HI-8382JTF

HI-8382, HI-8383 September 2011 ARINC 429 Differential Line Driver PIN CONFIGURATION VREF 1 STROBE 2 SYNC 3 DATA(A) 4 CA 5 AOUT 6 -V 7 GND 8 GENERAL DESCRIPTION The HI-8382 and HI-8383 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus specifications. Inputs are provided for clocking and synchronization. These signals are AND'd with the DATA inputs to enhance system performance and allow the HI-8382 to be used in a variety of applications. Both logic and synchronization inputs feature built-in 2,000V minimum ESD input protection as well as TTL and CMOS compatibility. The differential outputs of the HI-8382 are independently programmable to either the high speed or low speed ARINC 429 output rise and fall time specifications through the use of two external capacitors. The output voltage swing is also adjustable by the application of an external voltage to the VREF input. The HI-8382 has on-chip Zener diodes in series with a fuse to each differential output protecting the ARINC bus from an overvoltage failure. The outputs each have a series resistance of 37.5 ohms. The HI-8383 is identical to the HI8382 except that the series resistors are 13 ohms and the overvoltage protection circuitry has been eliminated. The updated HI-318X and HI-8585 ARINC 429 line drivers are recommended for all new designs where logic signals must be converted to ARINC 429 levels such as a user ASIC, the HI-3282 or HI-8282A ARINC 429 Serial Transmitter/Dual Receiver, the HI-6010 ARINC 429 Transmitter/Receiver or the HI-8783 ARINC interface device. Holt products are readily available for both industrial and military applications. Please contact the Holt Sales Department for additional information, including data sheets for any of the Holt products mentioned above. (Top View) 16 V1 15 N/C 14 CLOCK 13 DATA(B) 12 CB 11 BOUT 10 N/C 9 +V HI-8382C / CT / CM-01 / CM-03 SMD # 5962-8687901EA 16 - PIN CERAMIC SIDE-BRAZED DIP (See Page 6 for additional package pin configurations) FUNCTION + _ HI-8382 ARINC 429 DIFFERENTIAL LINE DRIVER FEATURES ! Low power CMOS ! TTL and CMOS compatible inputs ! Programmable output voltage swing ! Adjustable ARINC rise and fall times ! Operates at data rates up to 100 Kbits ! Overvoltage protection ! Industrial and extended temperature ranges ! DSCC SMD part number TRUTH TABLE SYNC CLOCK DATA(A) DATA(B) AOUT X L H H H H L X H H H H X X L L H H X X L H L H 0V 0V 0V -VREF +VREF 0V BOUT COMMENTS 0V 0V 0V +VREF -VREF 0V NULL NULL NULL LOW HIGH NULL ( DS8382 Rev. F ) HOLT INTEGRATED CIRCUITS www.holtic.com 09/11 HI-8382, HI-8383 FUNCTIONAL DESCRIPTION The SYNC and CLOCK inputs establish data synchronization utilizing two AND gates, one for each data input. Each logic input, including the power enable (STROBE) input, are TTL/CMOS compatible. Besides reducing chip current drain, STROBE also floats each output. However the overvoltage fuses and diodes of the HI-8382 are not switched out. Figure 1 illustrates a typical ARINC 429 bus application. Three power supplies are necessary to operate the HI-8382; typically +15V, -15V and +5V. The chip also works with ±12V