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HI-8110SM-32

HI-8110SM-32

  • 厂商:

    HOLTIC

  • 封装:

  • 描述:

    HI-8110SM-32 - CMOS HIGH VOLTAGE DISPLAY DRIVER - Holt Integrated Circuits

  • 数据手册
  • 价格&库存
HI-8110SM-32 数据手册
HI-8010/HI-8110 Series August 2006 CMOS HIGH VOLTAGE DISPLAY DRIVER PIN CONFIGURATION (Top View) CL CS VSS S36 S35 S34 S33 S32 S31 S30 S29 S28 S27 LD DIN LCDØ LCDØOPT VDD S37 S38 S1 S2 S3 S4 S5 S6 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 52 - PIN 29 PLASTIC QFP 28 GENERAL DESCRIPTION The HI-8010 & HI-8110 high voltage display drivers are constructed of MOS P Channel and N Channel enhancement mode devices in a single monolithic structure. They are designed to drive high voltage liquid crystal displays by converting low level input signals (TTL on the HI-8010 and CMOS on the HI-8110) to high voltage drive signals. Both devices can drive up to 38 segments and require minimal display-to-data source interfacing. Serial data is loaded and held in internal latches until new display data is received. The HI-8010 & HI-8110 are available in a variety of ceramic and plastic packaging including leaded and leadless chip carriers; and J-lead and gull-wing quad flat packs. 2 3 4 5 6 7 8 9 10 11 12 HI-8010PQI HI-8110PQI HI-8010PQT & HI-8110PQT S26 S25 S24 S23 S22 S21 S20 DOUT 38 N/C N/C N/C BP S19 14 15 16 17 18 19 20 21 22 23 24 25 26 FEATURES ! 5 volt input translated to 30 volts or less ! Pin-out adaptable to drive 30, 32 or 38 LCD segments ! RC oscillator or high voltage (BP) clock input ! TTL compatible inputs (HI-8010 only) ! CMOS compatible inputs (HI-8110 only) ! Low power consumption ! Industrial (-40°C to +85°C) & Military (-55°C to +125°C) temperature ranges ! Pin for pin compatible with the Micrel MIC8010/8011 series and the AMI S4520 series drivers ! Cascadable ! Military level processing available DIN Þ CL Þ CS Þ LE DATA IN (See page 5 for additional package pin configurations) FUNCTIONAL BLOCK DIAGRAM 38 Stage Shift Register CLK S7 S8 S9 S10 S11 S12 S13 S14 VEE S15 S16 S17 S18 Þ DOUT 38 Þ DOUT 32 Þ DOUT 30 LD Þ LCDØ OPT Þ LCDØ Þ Oscillator Divider Vo l t a g e Tr a n s l a t o r 38 Bit Latch Vo l t a g e Tr a n s l a t o r s H i g h Vo l t a g e Drivers APPLICATIONS ! Dichroic Liquid Crystal Displays ! Standard Liquid Crystal Displays ! Vacuum Fluorescent Displays ! MEMS Drivers HOLT INTEGRATED CIRCUITS www.holtic.com H i g h Vo l t a g e B u ff e r Þ BP SEGMENTS (DS8010, Rev. E) 08/06 HI-8010/HI-8110 Series PIN DESCRIPTIONS SYMBOL VSS CS CL LD DIN LCD0 LCD0OPT VDD VEE DOUT BP Segments FUNCTION POWER INPUT INPUT INPUT INPUT INPUT OUTPUT POWER POWER OUTPUT OUTPUT OUTPUT 0 Volts Logic input Logic input Logic input Logic input Analog input Analog output 5 Volts 0 Volts to -30 Volts Logic output Display drive output Display drive output DESCRIPTION Chip select Clocks shift register on negative edge and DOUT pins on positive edge Segment outputs equal shift register data if Load is high Shift register data input Display clock input and is always bonded out. Can swing from VEE to VDD Bonded out only if an RC