HI-1573PSM

HI-1573, HI-1574 January 2007 MIL-STD-1553 3.3V Monolithic Dual Transceivers PIN CONFIGURATIONS 44 43 BUSA 42 BUSA 41 BUSA 40 BUSA 39 VDDA 38 VDDA 37 TXA 36 TXA 35 34 -1 RXENA 2 GNDA 3 GNDA 4 GNDA 5 VDDB 6 VDDB 7 BUSB 8 BUSB 9 BUSB 10 BUSB 11 DESCRIPTION The HI-1573 and HI-1574 are low power CMOS dual transceivers designed to meet the requirements of the MIL-STD-1553 specification. The transmitter section of each channel takes complementary CMOS / TTL digital input data and converts it to bi-phase Manchester encoded 1553 signals suitable for driving the bus isolation transformer. Separate transmitter inhibit control signals are provided for each transmitter. The receiver section of the each channel converts the 1553 bus bi-phase data to complementary CMOS / TTL data suitable for inputting to a Manchester decoder. Each receiver has a separate enable input which can be used to force the output of the receiver to a logic "0" (HI-1573) or logic 1 (HI-1574). To minimize the package size for this function, the transmitter outputs are internally connected to the receiver inputs, so that only two pins are required for connection to each coupling transformer. For designs requiring independent access to transmitter and receiver 1553 signals, please contact your Holt Sales representative. 1573PCI 1573PCT 1574PCI 1574PCT 33 32 31 TXINHA 30 RXA 29 RXA 28 27 26 TXB 25 TXB 24 TXINHB 23 - 44 Pin Plastic 7mm x 7mm Chip-scale package VDDA 1 BUSA 2 BUSA 3 RXENA 4 GNDA 5 VDDB 6 BUSB 7 BUSB 8 RXENB 9 GNDB 10 20 19 18 17 16 15 14 13 12 11 TXA TXA TXINHA RXA RXA TXB TXB TXINHB RXB RXB FEATURES ! Compliant to MIL-STD-1553A & B, ARINC 708A ! 3.3V single supply operation ! Smallest footprint available in 20 pin plastic ESOIC (thermally enhanced SOIC) package 20 Pin Plastic ESOIC - WB package VDDA 1 BUSA 2 BUSA 3 RXENA 4 GNDA 5 VDDB 6 BUSB 7 BUSB 8 RXENB 9 GNDB 10 20 TXA 19 TXA ! Less than 0.5W maximum power dissipation ! 7 mm x 7 mm 44-pin plastic chip-scale package ! Available in DIP and small outline (ESOIC) package options ! Military processing options ! Industry standard pin configurations (DS1573 Rev.I) 20 Pin Ceramic DIP package 01/07 HOLT INTEGRATED CIRCUITS www.holtic.com RXENB GNDB GNDB GNDB RXB RXB - 12 13 14 15 16 17 18 19 20 21 22 1573PSI 1573PST 1573PSM 1574PSI 1574PST 1574PSM 1573CDI 1573CDT 1573CDM 1574CDI 1574CDT 1574CDM 18 TXINHA 17 RXA 16 RXA 15 TXB 14 TXB 13 TXINHB 12 RXB 11 RXB HI-1573, HI-1574 PIN DESCRIPTIONS PIN (DIP & SOIC) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 SYMBOL VDDA BUSA BUSA RXENA GNDA VDDB BUSB BUSB RXENB GNDB RXB RXB TXINHB TXB TXB RXA RXA TXINHA TXA TXA FUNCTION power supply analog output analog output digital input power supply power supply analog output analog output digital input power supply digital output digital output digital input digital input digital input digital output digital output digital input digital input digital input DESCRIPTION +3.3 volt power for transceiver A MIL-STD-1533 bus driver A, positive signal MIL-STD-1553 bus driver A, negative signal Receiver A enable. If low, forces RXA and RXA low (HI-1573) or High (HI-1574) Ground for transceiver A +3.3 volt power for transceiver B MIL-STD-1533 bus driver B, positive signal MIL-STD-1553 bus driver B, negative signal Receiver B enable. If low, forces RXB and RXB low (HI-1573) or High (HI-1574) Ground for transceiver B Receiver B output, inverted Receiver B output, non-inverted Transmit inhibit, bus B. If high BUSB, BUSB disabled Transmitter B digital data input, non-inverted Transmitter B digital data input, inverted Receiver A output, inverted Receiver A output, non-inverted Transmit inhibit, bus A. If high BUSA, BUSA disabled Transmitter A digital data