HI-1565

HI-1565, HI-1566 July 2009 MIL-STD-1553 / 1760 5V Monolithic Dual Transceivers PIN CONFIGURATIONS 44 N/C 43 BUSA 42 BUSA 41 BUSA 40 BUSA 39 VDDA 38 VDDA 37 TXA 36 TXA 35 N/C 34 N/C N/C 1 RXENA 2 GNDA 3 GNDA 4 GNDA 5 VDDB 6 VDDB 7 BUSB 8 BUSB 9 BUSB 10 BUSB 11 DESCRIPTION The HI-1565 and HI-1566 are low power CMOS dual transceivers designed to meet the requirements of the MIL-STD-1553 /1760 specifications. The transmitter section of each bus takes complementary CMOS / TTL Manchester II bi-phase data and converts it to differential voltages suitable for driving the bus isolation transformer. Separate transmitter inhibit control signals are provided for each transmitter. The receiver section of each bus converts the 1553 bus biphase differential data to complementary CMOS / TTL data suitable for inputting to a Manchester decoder. Each receiver has a separate enable input which can be used to force the output of the receiver to a logic 0 (HI-1565) or logic 1 (HI-1566). To minimize the package size for this function, the transmitter outputs are internally connected to the receiver inputs, so that only two pins are required for connection to each coupling transformer. 1565PCI 1565PCT 1566PCI 1566PCT 33 N/C 32 N/C 31 TXINHA 30 RXA 29 RXA 28 N/C 27 N/C 26 TXB 25 TXB 24 TXINHB 23 N/C 44 Pin Plastic 7mm x 7mm Chip-scale package VDDA 1 BUSA 2 BUSA 3 RXENA 4 GNDA 5 VDDB 6 BUSB 7 BUSB 8 RXENB 9 GNDB 10 20 19 18 17 16 15 14 13 12 11 TXA TXA TXINHA RXA RXA TXB TXB TXINHB RXB RXB FEATURES ! Compliant to MIL-STD-1553A & B, MIL-STD-1760, ARINC 708A ! CMOS technology for low standby power ! Smallest footprint available in 44-pin plastic chip-scale package with integral heatsink 20 Pin Plastic ESOIC - WB package N/C 12 N/C 13 N/C 14 N/C 15 RXENB 16 GNDB 17 GNDB 18 GNDB 19 RXB 20 RXB 21 N/C 22 1565PSI 1565PST 1565PSM 1566PSI 1566PST 1566PSM VDDA 1 BUSA 2 BUSA 3 RXENA 4 GNDA 5 VDDB 6 BUSB 7 BUSB 8 RXENB 9 GNDB 10 20 TXA 19 TXA ! Less than 1.0W maximum power dissipation ! BUS pins ESD protected to greater than 8KV ! Also available in DIP and small outline (ESOIC) package options 1565CDI 1565CDT 1565CDM 1566CDI 1566CDT 1566CDM 18 TXINHA 17 RXA 16 RXA 15 TXB 14 TXB 13 TXINHB 12 RXB 11 RXB ! Industrial and extended temperature ranges ! Industry standard pin configurations (DS1565 Rev. F) 20 Pin Ceramic DIP package HOLT INTEGRATED CIRCUITS www.holtic.com 07/09 HI-1565, HI-1566 PIN DESCRIPTIONS PIN (DIP/ESOIC) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 SYMBOL VDDA BUSA BUSA RXENA GNDA VDDB BUSB BUSB RXENB GNDB RXB RXB TXINHB TXB TXB RXA RXA TXINHA TXA TXA FUNCTION power supply analog output analog output digital input power supply power supply analog output analog output digital input power supply digital output digital output digital input digital input digital input digital output digital output digital input digital input digital input +5 volt power for bus A DESCRIPTION MIL-STD-1533 bus driver A, positive signal MIL-STD-1553 bus driver A, negative signal Receiver A enable. If low, forces RXA and RXA low (HI-1565) or High (HI-1566) Ground for bus A +5 volt power for bus B MIL-STD-1533 bus driver B, positive signal MIL-STD-1553 bus driver B, negative signal Receiver B enable. If low, forces RXB and RXB low (HI-1565) or High (HI-1566) Ground for bus B Receiver B output, inverted Receiver B output, non-inverted Transmit inhibit, bus B. If high BUSB, BUSB disabled Transmitter B digital data input, non-inverted Transmitter B digital data input, inverted Receiver A output, inverted Receiver A output, non-inverted Transmit inhibit, bus A. If high BUSA, BUSA disabled Transmitter A digital data input, non-inverted Transmitter A digital data input, inverted FUNCTIONAL DESCRIPTION The HI-1565 family of data bus transceivers contain differential voltage source drivers and differential receivers. They are intended for applications using a MIL-STD-1553 A/B data bus. The device produces a trapezoidal output waveform during transmission. TRANSMITTER Data input to the device’s transmitter section is from the complementary CMOS /TTL inputs TXA/B and TXA/B. The transmitter accepts Manchester II bi-phase data and converts it to differential voltages on BUSA/B and BUSA/B. The transceiver outputs are either direct or transformer coupled to the MIL-STD-1553 data bus. Both coupling methods produce a nominal voltage on the bus of 7.5 volts peak to peak. The transmitter is automatically inhibited and placed in the high impedance state when both TXA/B and TXA/B are either at a logic “1” or logic “0” simultaneously. A logic “1” applied to the TXINHA/B input will force the transmitter to the high impedance state, regardless of the state of TXA/B and TXA/B. RECEIVER The receiver accepts bi-phase differential data from the MIL-STD-1553 bus through the same direct or transformer coupled interface as the transmitter. The receiver’s differential input stage drives a filter and threshold comparator that produces CMOS/TTL data at the RXA/B and RXA/B output pins. Each set of receiver outputs can be independently forced to a logic "0" (HI-1565) or logic “1” (HI-1566) by setting RXENA or RXENB low. MIL-STD-1553 BUS INTERFACE A direct coupled interface (see Figure 2) uses a 1:2.5 ratio isolation transformer and two 55 ohm isolation resistors between the transformer and the bus. In a transformer coupled interface (see Figure 3), the transceiver is connected to a 1:1.79 isolation transformer which in turn is connected to a 1:1.4 coupling transformer. The transformer coupled method also requires two coupling resistors equal to 75% of the bus characteristic impedence (Zo) between the coupling transformer and the bus. HOLT INTEGRATED CIRCUITS 2 HI-1565, HI-1566 Each Bus TRANSMITTER Data Bus Isolation Transformer Coupler Network Direct or Transformer BUSA/B TXA/B Transmit Logic TXA/B TXINHA/B RECEIVER RXA/B Receive Logic RXA/B RXENA/B BUSA/B Slope Control Input Filter Comparator Figure 1. Block Diagram TRANSMIT WAVEFORM - EXAMPLE PATTERN TXA/B TXA/B BUSA/B - BUSA/B RECEIVE WAVEFORMS - EXAMPLE PATTERN Vin (Line to Line) tDR tDR tDR tDR RXA/B tRG tRG RXA/B HOLT INTEGRATED CIRCUITS 3 HI-1565, HI-1566 ABSOLUTE MAXIMUM RATINGS Supply voltage (VDD) Logic input voltage range Receiver differential voltage Driver peak output current Power dissipation at 25°C ceramic DIL, derate Solder Temperature Junction Temperature Storage Temperature -0.3 V to +7 V -0.3 V dc to +5.5 V 10 Vp-p Temperature Range +1.0 A 1.0 W 7mW/°C 275°C for 10 sec. 175°C -65°C to +150°C Industrial Screening.........