC
O
CMOS
TEST and SC share the same pin.
TEST is used to test the 32 Khz system frequency.
SC is used to detect LVD and CDS.
VSS
¾
¾
Negative power supply, ground
VDD
¾
¾
Positive power supply
RELAY/LED
O
CMOS
RELAY and LED share the same pin.
Active high - a RELAY is driven through an external NPN transistor.
BUZ/CDS
I/O
CMOS
BUZ and CDS share the same pin.
The BUZ output can drive a piezo buzzer.
CDS is connected to a CDS voltage divider for daytime/night auto-detection. A low
input to this pin can disable the PIR input. CDS is connected to the input of a internal
comparator with a debounce time of 15~20 seconds for the HT7612 and less than 3
seconds for the HT7612B.
BUZ/LVD
I/O
CMOS
BUZ and LVD share the same pin.
The BUZ output can drive a piezo buzzer
LVD is used as an input low voltage detector.
ZC
I
¾
TRIAC
O
CMOS
TRIAC output drive. The output is a pulse output when active.
CMOS
Operating mode selection input.
VDD: Output is always ON
VSS: Output is always OFF
Open: Auto detection
Test Mode Input.
MODE
Rev. 1.70
I
AC zero crossing detector input.
2
July 16, 2012
HT7612/HT7612B
Absolute Maximum Ratings
Supply Voltage ...........................VSS-0.3V to VSS+6.0V
Storage Temperature ............................-50°C to 125°C
Input Voltage..............................VSS-0.3V to VDD+0.3V
Operating Temperature...........................-40°C to 85°C
Zero Crossing Current ................................Max. 300mA
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed
in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
Electrical Characteristics
Symbol
Parameter
Ta=25°C
Test Conditions
Max.
Unit
2.7
4.0
5.5
V
3.201
3.300
3.399
V
¾
200
¾
¾
mA
HT7612: DT off, OPAMP off,
VREF no load
¾
17
23
mA
HT7612B: DT off, OPAMP on,
VREF no load
¾
19
25
mA
¾
¾
Operating Voltage
VREF
Reference Voltage - see Note
5V
IREF
Driving Current
5V
Standby Current
Typ.
Conditions
VDD
ISTB
Min.
VDD
5V
Cf=1mF
IOH1
TRIAC Source Current
5V
VOH=4.5V
-20
-40
¾
mA
IOL1
TRIAC Sink Current
5V
VOL=0.5V
20
40
¾
mA
IOH2
BUZ & BUZ Source Current
5V
VOH=4.5V
-5
-10
¾
mA
IOL2
BUZ & BUZ Sink Current
5V
VOL=0.5V
10
20
¾
mA
IOH3
RELAY/LED Source Current
5V
VOH=4.5V
-5
-10
¾
mA
IOL3
RELAY/LED Sink Current
5V
VOL=0.5V
10
20
¾
mA
VIH
MODE High Input Voltage
¾
¾
0.7VDD
¾
¾
V
VIL
MODE Low Input Voltage
¾
¾
¾
¾
0.3VDD
V
VTH1
ZC High Transfer Voltage
¾
¾
0.7VDD
¾
¾
V
VTL1
ZC Low Transfer Voltage
¾
¾
¾
¾
0.3VDD
V
VOS
OP Amp Input Offset Voltage
5V
¾
10
¾
mV
CL=10pF
VLVD
Low Voltage Detector Voltage
¾
¾
0.99
1.10
1.21
V
fSYS
System Oscillator Frequency - IRC
5V
¾
28.8
32.0
35.2
kHz
15.2
16.0
16.8
kHz
fDT
Delay Time Frequency - ERC
¾
VREF, RDT=30kW,
CDT=3000pF
AVO
OP Amp Open Loop Gain
5V
RL=510kW to VSS
60
80
¾
dB
GBW
OP Amp Gain Band Bandwidth
5V
RL=510kW, CL=100pF
2.5
5.0
¾
kHz
VH
High Level Comparator Window
5V
1/2 VREF + 1/6 VREF
1.98
2.20
2.42
V
VL
Low Level Comparator Window
5V
1/2 VREF - 1/6 VREF
0.99
1.10
1.21
V
Note:
When VDD is less than 3.4V, then the VREF voltage will be equal to VDD. If the VREF voltage is less than the PIR
working voltage, then the PIR sensor will not work normally.
Rev. 1.70
3
July 16, 2012
HT7612/HT7612B
Functional Description
The following gives a description of the functional pins
on the device.