supplies. The +5V supply can also provide a reference voltage that determines the output voltage swing. The differential output voltage swing will equal 2VREF. If a value of VREF other than +5V is needed, a separate +5V power supply is required for pin V1. With the DATA (A) input at a logic high and DATA (B) input at a logic low, AOUT will switch to the +VREF rail and BOUT will switch to the -VREF rail (ARINC HIGH state). With both data input signals at a logic low state, the outputs will both switch to 0V (ARINC NULL state). The driver output impedance, ROUT, is nominally 75 ohms. The rise and fall times of the outputs can be calibrated through the selection of two external capacitor values that are connected to the CA and CB input pins. Typical values for high-speed operation (100KBPS) are CA = CB = 75pF and for low-speed operation (12.5 to 14KBPS) CA = CB = 500pF. The driver can be externally powered down by applying a logic high to the STROBE input pin. If this feature is not being used, the pin should be tied to ground. The CA and CB pins are inputs to unity gain amplifiers. Therefore they must be allowed to swing to -5V. Provision to VREF +V CA switch capacitors must be done with analog switches that allow voltages below their ground. Both ARINC outputs of the HI-8382 are protected by internal fuses capable of sinking between 800 - 900 mA for short periods of time (125µs). POWER SUPPLY SEQUENCING The power supplies should be controlled to prevent large currents during supply turn-on and turn-off. The recommended sequence is +V followed by V1, always ensuring that +V is the most positive supply. The -V supply is not critical and can be asserted at any time. +5V +15V VREF DATA (A) V1 SYNC CLOCK AOUT +V INPUTS DATA (B) CA CB STROBE GND -V TO ARINC BUS BOUT -15V Figure 1. ARINC 429 BUS APPLICATION A OUT DATA (A) LEVEL SHIFTER AND SLOPE CONTROL (A) CLOCK R OUT / 2 OUTPUT DRIVER (A) RL SYNC LEVEL SHIFTER AND SLOPE CONTROL (B) CL FA R OUT / 2 OUTPUT DRIVER (B) FB DATA (B) V1 STROBE CURRENT REGULATOR Not included on HI-8383 OVER VOLTAGE CLAMPS GND -V CB B OUT Figure 2. FUNCTIONAL BLOCK DIAGRAM HOLT INTEGRATED CIRCUITS 2 HI-8382, HI-8383 PIN DESCRIPTIONS SYMBOL VREF STROBE SYNC DATA (A) CA AOUT -V GND +V BOUT CB DATA (B) CLOCK V1 FUNCTION POWER INPUT INPUT INPUT INPUT OUTPUT POWER POWER POWER OUTPUT INPUT INPUT INPUT POWER DESCRIPTION THE REFERENCE VOLTAGE USED TO DETERMINE THE OUTPUT VOLTAGE SWING A LOGIC HIGH ON THIS INPUT PLACES THE DRIVER IN POWER DOWN MODE SYNCHRONIZES DATA INPUTS DATA INPUT TERMINAL A CONNECTION FOR DATA (A) SLEW-RATE CAPACITOR ARINC OUTPUT TERMINAL A -12V to -15V 0.0V +12V to +15V ARINC OUTPUT TERMINAL B CONNECTION FOR DATA (B) SLEW-RATE CAPACITOR DATA INPUT TERMINAL B SYNCHRONIZES DATA INPUTS +5V ±5% ABSOLUTE MAXIMUM RATINGS All Voltages referenced to GND, TA = Operating Temperature Range (unless otherwise specified) PARAMETER Differential Voltage Supply Voltage SYMBOL VDIF +V -V V1 VREF VIN CONDITIONS Voltage between +V and -V terminals OPERATING RANGE MAXIMUM 40 UNIT V V V V V V V V +10.8 to +16.5 -10.8 to -16.5 +5 ±5% For ARINC 429 For Applications