HI-3282
GENERAL DESCRIPTION
The HI-3282 is a silicon gate CMOS device for interfacing the ARINC 429 serial data bus to a 16-bit parallel data bus. Two receivers and an independent transmitter are provided. The receiver input circuitry and logic are designed to meet the ARINC 429 specifications for loading, level detection, timing, and protocol. The transmitter section provides the ARINC 429 communication protocol. Additional interface circuitry such as the Holt HI-8382 or HI8585 are required to translate the 5 volt logic outputs to ARINC 429 drive levels. The 16-bit parallel data bus exchanges the 32-bit ARINC data word in two steps when either loading the transmitter or interrogating the receivers. The data bus interfaces with CMOS and TTL. Timing of all the circuitry begins with the master clock input, CLK. For ARINC 429 applications, the master clock frequency is 1 MHz. Each independent receiver monitors the data stream with a sampling rate 10 times the data rate. The sampling rate is software selectable at either 1MHz or 125KHz. The results of a parity check are available as the 32nd ARINC bit. The transmitter has a First In, First Out (FIFO) memory to store 8 ARINC words for transmission. The data rate of the transmitter is software selectable by dividing the master clock, CLK, by either 10 or 80. The master clock is used to set the timing of the ARINC transmission within the required resolution.
FEATURES
! ARINC specification 429 compatible ! Compatible with Industry-standard alternate Parts ! Small footprint 44 PQFP package option ! 16-Bit parallel data bus ! Direct receiver interface to ARINC bus ! Timing control 10 times the data rate ! Selectable data clocks ! Automatic transmitter data timing ! Self test mode ! Parity functions ! Low power, single 5 volt supply ! Industrial & full military temperature ranges
N/C - 1 D/R1 - 2 D/R2 - 3 SEL - 4 EN1 - 5 EN2 - 6 BD15 - 7 BD14 - 8 BD13 - 9 BD12 - 10 BD11 - 11
HI-3282PQI & HI-3282PQT
33 - N/C 32 - N/C 31 - CWSTRX 30 - ENTX 29 - 429DO 28 -429DO 27 - TX/R 26 - PL2 25 - PL1 24 - BD00 23 - BD01
APPLICATIONS
! Avionics data communication ! Serial to parallel conversion ! Parallel to serial conversion
(DS3282 Rev. E)
HOLT INTEGRATED CIRCUITS 1
05/01
HI-3282
PIN DESCRIPTION
SYMBOL
VCC 429DI1 (A) 429DI1 (B) 429DI2 (A) 429DI2 (B) D/R1 D/R2 SEL EN1 EN2 BD15 BD14 BD13 BD12 BD11 BD10 BD09 BD08 BD07 BD06 GND BD05 BD04 BD03 BD02 BD01 BD00 PL1 PL2 TX/R 429DO 429DO ENTX CWSTR CLK TX CLK MR DBCEN
FUNCTION
POWER INPUT INPUT INPUT INPUT OUTPUT OUTPUT INPUT INPUT INPUT I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O POWER I/O I/O I/O I/O I/O I/O INPUT INPUT OUTPUT OUTPUT OUTPUT INPUT INPUT INPUT OUTPUT INPUT INPUT +5V ±5%
DESCRIPTION
ARINC receiver 1 positive input ARINC receiver 1 negative input ARINC receiver 2 positive input ARINC receiver 2 negative input Receiver 1 data ready flag Receiver 2 data ready flag Receiver data byte selection (0 = BYTE 1) (1 = BYTE 2) Data Bus control, enables receiver 1 data to outputs Data Bus control, enables receiver 2 data to outputs if EN1 is high Data Bus Data Bus Data Bus Data Bus Data Bus Data Bus Data Bus Data Bus Data Bus Data Bus 0V Data Bus Data Bus Data Bus Data Bus Data Bus Data Bus Latch enable for byte 1 entered from data bus to transmitter FIFO. Latch enable for byte 2 entered from data bus to transmitter FIFO. Must follow PL1. Transmitter ready flag. Goes low when ARINC word loaded into FIFO. Goes high after transmission and FIFO empty. "ONES" data output from transmitter. "ZEROES" data output from transmitter. Enable Transmission Clock for control word register Master Clock input Transmitter Clock equal to Master Clock (CLK), divided by either 10 or 80. Master Reset, active low Data bit control Enable. (Active low, with internal pull up to VDD).