RELAY
B U Z /L V D
TEST
B U Z /C D S
The TEST pin is an output which is used to test the 32
KHz system frequency. Note that the pin is a shared
TEST/SC pin. The TEST output pin can be used within 1
second after power-on.
Fig.2 Buzzer Pin Drive Buzzer
The RELAY pin is a CMOS output structure which is normally low and active high. The high duration is controlled by the delay time oscillator and the MODE pin.
The RELAY pin structure is shown in Fig.3.
SC
The SC pin is an output pin which is used to for LVD and
CDS detection. Note the pin is a shared TEST/SC pin.
The SC pin can be used 1 second after power-on.
V
D D
L O A D
DT
A C
The DT pin is a delay time oscillator input pin. It is connected to an external RC to obtain the desired output
turn-on duration. Variable output turn-on durations can
be achieved by selecting various values of RC or using
a variable resistor. The DT structure is shown in Fig.1.
V
R E F
R E L A Y /L E D
_
Fig.3 RELAY Pin Drive RELAY
+
D T
R E L A Y
8 0 5 0
1 0 k W
_
C o m p
+
S R
F F I
C L K
TRIAC
The TRIAC pin is a CMOS output structure which will
output a series of pulses when active. The pulse train is
synchronised by the ZC (zero crossing) input. The active duration is controlled by the delay time oscillator
and the MODE pin. The TRIAC structure is shown in
Fig.4.
C o m p
O s c illa to r
Fig.1 DT Oscillator Structure
L O A D
BUZ/BUZ
T R IA C
The BUZ & BUZ pins are both CMOS output structures.
They will output 4 beep sounds within 1second to indicate that the warm-up time has completed. These differential output pins can be used to drive a piezo buzzer.
The BUZ/BUZ structure are shown in Fig.2.
6 8 W
0 .0 4 7 m F
T R IA C
A C
1 0 k W
Fig.4 TRIAC Pin Drive TRIAC
Rev. 1.70
4
July 16, 2012
HT7612/HT7612B
MODE
The MODE pin is a tristate input which is used to select the desired device operating mode.
MODE pin Operating
Status
Mode
Description
VDD
ON
Output is always ON:
RELAY output high for RELAY driving.
TRIAC pulse train output is synchronised by ZC for TRIAC driving.
VSS
OFF
Output is always OFF:
RELAY output low for RELAY driving.
TRIAC output low for TRIAC driving.
OPEN
AUTO
Outputs remain in the OFF state until activated by a valid PIR input trigger signal. When
working in the AUTO mode, the devices allows for an override control by switching the ZC
signal.
device is overridden to ON and there is no further
override operations, it will automatically return to the
AUTO mode after 8 hours. It will flash 3 times at a 1Hz
rate when returning to the AUTO mode. But if the
AUTO mode is changed by switching the MODE
switch, it will not flash, as shown in Fig.5.
The device also provides an additional test function on
the MODE pin. If the MODE pin is presented with a high
pulse, of greater than 400ms duration, within 1 second
after power-on, the device will be forced into its test
mode. When the device enters the test mode the
power-on delay time will be changed from its normal operating value of 40 seconds to 10 seconds.
In Fig.6, an external pull-high resistor is required for normal applications.
V
ZC
The ZC pin is a CMOS Schmitt trigger input pin. Using
suitable ZC signal switching, the device can provide the
following functions:
When the device is operating in the AUTO mode,
which is when the MODE pin is open, the output will
be activated by a valid PIR trigger signal and the output active duration will be controlled by a DT oscillating period. The mode can be switched from the AUTO
mode to the ²ON² mode by either connecting the
MODE pin to VDD or switching the ZC signal with an
OFF/ON operation of the power switch. The term
²override² refers to the change of operating mode by
switching the power switch. The device can be toggled from ON to AUTO by an override operation. If the
2 M W
1 M W
A C
· Override control
D D
Fig.6 ZC Application Example
Note:
Regarding the priority of the MODE pin and the
ZC switching, note that when the MODE pin is
connected to VDD or VSS, the MODE state will
be determined by the MODE pin.
When the MODE pin is OPEN, the MODE state
will be determined by the ZC switching.
fla s h
fla s h
O p e r a tin g
M o d e
A U T O
Z C
O N
A U T O
8 h r
O N
A U T O
< 8 h r
< 3 s e c
Z C
A lw a y s h ig h o r a lw a y s L o w
> 3 0 m s
Fig.5 ZC Override Timing
Rev. 1.70
5
July 16, 2012
HT7612/HT7612B
CDS
LED
The CDS pin is connected to an internal comparator input.
