HI-8190

HI-8190, HI-8191, HI-8192 October 2011 12W, Quad, SPST, 3.3V / 5.0V compatible Analog Switch FEATURES · ± 3.3V to ± 15V CMOS analog switches · Low RON: 12 W to 15 W typical · Robust CMOS Silicon-on-Insulator (SOI) technology · SOI switch isolation with 1nA typical Off leakage · Superior ESD protection > 4KV HBM · Fast switching time with break-before-make · Low power · Extended Temperature Range (-55°C to +125°C) GENERAL DESCRIPTION The HI-8190 is a quad analog CMOS switch fabricated with Silicon-on-Insulator (SOI) technology for latch-up free operation and maximum switch isolation. The switch voltages can range from bipolar ± 3.3V to ± 15V or single ended from 3.3V to 15V. The logic supply can range from 3.3V to 5.0V. The HI-8190 provides four each normally open switches when the switch control inputs are Low. The HI-8191 provides four each normally closed switches when the switch control inputs are Low. The HI8192 provides a combination of two normally On and two normally Off switches. The limits of the operating range are defined by the V+/V- bias voltage. On-resistance of each switch depends upon only the VLOGIC selection. At 5V, RON ranges from 10W to 17W while at 3.3V supply RON ranges from 10W to 22W. Each switch is designed using back to back high voltage transistors. Switch transistors are symmetrical and conduct equally well in either direction. Signal range can run the full rails. Off leakages are very low (1 nA typical) and charge injection is less than 3 pC. Switch ESD tolerance is greater than 4 KV. The Off state is achieved first before any On condition is applied. Switching times with a 3.3V VLOGIC supply are typically 35 ns to the On state and 20 ns to the Off state. PIN CONFIGURATIONS (Top Views) IN1 1 S1A 2 S1B 3 V- 4 GND 5 S4B 6 S4A 7 IN4 8 16 IN2 15 S2A 14 S2B 13 V+ 12 VLOGIC 11 S3B 10 S3A 9 IN3 16 S1A S1B 1 V- 2 GND 3 S4B 4 13 S2A 12 S2B 11 V+ 10 VLOGIC 9 S3B 15 IN1 IN4 6 S4A 5 IN3 7 · Data bus isolation · Sample-and-Hold circuits · Test Equipment · Communications Systems · Battery operated Systems · PBX, PABX · Audio Signal Routing · Data Acquisition Systems · xDSL Modems · Avionics HI-8190PCx 16-pin 5mm x 5mm Chip-scale package PRODUCT OPTIONS PART TYPE IN1 HI-8190 0 1 HI-8191 0 1 HI-8192 0 1 Switch 1 Open Closed Closed Open Open Closed IN2 0 1 0 1 0 1 Switch 2 Open Closed Closed Open Closed Open IN3 0 1 0 1 0 1 Switch 3 Open Closed Closed Open Closed Open IN4 0 1 0 1 0 1 Switch 4 Open Closed Closed Open Open Closed (DS8190 Rev. New) HOLT INTEGRATED CIRCUITS www.holtic.com S3A 8 APPLICATIONS 14 IN2 Industry-standard plastic package options include 16-pin TSSOP, SO, DIP and 16-pin QFN. Ceramic packaging is available on request. All three products are offered in both Industrial (-40°C to +85°C) and extended (-55°C to +125°C) temperature range options. HI-8190PSx, HI-8190PDx 16-Pin SO or DIP package 10/11 HI-8190, HI-8191, HI-8192 PIN DESCRIPTIONS SIGNAL IN1 S1A S1B VGND S4B S4A IN4 IN3 S3A S3B VLOGIC V+ S2B S1B IN2 FUNCTION Logic Input Switch Node Switch Node Supply Supply Switch Node Switch Node Logic Input Logic Input Switch Node Switch Node Supply Supply Switch Node Switch Node Logic input DESCRIPTION HI-8190 and HI-8192 are normally Open when input Low Switch 1 Node Switch 1 Node Negative supply for Bipolar configuration. GND for Unipolar use Reference Ground Switch 4 Node Switch 4 Node