-40°C to +85°C Hi-Temp Screening........-55°C to +125°C NOTE: Stresses above absolute maximum ratings or outside recommended operating conditions may cause permanent damage to the device. These are stress ratings only. Operation at the limits is not recommended. RECOMMENDED OPERATING CONDITIONS Supply Voltage VDD....................................... 5V... ±5% DC ELECTRICAL CHARACTERISTICS VDD = 5.0V, GND = 0V, TA = Operating Temperature Range (unless otherwise specified). PARAMETER Operating Voltage Total Supply Current SYMBOL VDD ICC1 ICC2 ICC3 CONDITION Not Transmitting Transmit one bus @ 50% duty cycle Transmit one bus @ 100% duty cycle Not Transmitting Transmit one bus @ 100% duty cycle Digital inputs Digital inputs VIH = 4.9V, Digital inputs VIL = 0.1V, Digital inputs IOUT = -0.4mA, Digital outputs IOUT = 4.0mA, Digital outputs MIN 4.75 TYP 5 14 200 400 MAX 5.25 22 340 550 0.11 UNITS V mA mA mA W W V Power Dissipation PD1 PD2 0.70 2.0 1.4 1.4 0.95 Min. Input Voltage Max. Input Voltage Min. Input Current Max. Input Current Min. Output Voltage Max. Output Voltage RECEIVER Input resistance Input capacitance (HI) (LO) (HI) (LO) (HI) (LO) VIH VIL IIH IIL VOH VIH 0.8 20 V µA µA V -20 2.7 0.4 V (Measured at Point “AD“ in Figure 2 unless otherwise specified) RIN CIN CMRR VIN VICM Detect No Detect VTHD VTHND VTHD VTHND 1 Mhz Sine Wave (Measured at Point “AD“ in Figure 2) 1 MHz Sine Wave (Measured at Point “AT“ in Figure 3) Differential -5.0 1.15 Differential Differential 40 9 5.0 20.0 0.28 0.86 14.0 0.20 20 5 Kohm pF dB Vp-p V-pk Vp-p Vp-p Vp-p Vp-p Common mode rejection ratio Input Level Input common mode voltage Threshold Voltage - Direct-coupled Threshold Voltage - Transformer-coupled Detect No Detect HOLT INTEGRATED CIRCUITS 4 HI-1565, HI-1566 DC ELECTRICAL CHARACTERISTICS (cont.) VDD = 5.0V, GND = 0V, TA = Operating Temperature Range (unless otherwise specified). PARAMETER TRANSMITTER Output Voltage SYMBOL CONDITION MIN TYP MAX UNITS (Measured at Point “AD” in Figure 2 unless otherwise specified) Direct coupled Transformer coupled VOUT VOUT VON Direct coupled VDYN VDYN ROUT COUT 35 ohm load (Measured at Point “AD“ in Figure 2) 70 ohm load (Measured at Point “AT“ in Figure 3) Differential, inhibited 35 ohm load (Measured at Point “AD“ in Figure 2) 70 ohm load (Measured at Point “AT“ in Figure 3) Differential, not transmitting 1 MHz sine wave -90 -250 10 15 7.0 20.0 9.0 27.0 10.0 90 250 Vp-p Vp-p mVp-p mV mV Kohm pF Output Noise Output Dynamic Offset Voltage Transformer coupled Output resistance Output Capacitance AC ELECTRICAL CHARACTERISTICS VDD = 5.0V, GND = 0V, TA =Operating Temperature Range (unless otherwise specified). PARAMETER RECEIVER Receiver Delay Receiver gap time Receiver Enable Delay TRANSMITTER Driver Delay Rise time Fall Time Inhibit Delay SYMBOL tDR tRG tREN TEST CONDITIONS From input zero crossing to RXA/B or RXA/B Spacing between RXA/B and RXA/B pulses From RXENA/B rising or falling edge to RXA/B or RXA/B MIN TYP MAX 450 UNITS ns ns ns (Measured at Point “AD” in Figure 2) 90 365 40 (Measured at Point “AD” in Figure 2) tDT tr tf tDI-H tDI-L TXA/B, TXA/B to BUSA/B, BUSA/B 35 ohm load 35 ohm load Inhibited output Active output 100 100 150 300 300 100 150 ns ns ns ns ns TRANSMITTER TXA/B TXA/B TXINHA/B BUSA/B 1:2.5 55 W 35 W Point “AD“ BUSA/B Isolation Transformer 55 W 55 W Point “AD“ 35 W 55 W 2.5:1 RECEIVER RXA/B RXA/B Isolation Transformer RXENA/B Figure 2. Direct Coupled Test Circuits HOLT INTEGRATED CIRCUITS 5 HI-1565, HI-1566 Point “AT” TRANSMITTER TXA/B TXA/B TXINHA/B 52.5 W (.75 Zo) 35 W (.5 Zo) 52.5 W (.75 Zo) BUSA/B 1:1.79 1:1.4 52.5 W (.75 Zo) 35 W (.5 Zo) BUSA/B Isolation Transformer Point “AT” 1.79:1 Coupling Transformer 52.5 W (.75 Zo) 1.4:1 RECEIVER RXA/B RXA/B Coupling Transformer Isolation Transformer RXENA/B Figure 3. Transformer Coupled Test Circuits HEAT SINK - ESOIC & CHIP-SCALE PACKAGE Both the HI-1565PSI/T/M and HI-1566PSI/T/M use a 20-pin thermally enhanced SOIC package. The HI-1565PCI/T and HI-1566PCI/T use a plastic chip-scale package. These packages include a metal heat sink located on the bottom surface of the device. This heat sink should be soldered down to the printed circuit board for optimum thermal dissipation. The heat sink is electrically isolated and may be soldered to any convenient power or ground plane.. THERMAL CHARACTERISTICS PART NUMBER HI-1565PSI / T / M HI-1566PSI / T / M HI-1565CDI / T / M HI-1566CDI / T / M HI-1565PCI / T HI-1566PCI / T PACKAGE STYLE CONDITION Heat sink unsoldered Heat sink soldered Socketed Heat sink unsoldered ØJA 54°C/W 47°C/W 62°C/W 49°C/W JUNCTION TEMPERATURE TA=25°C 62°C 57°C 69°C 59°C TA=85°C TA=125°C 122°C 117°C 129°C 119°C 162°C 157°C 169°C 159°C 20-pin Thermally enhanced plastic SOIC (ESOIC) 20-pin Ceramic side-brazed DIP 44-pin Plastic chipscale package Data taken at VDD=5.0V, continuous transmission at 1Mbit/s, single transmitter enabled. APPLICATIONS NOTE Holt Applications Note AN-500 provides circuit design notes regarding the use of Holt's family of MIL-STD-1553 transceivers. Layout considerations, as well as recommended interface and protection components are included. HOLT INTEGRATED CIRCUITS 6 HI-1565, HI-1566 ORDERING INFORMATION HI - 156x xx x x (Plastic) PART NUMBER LEAD FINISH Blank F PART NUMBER Tin / Lead (Sn / Pb) Solder 100% Matte Tin (Pb-free, RoHS compliant) TEMPERATURE RANGE FLOW BURN IN I T M PART NUMBER -40°C TO +85°C -55°C TO +125°C -55°C TO +125°C PACKAGE DESCRIPTION I T M NO NO YES PC PS PART NUMBER 44 PIN PLASTIC CHIP-SCALE LPCC (44PCS) not available with ‘M’ flow 20 PIN PLASTIC ESOIC, Thermally Enhanced Wide SOIC w/Heat Sink (20HWE) RXENA = 0 RXENB = 0 