other than ARINC +5 ±5% 0 to 6 +7 6 6 > GND -0.3 < V1 +0.3 Voltage Reference Input Voltage Range Output Short-Circuit Duration Output Overvoltage Protection Operating Temperature Range Storage Temperature Range Lead Temperature Junction Temperature Power Dissipation See Note: 1 See Note: 2 TA TSTG Extended Industrial Ceramic & Plastic Soldering, 10 seconds TJ PD 16-Pin Ceramic DIP 28-Pin Ceramic LCC 28-Pin Plastic PLCC 32-Pin CERQUAD 16-Pin Ceramic DIP 28-Pin Ceramic LCC 28-Pin Plastic PLCC 32-Pin CERQUAD See Note: See Note: See Note: See Note: 3 3 3 3 -55 to +125 -40 to +85 -65 to +150 +275 +175 1.725 1.120 2.143 1.725 86.5 133.7 70.0 86.5 °C °C °C °C °C W W W W °C/W °C/W °C/W °C/W Thermal Resistance, (Junction-to-Ambient) ØJA Note 1. Heatsinking may be required for Output Short Circuit at +125°C and for 100KBPS at +125°C. Note 2. The fuses used for Output Overvoltage Protection may be blown by the presence of a voltage at either output that is greater than ±12.0V with respect to GND. (HI-8382 only) Note 3. Derate above +25°C, 11.5mW/°C for 16-PIN DIP and 32-PIN CERQUAD, 7.5 mW/°C for 28-PIN LCC, 14.2 mW/°C for 28-PIN PLCC NOTE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. HOLT INTEGRATED CIRCUITS 3 HI-8382, HI-8383 DC ELECTRICAL CHARACTERISTICS +V = +15V, -V = -15V, V1 = VREF = +5.0V, TA = Operating Temperature Range (unless otherwise specified). PARAMETER Supply Current +V (Operating) Supply Current -V (Operating) Supply Current V1 (Operating) Supply Current VREF (Operating) Supply Current +V (Power Down) Supply Current -V (Power Down) Supply Current +V (During Short Circuit Test) Supply Current -V (During Short Circuit Test) Output Short Circuit Current (Output High) Output Short Circuit Current (Output Low) Input Current (Input High) Input Current (Input Low) Input Voltage High Input Voltage Low Output Voltage High (Output to Ground) Output Voltage Low (Output to Ground) Output Voltage Null Input Capacitance SYMBOL ICCOP (+V) ICCOP (-V) ICCOP (V1) ICCOP (VREF) ICCPD (+V) ICCPD (-V) ISC (+V) ISC (-V) IOHSC IOLSC IIH IIL VIH VIL VOH VOL VNULL CIN No Load No Load No Load No Load CONDITION (0 - 100KBPS) (0 - 100KBPS) (0 - 100KBPS) (0 - 100KBPS) MIN -11 TYP MAX UNITS +11 500 500 475 mA mA µA µA uA uA 150 mA mA -80 mA mA 1.0 -1.0 µA µA V 0.5 V V V mV pF +VREF +.25 -VREF +.25 +250 STROBE = HIGH STROBE = HIGH Short to Ground Short to Ground Short to Ground Short to Ground (See Note: 1) (See Note: 1) -150 +80 -475 VMIN=0 (See Note: 2) VMIN=0 (See Note: 2) 2.0 No Load No Load No Load See Note 1 (0 -100KBPS) (0 -100KBPS) (0-100KBPS) +VREF -.25 -VREF -.25 -250 15 Note 1. Not tested, but characterized at initial device design and after major process and/or design change which affects this parameter. Note 2. Interchangeability of force and sense is acceptable. AC ELECTRICAL CHARACTERISTICS +V = +15V, -V = -15V, V1 = VREF = +5.0V, TA = Operating Temperature Range (unless otherwise specified). PARAMETER Rise Time (AOUT, BOUT) Fall Time (AOUT, BOUT) Propagtion Delay Input to Output Propagtion Delay Input to Output SYMBOL tR tF t PLH t PHL CONDITION CA = CB = 75pF CA = CB = 75pF CA = CB = 75pF CA = CB = 75pF See Figure 3. See Figure 3. See Figure 3. See Figure 3. MIN 1.0 1.0 TYP MAX UNITS 2.0 2.0 3.0 3.0 µs µs µs µs DATA (A) 0V DATA (B) 0V VREF 50% 50% ADJUST BY CA 2.0V 0.5V 2.0V 0.5V +4.75V to +5.25V AOUT 0V ADJUST BY CA -VREF 50% 50% -4.75V to -5.25V ADJUST BY CB ADJUST BY CB t PHL +VREF +4.75V to +5.25V -4.75V to -5.25V HIGH NULL BOUT 0V -VREF t PLH tR DIFFERENTIAL OUTPUT 0V 2VREF +9.5V to +10.5V (AOUT - BOUT) NOTE: OUTPUTS UNLOADED tF -2VRE LOW -9.5V to -10.5V Figure 3. SWITCHING WAVEFORMS HOLT INTEGRATED CIRCUITS 4 HI-8382, HI-8383 HI-8382 PACKAGE THERMAL CHARACTERISTICS MAXIMUM ARINC LOAD PA C K A G E S T Y L E 28 Lead PLCC 16 Lead Ceramic SB DIP 1 7 2 ARINC 429 DATA RATE Low Speed High Speed Low Speed High Speed 3 4 S U P P LY C U R R E N T ( m A ) Ta = 25°C Ta = 85°C J U N C T I O N T E M P, T j ( ° C ) Ta = 25°C Ta = 85°C Ta = 125°C Ta = 125°C 17.6 25.4 17.9 25.8 17.2 24.5 17.4 24.8 17.0 24.2 17.1 24.4 5, 6, 7 2 48 56 41 47 107 11 0 103 11 2 142 150 145 147 A OUT and B OUT Shorted To Ground PA C K A G E S T Y L E 28 Lead PLCC 16 Lead Ceramic SB DIP 1 ARINC 429 DATA RATE Low Speed High Speed Low Speed High Speed 3 4 S U P P LY C U R R E N T ( m A ) Ta = 25°C Ta = 85°C J U N C T I O N T E M P, T j ( ° C ) Ta = 25°C Ta = 85°C Ta = 125°C Ta = 125°C 60.1 63.1 62.1 64.0 55.7 56.3 56.2 56.2 52.4 52.3 53.0 52.2 11 0 100 90 86 157 150 145 144 194 182 180 176 Notes: 1. All data taken in still air on devices soldered to a single layer copper PCB (3" X 4.5" X .062"). 2. At 100% duty cycle, 15V power supplies. For 12V power supplies multiply all tabulated values by 0.8. 3. Low Speed: Data Rate = 12.5 Kbps, Load: R = 400 Ohms, C = 30 nF. 4. High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms, C = 10 nF. Data not presented for C = 30 nF as this is considered unrealistic for high speed operation. 5. Similar results would be obtained with AOUT shorted to BOUT. 6. For applications requiring survival with continuous short circuit, operation above Tj = 175°C is not recommended. 7. Data will vary depending on air flow and the method of heat sinking employed. ORDERING INFORMATION HI - 838x x x - xx (Ceramic) PART NUMBER TEMPERATURE RANGE FLOW BURN IN NOTES Blank T M-01 M-03 PART NUMBER -40°C to +85°C -55°C to +125°C -55°C to +125°C -55°C to +125°C PACKAGE DESCRIPTION I T M DSCC No No Yes Yes (1) (1) & (2) LEAD FINISH NOTES C S U PART NUMBER 8382 8383 16 PIN CERAMIC SIDE BRAZED DIP (16C) 28 PIN CERAMIC LEADLESS CHIP CARRIER (28S) 32 PIN CERQUAD (32U) not available with ‘M’ flow OUTPUT SERIES RESISTANCE FUSE Gold Gold Tin/Lead Solder (3) & (1) (3) & (1) 37.5 Ohms 13 Ohms Yes No (1) Process Flows M and DSCC always have Tin/Lead (Sn/Pb) solder lead finish. (2) DSCC SMD# 5962-8687901EA. Only available in “C” package with Sn/Pb solder lead finish. (3) Gold terminal finish is Pb-Free, RoHS compliant. HOLT INTEGRATED CIRCUITS 5 HI-8382, HI-8383 HI - 838xJ x x (Plastic) PART NUMBER LEAD FINISH Blank F PART NUMBER Tin / Lead (Sn / Pb) Solder 100% Matte Tin (Pb-free, RoHS compliant) TEMPERATURE RANGE FLOW BURN IN Blank T PART NUMBER 8382J 8383J -40°C