HI-8190 and HI-8192 are normally Open when input Low HI-8191 and HI-8192 are normally Closed when input Low Switch 3 Node Switch 3 Node 3.3V or 5.0V Logic supply Positive supply for Bipolar and Unipolar configurations Switch 2 Node Switch 2 Node HI-8191 and HI-8192 are normally Closed when input Low 24W 22W 20W 24W 22W VLOGIC = 3.3V 20W T = +125°C RON RON 18W 16W 14W 12W 10W 8W -15V 18W 16W 14W 12W 10W 8W -15V T = +25°C T = -55°C VLOGIC = 5.0V -10V -5V 0V VSWITCH 5V 10V 15V -10V -5V 0V VSWITCH 5V 10V 15V Typical RON as a function of VLOGIC and VSWITCH (10mA switch current, 25°C) Typical RON as a function of VSWITCH and Temperature (10mA switch current) VLOGIC = 5V HOLT INTEGRATED CIRCUITS 2 HI-8190, HI-8191, HI-8192 ABSOLUTE MAXIMUM RATINGS (Voltages referenced to GND = 0V) Supply Voltage, V+: ............................................................................16.5V Continuous Power Dissipation (TA=70°C): Supply Voltage, V-:.............................................................................-16.5V SO Package (derate 6.7mW/°C above 70°C)...................696mW Supply Volgate, VLOGIC .........................................................................5.5V Plastic DIP (derate 10.53 mw/°C above 70°C) .................842mW Switch Current (either direction):.........................................................50mA Thin QFN (derate 21.3mW/°C above 70°C) ...................1702mW Peak Switch Current (1 ms pulse, 10% duty cycle max.)..................200mA Digital Input Voltage (IN1-4):.....................................-0.3V to VLOGIC + 0.3V Storage Temperature Range: ......................................-65°C to +150°C Operating Temperature Range: (Industrial)..........................-40°C to +85°C (Hi-Temp) ........................-55°C to +125°C Maximum Junction Temperature ........................................................175°C NOTE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Soldering Temperature: (Ceramic)......................60 sec. at +300°C (Plastic - leads).............10 sec. at +280°C (Plastic - body) .....................+260°C Max. ELECTRICAL CHARACTERISTICS V+ = 15V, V- = -15V, GND = 0V. Operating temperature range (unless otherwise noted). VLOGIC = 3.3V PARAMETER SWITCH PARAMETERS Switch Signal Range Switch Resistance Leakage VRANGE RON |ISWLEAK| |ISWLEAK| |ISWLEAK| LOGIC INPUTS Input High Voltage Input Low Voltage Input Current SUPPLY VLOGIC Current V+ Current V- Current DYNAMIC PARAMETERS Turn On Time Turn Off time Break-Before-Make Time Charge Injection Off Isolation Crosstalk Capacitance TON TOFF TD Q RR CR COFF CON V+/V- = ±10V, 25°C VS = ±10V, -55°C to +125°C V+/V- = ±10V, 25°C VS = ±10V, -55°C to +125°C 10V signal, 25°C 10V signal, -55°C to +125°C VS=0V, RS=0W, 25°C f = 1 MHz, 25°C f = 1 MHz, 25°C Switch Off, 25°C Switch On, 25°C 3 3 3 3 4 4 5 6 7 8 9 4 4 65 90 5 20 55 75 35 40 8 4 4 65 90 5 20 8 20 25 35 55 ns ns ns ns ns ns pC dB dB pF pF IDD1 IDD2 IEE Any state Any state Any state -0.5 0.5 0.5 -0.5 0.5 0.5 µA µA µA VIH VIL IIN VIN = 0V or VIN=VLOGIC -0.5 70 30 0.5 -0.5 70 30 0.5 %VLOGIC %VLOGIC µA 25°C, 10mA -55°C to +125°C, 10mA Switch voltage ± 15V, 25°C Switch voltage ± 15V, 125° Switch voltage ± 15V, -55°C 1 1 2 2 2 10 8 22 26 5 20 150 -15 10 8 +15 17 20 5 20 150 V W W nA nA nA VLOGIC = 5.0V MIN TYP MAX SYMBOL CONDITIONS FIGURE MIN TYP MAX UNIT HOLT