RXA RXA RXB RXB 1565 1566 0 1 0 1 0 1 0 1 HI - 156xCD x (Ceramic) PART NUMBER TEMPERATURE RANGE FLOW BURN IN LEAD FINISH I T M PART NUMBER -40°C TO +85°C -55°C TO +125°C -55°C TO +125°C I T M NO NO YES Gold (Pb-free, RoHS compliant) Gold (Pb-free, RoHS compliant) Tin / Lead (Sn / Pb) Solder RXENA = 0 RXENB = 0 PACKAGE RXA RXA RXB RXB DESCRIPTION 1565CD 1566CD 0 1 0 1 0 1 0 1 20 PIN CERAMIC SIDE BRAZED DIP (20C) 20 PIN CERAMIC SIDE BRAZED DIP (20C) RECOMMENDED TRANSFORMERS The HI-1565 and HI-1566 transceivers have been characterized for compliance with the electrical requirements of MIL-STD-1553 when used with the following MANUFACTURER Premier Magnetics Technotrol Premier Magnetics Technotrol transformers. Holt recommends the Premier Magnetics parts as offering the best combination of electrical performance, low cost and small footprint. TURNS RATIO(S) Dual tapped 1:1.79, 1:2.5 Dual tapped 1:1.79, 1:2.5 1:1.4 1:1.4 PART NUMBER PM-DB2725EX TL1553-45 PM-DB2702 TQ1553-2 APPLICATION Isolation Isolation Stub coupling Stub coupling DIMENSIONS .500 x .500 x .375 inches .630 x 630 x .155 inches .625 x .625 x .250 inches .625 x .625 x .250 inches HOLT INTEGRATED CIRCUITS 7 HI-1565, HI-1566 REVISION HISTORY Document DS1565 Rev. Date E F 09/26/08 07/24/09 Description of Change Clarification of transmitter and receiver functions in Description, clarified available temperature ranges, and corrected a dimension in Recommended Transformers table. Corrected typographical errors in package dimensions. HOLT INTEGRATED CIRCUITS 8 PACKAGE DIMENSIONS 20-PIN PLASTIC SMALL OUTLINE (ESOIC) - WB (Wide Body, Thermally Enhanced) .0105 ± .0015 (.267 ± .038) inches (millimeters) Package Type: 20HWE .504 ± .008 (12.79 ± .19) .290 typ (7.37) .407 ± .013 (10.325 ± .32) Top View .295 ± .002 (7.493 ± .05) .205 typ (5.21) Bottom View See Detail A .0165 ± .0035 (.419 ± .089) .090 ± .01 (2.29 ± .25) Electrically isolated heat sink pad on bottom of package. Connect to any ground or power plane for optimum thermal dissipation. .050 BSC (1.27) BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) 0° to 8° .033 ± .017 (.838 ± .432) .0075 ± .004 (.191 ± .089) Detail A 20-PIN CERAMIC SIDE-BRAZED DIP 1.000 ±.010 (25.400 ±.254) .310 ±.010 (7.874 ±.254) .050 TYP. (1.270 TYP.) .200 max (5.080) .085 ±.009 (2.159 ± .229) inches (millimeters) Package Type: 20C .300 ± .010 (7.620 ± .254) .125 min (3.175) .017 ±.002 (.432 ±.051) .100 BSC (2.54) .010 + 002/-.001 . (.254 ±.051/.025) BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) HOLT INTEGRATED CIRCUITS 9 PACKAGE DIMENSIONS 44-PIN PLASTIC CHIP-SCALE PACKAGE .276 BSC (7.00) inches (millimeters) Package Type: 44PCS .203 ± .006 (5.15 ± .15) .020 BSC (0.50) .276 BSC (7.00) Top View .203 ± .006 (5.15 ± .15) Bottom View .010 (0.25) typ .039 max (1.00) .008 typ (0.2) Electrically isolated heat sink pad on bottom of package. Connect to any ground or power plane for optimum thermal dissipation. .016 ± .002 (0.40 ± .05) BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) HOLT INTEGRATED CIRCUITS 10