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HI-3282
FUNCTIONAL DESCRIPTION
CONTROL WORD REGISTER
The HI-3282 contains 11 data flip flops whose D inputs are connected to the data bus and clocks connected to CWSTR. Each flip flop provides options to the user as follows:
DATA BUS PIN
BD04
DATA BUS
ARINC 429 DATA FORMAT
The following table shows the bit positions in exchanging data with the receiver or the transmitter. ARINC bit 1 is the first bit transmitted or received. BYTE 1
BD BD BD BD BD BD BD BD BD BD BD BD BD BD BD BD 15 14 13 12 11 10 09 08 07 06 05 04 03 02 01 00 13 12 11 10 9 31 30 32 1 2 3 4 5 6 7 8
FUNCTION CONTROL
PAREN
DESCRIPTION
Enables parity bit insertion into Transmitter data bit 32 If enabled, an internal connection is made passing 429DO and 429DO to the receiver logic inputs If enabled, ARINC bits 9 and, 10 must match the next two control word bits If Receiver 1 Decoder is enabled, the ARINC bit 9 must match this bit If Receiver 1 Decoder is enabled, the ARINC bit 10 must match this bit If enabled, ARINC bits 9 and 10 must match the next two control word bits If Receiver 2 Decoder is enabled, then ARINC bit 9 must match this bit If Receiver 2 Decoder is enabled, then ARINC bit 10 must match this bit Logic 0 enables normal odd parity and Logic 1 enables even parity output in transmitter 32nd bit CLK is divided either by 10 or 80 to obtain XMTR data clock CLK is divided either by 10 or 80 to obtain RCVR data clock
ARINC BIT
BYTE 2
DATA BUS ARINC BIT BD BD BD BD BD BD BD BD BD BD BD BD BD BD BD BD 15 14 13 12 11 10 09 08 07 06 05 04 03 02 01 00 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14
BDO5
SELF TEST
0 = ENABLE
BDO6
RECEIVER 1 DECODER
1 = ENABLE
BDO7
-
-
THE RECEIVERS
ARINC BUS INTERFACE
Figure 1 shows the input circuit for each receiver. The ARINC 429 specification requires the following detection levels:
BDO8
-
-
BDO9
RECEIVER 2 DECODER
1 = ENABLE
BD10
-
-
STATE ONE NULL ZERO
DIFFERENTIAL VOLTAGE +6.5 Volts to +13 Volts +2.5 Volts to -2.5 Volts -6.5 Volts to -13 Volts
BD11
-
-
The HI-8382 guarantees recognition of these levels with a common mode Voltage with respect to GND less than ±5V for the worst case condition (4.75V supply and 13V signal level). The tolerances in the design guarantee detection of the above levels, so the actual acceptance ranges are slightly larger. If the ARINC signal is out of the actual acceptance ranges, including the nulls, the chip rejects the data.
BD12
INVERT XMTR PARITY XMTR DATA CLK SELECT RCVR DTA CLK SELECT
1 = ENABLE
BD13
0 = ÷10 1 = ÷80 0 = ÷10 1 = ÷80
BD14
HOLT INTEGRATED CIRCUITS 3
HI-3282
FUNCTIONAL DESCRIPTION (con't)
RECEIVER LOGIC OPERATION
Figure 2 shows a block diagram of the logic section of each receiver.