oscillator is required Selected pinout can provide shift register taps at positions 30, 32, 34, or 38 Low resistance drive for the backplane and swings from VDD to VEE High resistance drive for each segment and swings from VDD to VEE FUNCTIONAL DESCRIPTION Whenever a Logic "0" is applied to the Chip Select (CS) input, one bit of data is clocked into the shift register from the serial data input (DIN) with each negative transition of the Clock (CL) input. CS is internally tied to VSS on some versions. A Logic "1" present at the Load (LD) input will cause a parallel transfer of data from the shift register to the data latch. If the Load (LD) input is held high while data is clocked into the shift register, the latch will be transparent. All four logic inputs are TTL compatible on the HI-8010 and CMOS compatible on the HI-8110. To display segments, a Logic "1" is stored in the appropriate shift register bit position, and the segment output is out-ofphase with the backplane. C on the rising edge of the Clock (CL). Clock (CL), Load (LD) and Chip Select (CS) should be tied in common with each other, respectively, between all cascaded display drivers. INTERNAL OSCILLATOR CIRCUIT R The backplane output functions in 1 of 2 modes; externally driven or self-oscillating. When the LCDØ input is externally driven with the LCDØOPT input open circuit (Figure 2), the backplane output will be in-phase with LCDØ. Utilizing the self-oscillating mode, inputs LCDØ and LCDØOPT are tied together and connected to an RC circuit (Figure 3). A 150KW resistor with a 470pF capacitor generates an approximate backplane frequency of 100Hz. The LCDØ/LCDØOPT oscillator frequency is divided by 256 to determine the backplane output frequency. The resistor value (R) must be at least 30KW for proper self-oscillator operation. For displays having a number of segments greater than 38, two or more of the display drivers may be cascaded together by connecting the serial data output (DOUT) from the first driver, to the serial data input (DIN) of the following driver, etc. (See Figures 2 & 3). Data out (DOUT) will change state ÷ 256 Q LCDØ LCDØ OPT TO BACKPLANE TRANSLATOR AND DRIVER Figure 1 HOLT INTEGRATED CIRCUITS 2 HI-8010/HI-8110 Series CASCADING - EXT. OSCILLATOR LD CL CS CS DIN CL LD DOUT CS DIN CL LD DOUT CS DIN CL LD DOUT CASCADING - RC OSCILLATOR LD CL CS CS DIN 150KW CL LD DOUT CS DIN CL LD DOUT CS DIN CL LD DOUT HI-8010J-85 LCDØ BP HI-8010J-85 LCDØ BP HI-8010J-85 LCDØ BP HI-8110PQI LCDØ LCDØ OPT BP HI-8110PQI LCDØ LCDØ OPT BP HI-8110PQI LCDØ LCDØ OPT BP 470pf SEGMENTS 1 - 32 SEGMENTS BACK 33 - 64 PLANE SEGMENTS 65 - 96 SEGMENTS 1 - 38 SEGMENTS BACK 39 - 76 PLANE SEGMENTS 77 - 114 Figure 2 Figure 3 ABSOLUTE MAXIMUM RATINGS Voltages referenced to VSS = 0V Supply Voltage VDD........................ 0V to 7V VEE................VDD-35V to 0V Voltage at any input, except LCDØ..-0.3 to VDD+0.3V Voltage at LCDØ input...............VDD-35 to VDD+0.3V DC Current any input pin...................................10 mA Power Dissipation......................................................300 mW Operating Temperature Range - Industrial........