input, non-inverted Transmitter A digital data input, inverted FUNCTIONAL DESCRIPTION The HI-1573 family of data bus transceivers contains differential voltage source drivers and differential receivers. They are intended for applications using a MIL-STD-1553 A/B data bus. The device produces a trapezoidal output waveform during transmission. TRANSMITTER Data input to the device’s transmitter section is from the complementary CMOS inputs TXA/B and TXA/B. The transmitter accepts Manchester II bi-phase data and converts it to differential voltages on BUSA/B and BUSA/B. The transceiver outputs are either direct or transformer coupled to the MIL-STD-1553 data bus. Both coupling methods produce a nominal voltage on the bus of 7.5 volts peak to peak. The transmitter is automatically inhibited and placed in the high impedance state when both TXA/B and TXA/B are either at a logic “1” or logic “0” simultaneously. A logic “1” applied to the TXINHA/B input will force the transmitter to the high impedance state, regardless of the state of TXA/B and TXA/B. RECEIVER The receiver accepts bi-phase differential data from the MIL-STD-1553 bus through the same direct or transformer coupled interface as the transmitter. The receiver’s differential input stage drives a filter and threshold comparator that produces CMOS data at the RXA/B and RXA/B output pins. Each set of receiver outputs can be independently forced to a logic "0" (HI-1573) or logic “1” (HI-1574) by setting RXENA or RXENB low. MIL-STD-1553 BUS INTERFACE A direct coupled interface (see Figure 2) uses a 1:2.5 ratio isolation transformer and two 55 ohm isolation resistors between the transformer and the bus. In a transformer coupled interface (see Figure 3), the transceiver is connected to a 1:1.79 isolation transformer which in turn is connected to a 1:1.4 coupling transformer. The transformer coupled method also requires two coupling resistors equal to 75% of the bus characteristic impedence (Zo) between the coupling transformer and the bus. HOLT INTEGRATED CIRCUITS 2 HI-1573, HI-1574 Each Channel TRANSMITTER Data Bus Isolation Transformer Coupler Network Direct or Transformer BUSA/B TXA/B Transmit Logic TXA/B TXINHA/B RECEIVER RXA/B Receive Logic RXA/B RXENA/B BUSA/B Slope Control Input Filter Comparator Figure 1. Block Diagram TRANSMIT WAVEFORM - EXAMPLE PATTERN TXA/B TXA/B BUSA/B - BUSA/B RECEIVE WAVEFORMS - EXAMPLE PATTERN Vin (Line to Line) tDR tDR tDR tDR RXA/B tRG tRG RXA/B HOLT INTEGRATED CIRCUITS 3 HI-1573, HI-1574 ABSOLUTE MAXIMUM RATINGS Supply voltage (VDD) Logic input voltage range Receiver differential voltage Driver peak output current Power dissipation at 25°C ceramic DIL, derate Solder Temperature Junction Temperature Storage Temperature -0.3 V to +5 V -0.3 V dc to +3.6 V 10 Vp-p Temperature Range +1.0 A 1.0 W 7mW/°C 275°C for 10 sec. 175°C -65°C to +150°C Industrial Screening.........-40°C to +85°C Hi-Temp Screening........-55°C to +125°C Military Screening..........-55°C to +125°C NOTE: Stresses above absolute maximum ratings or outside recommended operating conditions may cause permanent damage to the device. These are stress ratings only. Operation at the limits is not recommended. RECOMMENDED OPERATING CONDITIONS Supply Voltage VDD....................................... 3.3V... ±5% DC ELECTRICAL CHARACTERISTICS VDD = 3.3 V, GND = 0V, TA = Operating Temperature Range (unless otherwise specified). PARAMETER Operating Voltage Total Supply Current SYMBOL VDD ICC1 ICC2 ICC3 CONDITION Not Transmitting Transmit one channel @ 50% duty cycle Transmit one channel @ 100% duty cycle Not Transmitting Transmit one channel @ 100% duty cycle Digital inputs Digital inputs Digital inputs Digital inputs IOUT = -1.0mA, Digital