RETRIEVING DATA
Once 32 valid bits are recognized, the receiver logic generates an End of Sequence (EOS). If the receiver decoder is enabled and the 9th and 10th ARINC bits match the control word program bits or if the receiver decoder is disabled, then EOS clocks the data ready flag flip flop to a "1", D/R1 or D/R2 (or both) will go low. The data flag for a receiver will remain low until after both ARINC bytes from that receiver are retrieved. This is accomplished by activating EN with SEL, the byte selector, low to retrieve the first byte and activating EN with SEL high to retrieve the second byte. ENI retrieves data from receiver 1 and EN2 retrieves data from receiver 2. If another ARINC word is received, and a new EOS occurs before the two bytes are retrieved, the data is overwritten by the new word.
BIT TIMING
The ARINC 429 specification contains the following timing specification for the received data: HIGH SPEED LOW SPEED 100K BPS ± 1% 12K -14.5K BPS 1.5 ± 0.5 µsec 10 ± 5 µsec 1.5 ± 0.5 µsec 10 ± 5 µsec 5 µsec ± 5% 34.5 to 41.7 µsec
BIT RATE PULSE RISE TIME PULSE FALL TIME PULSEWIDTH
RECEIVER PARITY
The receiver parity circuit counts Ones received, including the parity bit, ARINC bit 32. If the result is odd, then "0" will appear in the 32nd bit.
TO PINS SEL EN D/R DECODER CONTROL BITS
MUX CONTROL
32 TO 16 DRIVER
CONTROL BIT BD14
CLOCK OPTION
CLOCK
CLK
/
LATCH ENABLE CONTROL BITS 9 & 10
32 BIT LATCH BIT COUNTER AND END OF SEQUENCE
32 BIT SHIFT REGISTER
DATA
PARITY CHECK
32ND BIT
BIT CLOCK
EOS
EOS
ONES
WORD GAP
WORD GAP TIMER
BIT CLOCK
SHIFT REGISTER
START
END
NULL
SHIFT REGISTER
SEQUENCE CONTROL
ZEROS
SHIFT REGISTER
ERROR
ERROR DETECTION
CLOCK
FIGURE 2.
RECEIVER BLOCK DIAGRAM
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HI-3282
TRANSMITTER PARITY
TRANSMITTER
A block diagram of the transmitter section is shown in Figure 3.
Control register bit BD04 (PAREN) enables parity bit insertion into transmitter data bit 32. Parity is always inserted if DBCEN is open or high. If DBCEN is low, logic 0 on PAREN inserts data on bit 32, and logic 1 on PAREN inserts parity on bit 32. The parity generator counts the ONES in the 31-bit word. If the BD12 control word bit is set low, the 32nd bit transmitted will make parity odd. If the control bit is high the parity is even.
FIFO OPERATION
The FIFO is loaded sequentially by first pulsing PL1 to load byte 1 and then PL2 to load byte 2. The control logic automatically loads the 31 bit word in the next available position of the FIFO. If TX/R, the transmitter ready flag is high (FIFO empty), then 8 words, each 31 bits long, may be loaded. If TX/R is low, then only the available positions may be loaded. If all 8 positions are full, the FIFO ignores further attempts to load data.
SELF TEST
If the BD05 control word bit is set low, 429DO or 429DO become inputs to the receivers bypassing the interface circuitry. 429DO and 429DO outputs remain active during self test.