-40° to +85°C Operating Temperature Range - Hi-Temp/Mil..-55° to +125°C Storage Temperature Range...........................-65° to +150°C NOTE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS VDD = 5V, VEE = -25V, VSS = 0V, TA = Operating Temperature Range (unless otherwise specified). PARAMETER Operating Voltage Supply Current SYMBOL VDD IDD IEE CONDITION Static, No Load Static, No Load fBP=100Hz MIN 3.0 TYP MAX 7.0 200 150 UNITS V µA µA V V V V V V µA pF KW W mA mA Input Low Voltage, HI-8010 (except LCDØ) Input High Voltage, HI-8010 (except LCDØ) Input Low Voltage, HI-8110 (except LCDØ) Input High Voltage, HI-8110 (except LCDØ) Input Low Voltage (LCDØ) Input High Voltage (LCDØ) Input Current Input Capacitance (not tested) Segment Output Impedance Backplane Output Impedance Data Out Current: VILTTL VIHTTL VILCMOS VIHCMOS VILX VIHX IIN CI RSEG RBP IDOH IDOL IL = 10µA IL = 10µA @ 25°C Source Current, VOH = 4.5V Sink Current, VOL = 0.5V VIN = 0 to 5V 0 2 0 0.7 VDD VEE 3.5 0.8 VDD 0.3 VDD VDD 3 VDD 1 5 10 450 15 600 -0.6 0.6 HOLT INTEGRATED CIRCUITS 3 HI-8010/HI-8110 Series AC ELECTRICAL CHARACTERISTICS VDD = 5V, VEE = -25V, VSS = 0V, TA = Operating Temperature Range (unless otherwise specified). PARAMETER Clock Period Clock Pulse Width Data In - Setup Data In - Hold Chip Select - Setup to Clock Chip Select - Hold to Clock Load - Setup to Clock Chip Select - Setup to Load Load Pulse Width Chip Select - Hold to Load SYMBOL tCL tCW tDS tDH tCSS tCSH tLS tCSL tLW tLCS VDD 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V MIN 1200 520 50 400 200 450 500 300 500 300 TYP MAX UNITS ns ns ns ns ns ns ns ns ns ns Data Out Valid, from Clock tCDO 5V 800 ns TIMING DIAGRAM CL INPUT tCL DIN INPUT VALID VALID tDS tDH CS INPUT tCSS tCSH LD INPUT tLCS tCSL tCDO DOUT OUTPUT VALID VALID tLS tLW VALID HOLT INTEGRATED CIRCUITS 4 HI-8010/HI-8110 Series ADDITIONAL HI-8010/HI-8110 PIN CONFIGURATIONS (See page 1 for the 52-Pin Plastic QFP) S26 S25 S24 S23 S22 S21 S20 DOUT 32 BP S19 S18 6 5 4 3 2 1 44 43 42 41 40 39 38 S27 S28 S29 S30 S31 S32 N/C VSS CS CL LD 7 8 9 10 11 12 13 14 15 16 17 HI-8010J-85 & HI-8110J-85 44 - PIN PLASTIC PLCC 18 19 20 21 22 23 24 25 26 27 28 37 36 35 34 33 32 31 30 29 S17 S16 S15 VEE S14 S13 S12 S11 S10 S9 S8 LCDØ DIN LD CL VSS S30 S29 S28 S27 S26 DIN LCDØ LCDØOPT VDD S1 S2 S3 S4 S5 S6 S7 5 4 3 2 1 40 39 38 37 36 35 34 LCDØOPT VDD S1 S2 S3 S4 S5 S6 S7 S8 6 7 8 9 10 11 12 13 14 15 HI-8010SM-36 & HI-8110SM-36 40 - PIN CERAMIC LCC 16 17 18 19 20 21 22 23 24 25 33 32 31 30 29 28 27 26 S25 S24 S23 S22 S21 S20 DOUT 30 BP S19 S18 LCDØ LCDØOPT VDD S37 S38 S1 S2 S3 S4 S5 S6 S7 DIN LD CL VSS S36 S35 S34 S33 S32 S31 S30 S29 7 8 9 10 11 12 13 14 15 16 17 6 5 4 3 2 1 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 HI-8010SM-32 & HI-8110SM-32 48 - PIN CERAMIC LCC 18 19 20 21 22 23 24 25 26 27 28 29 30 S28 S27 S26 S25 S24 S23 S22 S21 S20 DOUT 38 BP S19 S9 S10 S11 S12 S13 S14 VEE S15 S16 S17 HOLT INTEGRATED CIRCUITS 5 S8 S9 S10 S11 S12 S13 S14 VEE S15 S16 S17 S18 HI-8010/HI-8110 Series ORDERING INFORMATION