It is used to allow the device to distinguish between day
and night conditions. When the CDS input voltage is lower
than VL, the PIR amplifier circuit will be disabled and the
TRIAC and RELAY output pins will be inactive. When the
input voltage of the CDS is higher than VL, the outputs are
both active. The debounce time for the CDS pin for switching the outputs from an inactive to an active state is about
15~20 seconds for the HT7612 and less than 3 seconds
for the HT7612B. Connect this pin to VDD when this function is not used. The CDS timing is shown in Fig.7
The LED pin is a CMOS output pin which is used as a
valid trigger indicator. When the TRIAC/RELAY is activated, this pin will be active until the TRIAC/RELAY has
is switched OFF. The LED pin structure is shown in
Fig.9.
CDS
Status
Output
Low
Day Time
Disabled
High
Night
Enabled
R E L A Y /L E D
1 k 9
T r ig g e r
In d ic a to r
Fig. 9 LED Pin Drive LED
LVD
LVD is a low voltage detector. When the detected voltage is lower than 1.1V, the LED flicker and the buzzer
will emit a tone.
C D S
T R IA C &
R E L A Y
A c tiv e
In a c tiv e
In Fig10, assume RX, RLVD can be adjusted to obtain the
desired voltage detection level.
A c tiv
Fig.7 CDS Timing
V
In Fig.8, RCDS and RY can be adjusted to obtain the desired daytime detection level.
R
+
R E F
-
V
R
Y
L
R
X
B U Z /L V D
1 .1 V
R
L V D
T E S T /S C
B U Z /C D S
+
V
D D
Fig.10 LVD Application Example
C D S
T E S T /S C
Fig.8 CDS Application Example
VREF
VH
VREF
Comp1
VH
Output
OP1
OP2
VM
D
S
VM
VL
VREF
Comp2
VL
Regulator
G
PIR
Sensor
VH
Comparator
Input
VL
PIR Amplifier
Rev. 1.70
6
July 16, 2012
HT7612/HT7612B
Effective Trigger Timing
The effective input trigger signal width should be ³ 24ms. The output is valid either with (1) trigger signal width ³ 0.5
seconds or (2) more than 2 effective trigger inputs within 2 seconds (separation of 2 triggers ³ 0.5s). The separation
time between two TRIAC(RELAY) turn-on time must be more than 1 sec. The trigger timing is shown in Fig.11.
Fig.11 Trigger Timing
Retrigger
When the output of the comparator is a valid signal, the RELAY/TRIAC will be activated and the active duration is controlled by the DT oscillating period. If the previous ²Delay Time tD² has not been exceeded and the next valid signal occurs again, the active duration of the RELAY/TRIAC will be restarted. The timing is shown in Fig.12.
Fig.12 Retrigger
Rev. 1.70
7
July 16, 2012
HT7612/HT7612B
LVD & CDS Detecting Circuit
V
The external and internal detecting circuits for LVD and
CDS are shown in Fig.13. When the input voltage VLVD
is lower than 1.1V, the comparator outputs a low level
which means that VDD is lower than the minimum operating voltage (Vmin). When VCDS is lower than VL, the
comparator outputs a high level which means that it is
daytime, otherwise it is night.
V
D D
R
X
R E F
R
Y
B U Z /L V D
B U Z /C D S
R
L V D
R
C D S
T E S T /S C
Where
Fig.13 External Application Circuit
V
V
C D S
R
=
L V D
=
R
L V D
R
R
C D S
L V D
+ R
C D S
+ R
V
X
Y
V
D D
Note:
R E F
When the CDS input voltage is lower than VL, it
means that a daytime condition exists for the
PIR circuit.
Relationship LVD and CDS
The LVD and CDS trigger timing are shown in Fig.14 and Fig.15 respectively. In Fig.14, When an LVD condition occurs,
the LED will flicker and the buzzer will emit a tone. In Fig.15, When the CDS state changes from low to high, the output
of the PIR is enabled after 10 sec for the HT7612 or 0 sec for the HT7612B, and when the CDS sate changes from high
to low, will be disabled.
Fig.14 Trigger Timing of LVD
CDS State
(Internal signal)
Output
Enable
10 sec for HT7612
0 sec for HT7612B
+ Trigger
Level
Comparator
Input
- Trigger
Level
Comparator
Output
Fig.15 Trigger Timing of CDS
Rev. 1.70
8
July 16, 2012
HT7612/HT7612B
Trigger Timing
Note:
The output is activated if the trigger signal conforms to the following criteria:
1. Two triggers occur within 2 seconds and separation time between two triggers is more than 0.5sec.
2. The trigger signal sustains duration ³ 0.5 seconds.
Rev. 1.70
9
July 16, 2012
HT7612/HT7612B
Application Circuit
AC Power Application
· TRIAC
Note:
Adjust R9 to fit various CDS.