DATA TRANSMISSION
When ENTX goes high, enabling transmission, the FIFO positions are incremented with the top register loading into the data transmission shift register. Within 2.5 data clocks the first data bit appears at either 429DO or 429DO. The 31 bits in the data transmission shift register are presented sequentially to the outputs in the ARINC 429 format with the following timing: HIGH SPEED 10 Clocks 5 Clocks 5 Clocks 40 Clocks LOW SPEED 80 Clocks 40 Clocks 40 Clocks 320 Clocks
SYSTEM OPERATION
The two receivers are independent of the transmitter. Therefore, control of data exchanges are strictly at the option of the user. The only restrictions are: 1. The received data may be overwritten if not retrieved within one ARINC word cycle. 2. The FIFO can store 8 words maximum and ignores attempts to load addition data if full. 3. Byte 1 of the transmitter data must be loaded first. 4. Either byte of the received data may be retrieved first. Both bytes must be retrieved to clear the data ready flag. 5. After ENTX, transmission enable, goes high it cannot go low until TX/R, transmitter readyflag, goes high. Otherwise, one ARINC word is lost during transmission.
ARINC DATA BIT TIME DATA BIT TIME NULL BIT TIME WORD GAP TIME
The word counter detects when all loaded positions are transmitted and sets the transmitter ready flag, TX/R, high.
HOLT INTEGRATED CIRCUITS 5
HI-3282
time as EN, the byte will also be placed into the transmitter FIFO. SEL is then taken high and EN is strobed again to place the upper byte of the data word on the data bus. By strobing PL2 at the same time as EN, the second byte will also be placed into the FIFO. The data word is now ready to be transmitted according to the parity programmed into the control word register. In normal operation, either byte of a received data word may be read from the receiver latches first by use of SEL input. During repeater operation however, the lower byte of the data word must be read first. This is necessary because, as the data is being read, it is also being loaded into the FIFO and the transmitter FIFO is always loaded with the lower byte of the data word first.
REPEATER OPERATION
The repeater mode of operation allows a data word that has been received by the HI-3282 to be placed directly into its FIFO for transmission. After a 32-bit word has been shifted into the receiver shift register, the D/R flag will go low. A logic "0" is placed on the SEL line and EN is strobed. This is the same procedure as for normal receiver operation and it places the lower byte (16) of the data word on the d a t a bus. By strobing P L 1 at the same
429DO
ARINC BIT
429DO
DATA NULL DATA NULL DATA NULL
BIT 30
BIT 31
BIT 32
WORD GAP
BIT 1 NEXT WORD
DATA BUS
VALID
tCWSET t CWHLD
CWSTR
t CWSTR
t D/R
t END/R t EN t SELEN tENSEL tENEN tDATAEN t ENDATA tSELEN tENSEL
tD/REN
DATA BUS
t DATAEN
tENDATA
HOLT INTEGRATED CIRCUITS 6
HI-3282
DATA BUS
BYTE 1 VALID
BYTE 2 VALID
tDWSET
PL1
tDWHLD
tDWSET
tDWHLD tPL12
t PL
PL2
tPL12
TX/R
t PL
tTX/R
PL2
tDTX/R tPL2EN
TX/R
ENTX
tENDAT
429DO or 429DO
ARINC BIT
tENTX/R
DATA BIT 2 DATA BIT 32
DATA BIT 1
429DI
BIT 32
tEND/R
D/R
t D/R
EN
t D/REN
t EN
tENEN
t EN
t SELEN
SEL
DON'T CARE
tENSEL
DON'T CARE
tENPL
PL1
tPLEN t ENPL
tSELEN
t ENSEL tPLEN
PL2
t TX/R
TX/R
tTX/REN
ENTX
t ENTX/R
tENDAT
429DO BIT 1
t DTX/R
BIT 32
t NULL
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HI-3282
Supply Voltage Vcc Voltage at pins 2, 3, 4 & 5 Voltage at any other pin DC Current Drain per input pin
-0.5V to +7V -29V to +29V -1.5V to Vcc +1.5V 10mA
Power Dissipation Operating Temperature Range: (Industrial) (Military) Storage Temperature Range:
500mW -40°C to +85°C -55°C to +125°C -65°C to +150°C
NOTE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Vcc = 5V ±5%, GND = 0V, TA = Operating Temperature Range (unless otherwise specified).