outputs IOUT = 1.0mA, Digital outputs MIN 3.15 TYP 3.30 4 225 425 MAX 3.45 10 250 500 0.06 UNITS V mA mA mA W W VDD Power Dissipation PD1 PD2 0.3 70% 0.5 Min. Input Voltage Max. Input Voltage Min. Input Current Max. Input Current Min. Output Voltage Max. Output Voltage RECEIVER Input resistance Input capacitance (HI) (LO) (HI) (LO) (HI) (LO) VIH VIL IIH IIL VOH VIH 30% 20 -20 90% 10% VDD µA µA VDD VDD (Measured at Point “AD“ in Figure 2 unless otherwise specified) RIN CIN CMRR VIN VICM Detect No Detect VTHD VTHND VTHD VTHND 1 Mhz Sine Wave (Measured at Point “AD“ in Figure 2) 1 MHz Sine Wave (Measured at Point “AT“ in Figure 3) Differential -5.0 1.15 Differential Differential 40 9 5.0 20.0 0.28 0.86 14.0 0.20 20 5 Kohm pF dB Vp-p V-pk Vp-p Vp-p Vp-p Vp-p Common mode rejection ratio Input Level Input common mode voltage Threshold Voltage - Direct-coupled Theshold Voltage - Transformer-coupled = Detect No Detect HOLT INTEGRATED CIRCUITS 4 HI-1573, HI-1574 DC ELECTRICAL CHARACTERISTICS (cont.) VDD = 3.3 V, GND = 0V, TA = Operating Temperature Range (unless otherwise specified). PARAMETER TRANSMITTER Output Voltage SYMBOL CONDITION MIN TYP MAX UNITS (Measured at Point “AD” in Figure 2 unless otherwise specified) Direct coupled Transformer coupled VOUT VOUT VON Direct coupled VDYN VDYN ROUT COUT 35 ohm load (Measured at Point “AD“ in Figure 2) 70 ohm load (Measured at Point “AT“ in Figure 3) Differential, inhibited 35 ohm load (Measured at Point “AD“ in Figure 2) 70 ohm load (Measured at Point “AT“ in Figure 3) Differential, not transmitting 1 MHz sine wave -90 -250 10 15 .6.0 .18.0 9.0 27.0 10.0 90 250 Vp-p Vp-p mVp-p mV mV Kohm pF Output Noise Output Dynamic Offset Voltage Transformer coupled Output resistance Output Capacitance AC ELECTRICAL CHARACTERISTICS VDD = 3.3 V, GND = 0V, TA =Operating Temperature Range (unless otherwise specified). PARAMETER RECEIVER Receiver Delay Receiver gap time Receiver Enable Delay TRANSMITTER Driver Delay Rise time Fall Time Inhibit Delay SYMBOL tDR tRG TEST CONDITIONS From input zero crossing to RXA/B or RXA/B Spacing between RXA/B and RXA/B pulses From RXENA/B rising or falling edge to RXA/B or RXA/B MIN TYP MAX 500 Note 3 UNITS ns ns (Measured at Point “AT” in Figure 3) 60 Note 1 430 Note 2 40 tREN ns (Measured at Point “AD” in Figure 2) tDT tr tf tDI-H tDI-L TXA/B, TXA/B to BUSA/B, BUSA/B 35 ohm load 35 ohm load Inhibited output Active output 100 100 150 300 300 100 150 ns ns ns ns ns Note 1. Measured using a 1 MHz sinusoid, 20 V peak to peak, line to line at point “AT” (Guaranteed but not tested). Note 2. Measured using a 1 MHz sinusoid, 860 mV peak to peak, line to line at point “AT” (100% tested). Note 3. Measured using a 1 MHz sinusoid, 860 mV peak to peak, line to line at point “AT”. Measured from input zero crossing point. TRANSMITTER TXA/B TXA/B TXINHA/B 55 W Point “AD“ 35 W BUSA/B 1:2.5 55 W 35 W Point “AD“ BUSA/B Isolation Transformer 2.5:1 55 W RECEIVER RXA/B RXA/B 55 W Isolation Transformer RXENA/B Figure 2. Direct Coupled Test Circuits HOLT INTEGRATED CIRCUITS 5 HI-1573, HI-1574 TRANSMITTER TXA/B TXA/B TXINHA/B 52.5 W (.75 Zo) 35 W (.5 Zo) 52.5 W (.75 Zo) BUSA/B 1:1.79 Point “AT” 1:1.4 52.5 W (.75 Zo) 35 W (.5 Zo) BUSA/B Isolation Transformer Point “AT” 1.79:1 Coupling Transformer 52.5 W (.75 Zo) 1.4:1 RECEIVER RXA/B RXA/B Coupling Transformer Isolation Transformer RXENA/B Figure 3. Transformer Coupled Test Circuits HEAT SINK - ESOIC & CHIP-SCALE PACKAGE Both the HI-1573PSI/T/M and HI-1574PSI/T/M use a 20pin thermally enhanced SOIC package. The HI1573PCI/T and HI-1574PCI/T use a plastic chip-scale package. These packages include a metal heat sink located on the bottom surface of the device. This heat sink should be