Adjust R6 to obtain the desired output duration.
Adjust R5 to change PIR sensitivity.
Change the value of C10 to 0.33mF/600V for AC 220V application.
Rev. 1.70
10
July 16, 2012
HT7612/HT7612B
· RELAY
Note:
Adjust R9 to fit various CDS.
Adjust R6 to obtain the desired output duration.
Adjust R5 to change PIR sensitivity.
Change the value of C10 to 0.33mF/600V for AC 220V application.
Rev. 1.70
11
July 16, 2012
HT7612/HT7612B
4.5V DC Power Application Circuit
Note:
Adjust R9 to fit various CDS.
Adjust R6 to obtain the desired output duration.
Adjust R5 to change PIR sensitivity.
Rev. 1.70
12
July 16, 2012
HT7612/HT7612B
Photo-transistor Application Circuit
Note:
Adjust R9 to fit various CDS.
Adjust R6 to obtain the desired output duration.
Adjust R5 to change PIR sensitivity.
Use a Photo-transistor instead of a CDS to meet European RoHS standards.
Rev. 1.70
13
July 16, 2012
HT7612/HT7612B
Simplified LED Lighting Application Circuit
Note:
Adjust R6 to obtain the desired output duration.
Adjust R5 to change PIR sensitivity.
Pin14 and pin13 should be connected with pull-high resistors when LVD and CDS detection functions are not
used.
Rev. 1.70
14
July 16, 2012
HT7612/HT7612B
HT7612 + HT7L4091 Application Circuit (7W LED Bulb)
Note:
Adjust R9 to fit various CDS.
Adjust R6 to obtain the desired output duration.
Adjust R5 to change PIR sensitivity.
Rev. 1.70
15
July 16, 2012
HT7612/HT7612B
HT7612 + HT7L2102 Application Circuit
Note:
Adjust R9 to fit various CDS.
Adjust R6 to obtain the desired output duration.
Adjust R5 to change PIR sensitivity.
Rev. 1.70
16
July 16, 2012
HT7612/HT7612B
Package Information
Note that the package information provided here is for consultation purposes only. As this
information may be updated at regular intervals users are reminded to consult the Holtek website for the
latest version of the Package/Carton Information.
16-pin DIP (300mil) Outline Dimensions
A
A
B
1 6
9
1
8
B
1 6
9
1
8
H
H
C
C
D
D
G
E
G
E
I
F
Fig1. Full Lead Packages
I
F
Fig2. 1/2 Lead Packages
· MS-001d (see fig1)
Symbol
A
Min.
Nom.
Max.
0.780
¾
0.880
B
0.240
¾
0.280
C
0.115
¾
0.195
D
0.115
¾
0.150
E
0.014
¾
0.022
F
0.045
¾
0.070
G
¾
0.100
¾
H
0.300
¾
0.325
I
¾
¾
0.430
Symbol
A
Rev. 1.70
Dimensions in inch
Dimensions in mm
Min.
Nom.
Max.
19.81
¾
22.35
B
6.10
¾
7.11
C
2.92
¾
4.95
D
2.92
¾
3.81
E
0.36
¾
0.56
F
1.14
¾
1.78
G
¾
2.54
¾
H
7.62
¾
8.26
I
¾
¾
10.92
17
July 16, 2012
HT7612/HT7612B
· MS-001d (see fig2)
Symbol
A
Nom.
Max.
0.735
¾
0.775
B
0.240
¾
0.280
C
0.115
¾
0.195
D
0.115
¾
0.150
E
0.014
¾
0.022
F
0.045
¾
0.070
G
¾
0.100
¾
H
0.300
¾
0.325
I
¾
¾
0.430
Symbol
Rev. 1.70
Dimensions in inch
Min.
Dimensions in mm
Min.
Nom.
Max.
A
18.67
¾
19.69
B
6.10
¾
7.11
C
2.92
¾
4.95
D
2.92
¾
3.81
E
0.36
¾
0.56
1.78
F
1.14
¾
G
¾
2.54
¾
H
7.62
¾
8.26
I
¾
¾
10.92
18
July 16, 2012
HT7612/HT7612B
· MO-095a (see fig2)
Symbol
A
Nom.
Max.