to +85°C -55°C to +125°C PACKAGE DESCRIPTION I T No No OUTPUT SERIES RESISTANCE FUSE 28 PIN PLASTIC PLCC (28J) (1) 28 PIN PLASTIC PLCC (28J) (1) 37.5 Ohms 13 Ohms Yes No (1) NOT RECOMMENDED FOR NEW DESIGNS. The newer HI-3182PJxx and HI-3183PJxx are drop-in replacements for the older HI-8382Jxx and HI-8383Jxx respectively. ADDITIONAL PIN CONFIGURATIONS (See page 1 for the 16-pin Ceramic Side-Brazed DIP Package ) SYNC STROBE N/C VREF V1 N/C N/C 4 20 19 18 17 16 15 14 3 2 1 28 27 26 25 CLOCK 24 N/C 29 28 27 26 25 24 23 22 21 N/C N/C N/C N/C DATA(B) CB N/C N/C BOUT CLOCK V1 N/C VREF STROBE SYNC N/C 30 31 32 1 2 3 4 HI-8382U HI-8382UT 5 6 7 8 9 10 11 12 13 N/C N/C +V GND N/C -V N/C N/C DATA (A) N/C N/C CA N/C N/C 5 6 7 8 9 10 11 12 13 14 15 16 17 18 HI-8382S HI-8382ST 23 DATA (B) 22 CB 21 N/C 20 N/C 19 N/C N/C N/C N/C DATA(A) CA N/C N/C N/C AOUT 32-PIN J-LEAD CERQUAD SYNC STROBE N/C VREF V1 N/C N/C 28-PIN CERAMIC LCC 4 3 2 1 2 8 2 7 26 25 24 23 22 21 20 19 N/C DATA (A) N/C N/C CA N/C N/C 5 6 7 8 9 10 11 12 13 14 15 16 17 18 HI-8382J HI-8382JT CLOCK N/C DATA (B) CB N/C N/C N/C 28-PIN PLASTIC PLCC HOLT INTEGRATED CIRCUITS 6 N/C AOUT -V GND +V BOUT N/C N/C AOUT -V GND +V BOUT N/C HI-8382, HI-8383 REVISION HISTORY P/N DS8382 Rev E F Date 02/26/09 09/16/11 Description of Change Clarified the temperature ranges, and Note (1) in the Ordering Information. Realigned pin names and numbers with package pin locations in Additional Pin Configuration drawings. HOLT INTEGRATED CIRCUITS 7 HI-8382 PACKAGE DIMENSIONS 16-PIN CERAMIC SIDE-BRAZED DIP inches (millimeters) Package Type: 16C .810 max (20.574) .295 ±.010 (7.493 ±.254) .050 ±.005 (1.270 ±.127) .035 ± .010 (.889 ±.254) BASE PLANE SEATING PLANE .100 BSC (2.54) .300 ± .010 (7.620 ±.254) PIN 1 .200 max (5.080) .125 min (3.175) .010 ±.002 (.254 ±.051) .018 ± .002 (.457 ±.051) BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) 28-PIN PLASTIC PLCC PIN NO. 1 .045 x 45° PIN NO. 1 IDENT .045 x 45° inches (millimeters) Package Type: 28J .050 (1.27) BSC .490 ± .005 (12.446 ±.127) SQ. .453 ± .003 (11.506 ±.076) SQ. .031 ±.005 (.787 ±.127) .017 ±.004 (.432 ±.102) See Detail A .010 ± .001 (.254 ± .03) .020 (.508) min .173 ±.008 (4.394 ±.203) BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) .410 ±.020 (10.414 ±.508) DETAIL A R .035 .889 HOLT INTEGRATED CIRCUITS 8 HI-8382 PACKAGE DIMENSIONS 28-PIN CERAMIC LEADLESS CHIP CARRIER inches (millimeters) Package Type: 28S .020 INDEX (.508) PIN 1 .080 ±.020 (2.032 ±.508) PIN 1 .050 ±.005 (1.270 ±.127) .451 ±.009 (11.455 ±.229) SQ. .050 BSC (1.270) .008R ± .006 (.203R ±.152) .040 x 45° 3PLS (1.016 x 45° 3PLS) .025 ±.003 (.635 ±.076) BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) 32-PIN J-LEAD CERQUAD inches (millimeters) Package Type: 32U 31 32 1 2 .450 ±.008 (11.430 ±.203) .488 ±.008 (12.395 ±.203) .420 ±.012 (10.668 ±.305) .588 ±.008 (14.935 ±.203) .550 ± .009 (13.970 ± .229) .190 max (4.826) .083 ±.009 (2.108 ±.229) BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) .040 typ (1.016) .050 .019 ± .003 BSC (1.270) (.483 ± .076) .520 ±.012 (13.208 ±.305) HOLT INTEGRATED CIRCUITS 9