soldered down to the printed circuit board for optimum thermal dissipation. The heat sink is electrically isolated and may be soldered to any convenient power or ground plane.. APPLICATIONS NOTE Holt Applications Note AN-500 provides circuit design notes regarding the use of Holt's family of MIL-STD-1553 transceivers. Layout considerations, as well as recommended interface and protection components are included. THERMAL CHARACTERISTICS PART NUMBER HI-1573PSI / T / M HI-1574PSI / T / M HI-1573CDI / T / M HI-1574CDI / T / M HI-1573PCI / T HI-1574PCI / T PACKAGE STYLE CONDITION Heat sink unsoldered Heat sink soldered Socketed Heat sink unsoldered ØJA 54°C/W 47°C/W 62°C/W 49°C/W JUNCTION TEMPERATURE TA=25°C 52°C 49°C 56°C 50°C TA=85°C TA=125°C 112°C 109°C 116°C 110°C 152°C 149°C 156°C 150°C 20-pin Thermally enhanced plastic SOIC (ESOIC) 20-pin Ceramic side-brazed DIP 44-pin Plastic chipscale package Data taken at VDD=3.3V, continuous transmission at 1Mbit/s, single transmitter enabled. HOLT INTEGRATED CIRCUITS 6 HI-1573, HI-1574 ORDERING INFORMATION HI - 157x xx x x (Plastic) PART NUMBER LEAD FINISH Blank F PART NUMBER Tin / Lead (Sn / Pb) Solder 100% Matte Tin (Pb-free, RoHS compliant) TEMPERATURE RANGE FLOW BURN IN I T M PART NUMBER -40°C TO +85°C -55°C TO +125°C -55°C TO +125°C PACKAGE DESCRIPTION I T M NO NO YES PC PS PART NUMBER 44 PIN PLASTIC CHIP-SCALE (LPCC) 20 PIN PLASTIC ESOIC (Wide Body, Thermally Enhanced SOIC w/Heat Sink) RXENA = 0 RXENB = 0 RXA RXA RXB RXB 1573 1574 0 1 0 1 0 1 0 1 HI - 157xCD x (Ceramic) PART NUMBER TEMPERATURE RANGE FLOW BURN IN LEAD FINISH I T M PART NUMBER -40°C TO +85°C -55°C TO +125°C -55°C TO +125°C I T M NO NO YES Gold (Pb-free, RoHS compliant) Gold (Pb-free, RoHS compliant) Tin / Lead (Sn / Pb) Solder RXENA = 0 RXENB = 0 PACKAGE RXA RXA RXB RXB DESCRIPTION 1573CD 1574CD 0 1 0 1 0 1 0 1 20 PIN CERAMIC SIDE BRAZED DIP 20 PIN CERAMIC SIDE BRAZED DIP RECOMMENDED TRANSFORMERS The HI-1573 and HI-1574 transceivers have been characterized for compliance with the electrical requirements of MIL-STD-1553 when used with the following MANUFACTURER Technotrol Premier Magnetics Technotrol Premier Magnetics transformers. Holt recommends the Premier Magnetics parts as offering the best combination of electrical performance, low cost and small footprint. TURNS RATIO(S) Dual tapped 1:1.79, 1:2.5 Dual tapped 1:1.79, 1:2.5 1:1.4 1:1.4 PART NUMBER TL1553-45 PM-DB2725EX TQ1553-2 PM-DB2702 APPLICATION Isolation Isolation Stub coupling Stub coupling DIMENSIONS .630 x 630 x .155 inches .500 x .500 x .375 inches .625 x .625 x .250 inches .625 x .500 x .250 inches HOLT INTEGRATED CIRCUITS 7 PACKAGE DIMENSIONS inches (millimeters) 20-PIN PLASTIC SMALL OUTLINE (ESOIC) - WB (Wide Body, Thermally Enhanced) .0105 ± .0015 (.2667 ± .0381) Heat sink stud on bottom of package. Package Type: 24HEW .5035 ± .0075 (12.789 ± .191) .300 TYP. (7.620) .025 Min.. (.635) .4065 ± .0125 (10.325 ± .318) Top View .296 ± .003 (7.518 ± .076) .215 TYP. (5.461) Bottom View .018 TYP. (.457) SEE DETAIL A .025 Min.. (.635) .090 ± .010 (2.286 ± .254) 0° to 8° .050 TYP (1.27) .033 ± .017 (.838 ± .432) DETAIL A .0075 ± .0035 (.191 ± .889) 20-PIN CERAMIC SIDE-BRAZED DIP PACKAGE TYPE: 20C 1.000 ± .010 (25.400 ± .254) .310 ± .010 (7.874 ± .254) .050 TYP. (1.270 TYP.) .200 MAX. (5.080 MAX.) .085 ± .009 (2.159 ± .229) .300 ± .010 (7.620 ± .254) .125 MIN. (3.175 MIN.) .017 ± .002 (.432 ± .051) .100 ± .005 (2.540 ± .127) .010 + .002/- .001 (.254 + .051/- .025) HOLT INTEGRATED CIRCUITS 8 PACKAGE DIMENSIONS millimeters 44-PIN PLASTIC CHIP-SCALE PACKAGE Heat sink stud on bottom of package. 7.00 ± .10 5.65 ± .15 0.50 7.00 ± .10 5.65 ± .15 0.25 typ 0.40 ± .05 0.90 ± .10 0.2 typ HOLT INTEGRATED CIRCUITS 9