0.745
¾
0.785
B
0.275
¾
0.295
C
0.120
¾
0.150
D
0.110
¾
0.150
E
0.014
¾
0.022
F
0.045
¾
0.060
G
¾
0.100
¾
H
0.300
¾
0.325
I
¾
¾
0.430
Symbol
Rev. 1.70
Dimensions in inch
Min.
Dimensions in mm
Min.
Nom.
Max.
A
18.92
¾
19.94
B
6.99
¾
7.49
C
3.05
¾
3.81
D
2.79
¾
3.81
E
0.36
¾
0.56
1.52
F
1.14
¾
G
¾
2.54
¾
H
7.62
¾
8.26
I
¾
¾
10.92
19
July 16, 2012
HT7612/HT7612B
16-pin NSOP (150mil) Outline Dimensions
A
1 6
9
1
B
8
C
C '
G
D
E
H
a
F
· MS-012
Symbol
A
Min.
Nom.
Max.
0.228
¾
0.244
B
0.150
¾
0.157
C
0.012
¾
0.020
C¢
0.386
¾
0.402
D
¾
¾
0.069
E
¾
0.050
¾
F
0.004
¾
0.010
G
0.016
¾
0.050
H
0.007
¾
0.010
a
0°
¾
8°
Symbol
Rev. 1.70
Dimensions in inch
Dimensions in mm
Min.
Nom.
Max.
A
5.79
¾
6.20
B
3.81
¾
3.99
C
0.30
¾
0.51
C¢
9.80
¾
10.21
D
¾
¾
1.75
E
¾
1.27
¾
F
0.10
¾
0.25
G
0.41
¾
1.27
H
0.18
¾
0.25
a
0°
¾
8°
20
July 16, 2012
HT7612/HT7612B
Product Tape and Reel Specifications
Reel Dimensions
D
T 2
A
C
B
T 1
SOP 16N (150mil)
Symbol
Description
Dimensions in mm
A
Reel Outer Diameter
330.0±1.0
B
Reel Inner Diameter
100.0±1.5
C
Spindle Hole Diameter
D
Key Slit Width
T1
Space Between Flange
T2
Reel Thickness
Rev. 1.70
13.0
+0.5/-0.2
2.0±0.5
16.8
+0.3/-0.2
22.2±0.2
21
July 16, 2012
HT7612/HT7612B
Carrier Tape Dimensions
P 0
D
P 1
t
E
F
W
D 1
P
B 0
C
K 0
A 0
R e e l H o le
IC
p a c k a g e p in 1 a n d th e r e e l h o le s
a r e lo c a te d o n th e s a m e s id e .
SOP 16N (150mil)
Symbol
Description
Dimensions in mm
W
Carrier Tape Width
16.0±0.3
P
Cavity Pitch
8.0±0.1
E
Perforation Position
1.75±0.1
F
Cavity to Perforation (Width Direction)
7.5±0.1
D
Perforation Diameter
1.55
+0.10/-0.00
D1
Cavity Hole Diameter
1.50
+0.25/-0.00
P0
Perforation Pitch
4.0±0.1
P1
Cavity to Perforation (Length Direction)
2.0±0.1
A0
Cavity Length
6.5±0.1
B0
Cavity Width
10.3±0.1
K0
Cavity Depth
2.1±0.1
t
Carrier Tape Thickness
0.30±0.05
C
Cover Tape Width
13.3±0.1
Rev. 1.70
22
July 16, 2012
HT7612/HT7612B
Holtek Semiconductor Inc. (Headquarters)
No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan
Tel: 886-3-563-1999
Fax: 886-3-563-1189
http://www.holtek.com.tw
Holtek Semiconductor Inc. (Taipei Sales Office)
4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan
Tel: 886-2-2655-7070
Fax: 886-2-2655-7373
Fax: 886-2-2655-7383 (International sales hotline)
Holtek Semiconductor Inc. (Shenzhen Sales Office)
5F, Unit A, Productivity Building, No.5 Gaoxin M 2nd Road, Nanshan District, Shenzhen, China 518057
Tel: 86-755-8616-9908, 86-755-8616-9308
Fax: 86-755-8616-9722
Holtek Semiconductor (USA), Inc. (North America Sales Office)
46729 Fremont Blvd., Fremont, CA 94538
Tel: 1-510-252-9880
Fax: 1-510-252-9885
http://www.holtek.com
Copyright Ó 2012 by HOLTEK SEMICONDUCTOR INC.
The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used
solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable
without further modification, nor recommends the use of its products for application that may present a risk to human life
due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices
or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information,
please visit our web site at http://www.holtek.com.tw.
Rev. 1.70
23
July 16, 2012
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