HI - 8X10 J x - 85 (44-pin Plastic J Lead - PLCC) PART NUMBER LEAD FINISH Blank F PART NUMBER Tin / Lead (Sn / Pb) Solder 100% Matte Tin (Pb-free, RoHS compliant) INPUT LOGIC NUMBER OF SEGMENTS MASTER/ SLAVE TEMPERATURE RANGE FLOW BURN IN 8010 8110 TTL CMOS 32 32 BOTH BOTH -40°C TO +85°C -40°C TO +85°C I I NO NO HI - 8X10PQ x x (52-pin Plastic Quad Flat Pack - PQFP) PART NUMBER LEAD FINISH Blank F PART NUMBER Tin / Lead (Sn / Pb) Solder 100% Matte Tin (Pb-free, RoHS compliant) NUMBER OF SEGMENTS MASTER/ SLAVE TEMPERATURE RANGE FLOW BURN IN I T PART NUMBER 38 38 INPUT LOGIC BOTH BOTH -40°C TO +85°C -55°C TO +125°C I T NO NO 8010PQ 8110PQ TTL CMOS HI - 8X10SM -xx (Ceramic Leadless Chip Carrier - LCC) PART NUMBER MASTER/ SLAVE NUMBER OF SEGMENTS NUMBER OF LEADS FLOW BURN LEAD IN FINISH -32 -36 PART NUMBER BOTH BOTH INPUT LOGIC 38 30 TEMPERATURE RANGE 48 40 M M YES YES Tin / Lead (Sn / Pb) Solder Tin / Lead (Sn / Pb) Solder 8010SM 8110SM TTL CMOS -55°C TO +125°C -55°C TO +125°C HOLT INTEGRATED CIRCUITS 6 HI-8010/HI-8110 Series SEMI-CUSTOM PACKAGING The above part numbers represent the standard configurations of the HI-8010 & HI-8110 products. They can also be provided with a varied number of output segments (30, 32 and 38), with either industrial or military screening and in a wide variety of packages. Listed below are currently available packages. Please contact the Holt Sales Department for your specific requirements. PACKAGE DESCRIPTION PLASTIC DUAL-IN-LINE (PDIP) # LEADS 40 48 PLASTIC QUAD FLAT PACK (PQFP) PLASTIC J-LEAD CHIP CARRIER (PLCC) CERAMIC DUAL-IN-LINE (CDIP) 52 44 40 48 CERAMIC LEADLESS CHIP CARRIER (LCC) 40 48 CERAMIC J-LEAD CHIP CARRIER 44 48 CERAMIC LEADED CHIP CARRIER 40 48 HOLT INTEGRATED CIRCUITS 7 HI-8010/HI-8110 PACKAGE DIMENSIONS inches (millimeters) 44-PIN PLASTIC PLCC Package Type: 44J PIN NO. 1 .045 x 45° PIN NO. 1 IDENT .045 x 45° .050 ±.005 (1.27 ±.127) .690 ±.005 (17.526 ±.127) SQ. .653 ±.004 (16.586 ±.102) SQ. .031±.005 (.787 ±.127) .017 ±.004 (.432 ±.102) SEE DETAIL A .172 ±.008 (4.369 ±.203) .610 ±.020 (15.494±.508) .009 .011 .015 ± .002 (.381 ±.051) .020 MIN (.508 MIN) R .025 .045 DETAIL A 52-PIN PLASTIC QUAD FLAT PACK Package Type: 52PQS .0256 BSC (0.65 BSC) .520 ±.010 (13.2 ±.25) SQ. .394 ±.004 (10.00 ± .10) SQ. .012 ±.003 (.30 ±.08) .035 ±.006 (.88 ±.15) .088 ±.032 (1.6 ±.175) Typ. .008 (0.20) Min. .009 ±.003R (.225 ±.075R) See Detail A .092 ±.004 (2.32 ±.12) .079 ±.002 (2.00 ±.05) .009 R typ (0.23 R typ) 0° £ Q £ 7 ° DETAIL A HOLT INTEGRATED CIRCUITS 8 HI-8010/HI-8110 PACKAGE DIMENSIONS inches (millimeters) 40-PIN CERAMIC LEADLESS CHIP CARRIER PACKAGE TYPE: 40S PIN 1 IDENT. .085 MAX. (2.159 MAX.) .044 ±.011 (1.118 ±.280) PIN 1 IDENT. .484 ± .009 (12.294 ±.228) SQ. .020 ±.003 (.508 ±.076) .040 ± . 03 0 (1.016 ±.076) 48-PIN CERAMIC LEADLESS CHIP CARRIER Package Type: 48S PIN 1 IDENT. .090 MAX. (2.286 MAX.) .040 ±.007 (1.016 ±.178) PIN 1 IDENT. .563 ±.009 (14.300 ±.228) SQ. .020 TYP. (.508 TYP.) .040 TYP. (1.016 TYP.) HOLT INTEGRATED CIRCUITS 9
HI-8110SM-32 价格&库存

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