INTEGRATED CIRCUITS 3 HI-8190, HI-8191, HI-8192 TEST CIRCUITS IDS V1 SA SB IS(OFF) SA A + ID(OFF) SB A + - VS + - RON = V1/IDS VS VD Figure 1 - On Resistance Figure 2 - Off Leakage 0.1µF +5V +15V 0.1µF VIN (HI-8191) 50% 50% VLOGIC SA IN + GND V+ SB VOUT VIN (HI-8190) 50% 50% VS V0.1µF -15V 35pF 300W 90% VOUT 50% t ON t OFF Figure 3. Switching Times 0.1µF +5V +15V 0.1µF 5V VIN 0V S1B S2B 35pF 50% 50% VLOGIC VS1 VS2 S1A S2A IN GND V+ VOUT1 VOUT2 300W 90% VOUT1 50% V- 35pF 0.1µF 300W VOUT2 90% 50% -15V tD tD Figure 4. Break-Before-Make Time Delay (HI-8192) HOLT INTEGRATED CIRCUITS 4 HI-8190, HI-8191, HI-8192 +5V +15V VLOGIC RS SA IN + GND V+ SB VOUT VIN VCL 10nF VOUT -15V QINJ = CL x DVOUT DVOUT VS Figure 5. Charge Injection 0.1µF 0.1µF +5V +15V 0.1µF +5V +15V 0.1µF VLOGIC SA1 IN1 VS V+ SB1 50W IN2 VLOGIC SA IN GND VS V+ SB VOUT V0.1µF -15V 50W VOUT 50W SB2 GND SA2 V0.1µF -15V NC Figure 6 - Off Isolation Figure 7 - Channel-to-Channel Crosstalk 0.1µF +5V +15V 0.1µF 0.1µF +5V +15V 0.1µF VLOGIC SA Capacitance Meter f=1MHz IN GND V+ SB Capacitance Meter f=1MHz V0.1µF -15V IN VLOGIC SA V+ SB VS GND V0.1µF -15V Figure 8 - Off Capacitance Figure 9 - On Capacitance HOLT INTEGRATED CIRCUITS 5 HI-8190, HI-8191, HI-8192 ORDERING INFORMATION HI - 819x xx x x PART NUMBER LEAD FINISH Blank F PART NUMBER Tin / Lead (Sn / Pb) Solder 100% Matte Tin (Pb-free, RoHS compliant) TEMPERATURE RANGE FLOW BURN IN I T M PART NUMBER -40°C TO +85°C -55°C TO +125°C -55°C TO +125°C PACKAGE DESCRIPTION I T M NO NO YES PC PS PD PART NUMBER 16 PIN PLASTIC 5 x 5 mm CHIP SCALE (16PCS1) (No M-flow) 16 PIN PLASTIC NARROW BODY SOIC (16HN) 16 PIN PLASTIC DIP (16P) FUNCTION 8190 8191 8192 QUAD SWITCH, NORMALLY OPEN QUAD SWITCH, NORMALLY CLOSED QUAD SWITCH, TWO NORMALLY OPEN, TWO NORMALLY CLOSED HOLT INTEGRATED CIRCUITS 6 HI-8190, HI-8191, HI-8192 REVISION HISTORY P/N Rev Date 10/26/11 Description of Change Initial release DS8190 New HOLT INTEGRATED CIRCUITS 7 HI-8190 PACKAGE DIMENSIONS 16-PIN PLASTIC SMALL OUTLINE (SOIC) - NB (Narrow Body) .390 ± .004 (9.90 ± .10) .0087 ± .0012 (.220 ± .029) inches (millimeters) Package Type: 16HN .236 ±.008 (5.99 ±.20) Top View .1525 ± .0025 (3.87 ± .06) .0165 ± .003 (.419 ± .089) See Detail A .061 ± .007 (1.549 ± .178) .050 BSC (1.27) 0° to 8 ° .033 ± .017 (.838 ± .432) .0069 ± .0029 (.176 ± .074) BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) Detail A 16-PIN PLASTIC CHIP-SCALE PACKAGE millimeters Package Type: 16PCS1 Electrically isolated metal heat sink on bottom of package Connect to any ground or power plane for optimum thermal dissipation 3.38 ± 0.05 (0.133 ± 0.002) 5.00 ± 0.05 (0.197 ± 0.002) Top View Bottom View 5.00 ± 0.05 (0.197 ± 0.002) 0.75 ± 0.05 (0.03 ± 0.002) 0.203 (0.008) 0.025 ± 0.025 (0.001 ± 0.001) 0.80 (0.031) BSC 0.30 ± 0.05 (0.012 ± 0.002) REF. .50 ± 0.05 (0.020 ± 0.002) 0.20 (0.008) min. BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) HOLT INTEGRATED CIRCUITS 8 3.38 ± 0.05 (0.133 ± 0.002) HI-8190 PACKAGE DIMENSIONS 16-PIN PLASTIC DIP Package Type: 0.745 (18.923) 0.810 (20.574) 16P 0.240 (6.096) 0.260 (6.604) 0.290 (7.366) 0.310 (7.874) 0.015 (0.381) 0.035 (0.889) 0.120 (3.048) 0.150 (3.810) 0.008 (0.203) 0.015 (0.381) 0.125 (3.175) 0.150 (3.810) 0.015 (0.381) 0.023 (0.584) 0.045 (1.143) 0.065 (1.651) 0.100 (2.54) BSC. 0.300 (7.620) 0.370 (9.398) inches (millimeters) HOLT INTEGRATED CIRCUITS 9