LIMITS PARAMETER
ARINC INPUTS -
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNIT
Pins: 429DI1(A), 429DI1(B), 429DI2(A), 429DI2(B) ONE ZERO NULL Differential To GND To Vcc Input Sink Input Source Differential To GND To Vcc VIH VIL VNUL RI RG RH IIH IIL CI CG CH Common mode voltage less than ±5V with respect to GND 6.5 -13.0 -2.5 12 12 12 -450 20 20 20 10.0 -10.0 0 13.0 -6.5 2.5 V V V KΩ KΩ kΩ 200 µA µA pF pF pF
Differential Input Voltage:
Input Resistance:
27 27
Input Current: Input Capacitance: (Guaranteed but not tested) BI-DIRECTIONAL INPUTS - Pins:BD00-BD15 Input Voltage: Input Current: ALL OTHER INPUTS Input Voltage: Input Current:
Input Voltage HI Input Voltage LO Input Sink Input Source
VIH VIL IIH IIL
2.0 0.8 1.5 -1.5
V V µA µA
Input Voltage HI Input Voltage LO Input Sink Input Source Pull-up Current (DCBEN Pin)
VIH VIL IIH IIL IPU
2.0 0.8 10 -10 -150 -50
V V µA µA µA
OUTPUTS Output Voltage: Output Current: (Bi-directional Pins) Output Current: (All Other Outputs) Output Capacitance: SUPPLY INPUT Standby Supply Current: Operating Supply Current: ICC1 ICC2 10 10 mA mA Logic "1" Output Voltage Logic "0" Output Voltage Output Sink Output Source Output Sink Output Source VOH VOL IOL IOH IOL IOH CO IOH = -1.5mA IOL = 1.6mA VOUT = 0.4V VOUT = VCC - 0.4V VOUT = 0.4V VOUT = VCC - 0.4V 2.7 0.4 1.6 -1.0 1.6 -1.0 15 V V mA mA mA mA pF
HOLT INTEGRATED CIRCUITS 8
HI-3282
Vcc = 5V, GND = 0V, TA = Operating Temperature Range and fclk = 1mhz +0.1% with 60/40 duty cycle
PARAMETER
CONTROL WORD TIMING Pulse Width - CWSTR Setup - DATA BUS Valid to CWSTR HIGH Hold - CWSTR HIGH to DATA BUS Hi-Z RECEIVER TIMING Delay - Start ARINC 32nd Bit to D/R LOW: High Speed Low Speed Delay - D/R LOW to EN L0W Delay - EN LOW to D/R HIGH Setup - SEL to EN L0W Hold - SEL to EN HIGH Delay - EN L0W to DATA BUS Valid Delay - EN HIGH to DATA BUS Hi-Z Pulse Width - EN1 or EN2 Spacing - EN HIGH to next EN L0W FIFO TIMING Pulse Width - PL1 or PL2 Setup - DATA BUS Valid to PL HIGH Hold - PL HIGH to DATA BUS Hi-Z Spacing - PL1 or PL2 Delay - PL2 HIGH to TX/R LOW TRANSMISSION TIMING Spacing - PL2 HIGH to ENTX HIGH Delay - ENTX HIGH to 429DO or 429D0: High Speed Delay - ENTX HIGH to 429DO or 429D0: Low Speed Delay - 32nd ARINC Bit to TX/R HIGH Spacing - TX/R HIGH to ENTX L0W REPEATER OPERATION TIMING Delay - EN LOW to PL LOW Hold - PL HIGH to EN HIGH Delay - TX/R LOW to ENTX HIGH Master Reset Pulse Width ARINC Data Rate and Bit Timing tENPL tPLEN tTX/REN tMR 0 0 0 50 ± 1% ns ns ns ns tPL2EN tENDAT tENDAT tDTX/R tENTX/R 0 0 25 200 50 µs µs µs ns ns tPL tDWSET tDWHLD tPL12 tTX/R 50 50 0 0 840 ns ns ns ns ns tD/R tD/R tD/REN tEND/R tSELEN tENSEL tENDATA tDATAEN tEN tENEN 80 50 0 200 0 0 50 50 80 30 16 128 µs µs ns ns ns ns ns ns ns ns tCWSTR tCWSET tCWHLD 50 50 0 ns ns ns
SYMBOL
LIMITS MIN TYP MAX
UNITS
HOLT INTEGRATED CIRCUITS 9
HI-3282
ADDITIONAL HI-3282 PIN CONFIGURATIONS (See page 1 for the 44-pin Plastic QFP)
PIN CONFIGURATION (Top View)
HOLT INTEGRATED CIRCUITS 10
HI-3282
PART NUMBER
HI-3282PQI HI-3282PQT HI-3282PJI HI-3282PJT HI-3282CDI HI-3282CDT HI-3282CDM
PACKAGE DESCRIPTION 44 PIN PLASTIC QUAD FLATPACK (PQFP) 44 PIN PLASTIC QUAD FLATPACK (PQFP) 44 PIN PLASTIC J-LEAD PLCC 44 PIN PLASTIC J-LEAD PLCC 40 PIN CERAMIC SIDE-BRAZED DIP 40 PIN CERAMIC SIDE-BRAZED DIP 40 PIN CERAMIC SIDE-BRAZED DIP
TEMPERATURE RANGE
-40°C TO +85°C -55°C TO +125°C -40°C TO +85°C -55°C TO +125°C -40°C TO +85°C -55°C TO +125°C -55°C TO +125°C
FLOW
I T I T I T M
BURN IN
NO NO NO NO NO NO YES
LEAD FINISH SOLDER SOLDER SOLDER SOLDER GOLD GOLD SOLDER
HOLT INTEGRATED CIRCUITS 11
HI-3282 PACKAGE DIMENSIONS
inches (millimeters)
40-PIN CERAMIC SIDE-BRAZED DIP
Package Type: 40C
2.020 MAX (51.308 MAX)
.610 ± .010 (15.494 ± .254)
.595 ± .010 (15.113 ± .254)
.225 MAX (5.715 MAX)
.050 TYP (1.270 TYP)
.085 ± .009 (2.159 ± .229)
.600 ± .010 (15.240 ± .254)
.125 MIN (3.175 MIN)
.018 TYP (.457 TYP)
.100 BSC (2.540 BSC)
.010 + .002/−.001 (.254 + .051/−.025)
44-PIN PLASTIC PLCC
Package Type: 44J
PIN NO. 1 .045 x 45° PIN NO. 1 IDENT .045 x 45° .050 ± .005 (1.27 ± .127) .690 ± .005 (17.526 ± .127) SQ. .653 ± .004 (16.586 ± .102) SQ. .031± .005 (.787 ± .127) .017 ± .004 (.432 ± .102)
SEE DETAIL A
.009 .011
.172 ± .008 (4.369 ± .203) .610 ± .020 (15.494± .508) DETAIL A
.015 ± .002 (.381 ± .051) .020 MIN (.508 ΜΙΝ) R .025 .045
HOLT INTEGRATED CIRCUITS 12
HI-3282 PACKAGE DIMENSIONS
inches (millimeters)
44-PIN PLASTIC QUAD FLAT PACK (PQFP)
Package Type: 44PQS
.007 MAX. (.17)
.0315 BSC (.80 BSC) .547 ± .010 (13.90 ± .25) SQ. .394 ± .004 (10.0 ± .10) SQ. .014 ± ..002 (.35 ± .05) .035 +.006 / -.004 (.88 +.15 / -.10)
See Detail A
.097 MAX. (2.45) .079 +.004 / -.006 (2.00 +.10 / -.15)
.012 TYP. (.30 R)
0° ≤ Θ ≤ 7° .008 TYP. (.20 R)
Detail A
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