HI-8571CRM

HI-8570, HI-8571 August 2006 +/- 5V Supply, ARINC 429 LINE DRIVER PIN CONFIGURATION SLP1.5 1 TX0IN 2 TX1IN 3 GND 4 DESCRIPTION The HI-8570 and HI-8571 are CMOS integrated circuits designed to directly drive the ARINC 429 bus in an 8-pin package. Two logic inputs control a differential voltage between the output pins producing a +10 volt One, a -10 volt Zero, and a 0 volt Null. A logic input is provided to control the slope of the differential output signal. Timing is set by an on-chip resistor and capacitor and tested to be within ARINC requirements. The HI-8570 has 37.5 ohms in series with each line driver output. The HI-8571 provides the option to bypass part of the output resistance so external resistance may be added for lightning protection circuits. The HI-8570 or the HI-8571 along with the HI-8588 line receiver offer the smallest options available to get on and off theARINC 429 bus. 8 V+ 7 TXBOUT 6 TXAOUT 5 V- SUPPLY VOLTAGES V+ = +5V V- = -5V FUNCTION TABLE TX1IN TX0IN SLP1.5 TXAOUT 0V -5V -5V 5V 5V 0V TXBOUT 0V 5V 5V -5V -5V 0V SLOPE N/A 10ms 1.5ms 10ms 1.5ms N/A 0 0 0 0 1 1 0 0 1 X 0 1 0 1 X FEATURES ! ! ! ! ! ! ! Direct ARINC 429 line driver interface in a small package On-chip line driver slope control and selection by logic input Low current 5 volt supplies CMOS / TTL logic pins 1 1 1 PIN DESCRIPTION TABLE PIN SYMBOL SLP 1.5 TX0IN TX1IN GND VTXAOUT TXBOUT V+ FUNCTION LOGIC INPUT LOGIC INPUT LOGIC INPUT POWER POWER OUTPUT OUTPUT POWER DESCRIPTION CMOS OR TTL, V+ IS OK CMOS OR TTL CMOS OR TTL GROUND -5 VOLTS LINE DRIVER TERMINAL A LINE DRIVER TERMINAL B +5 VOLTS 1 2 3 Plastic and ceramic package options surface mount and DIP Thermally enhanced SOIC packages Mil processing available 4 5 6 7 8 (DS8570 Rev. B) HOLT INTEGRATED CIRCUITS www.holtic.com 08/06 HI-8570, HI-8571 FUNCTIONAL DESCRIPTION Figure 1 is a block diagram of the line driver. The +5V and -5V levels are generated from the supply voltages. Currents for slope control are set by zener voltages across onchip resistors. The TX0IN and TX1IN inputs receive logic signals from a control transmitter chip such as the HI-6010, HI-3282, HI8282A, HI-8584 or HI-8783. TXAOUT and TXBOUT hold each side of the ARINC bus at Ground until one of the inputs becomes a One. If for example TX1IN goes high, a charging path is enabled to 5V on an “A” side internal capacitor while the “B” side is enabled to -5V. The charging current is selected by the SLP1.5 pin. If the SLP1.5 pin is high, the capacitor is nominally charged from 10% to 90% in 1.5µs. If SLP1.5 is low, the rise and fall times are 10µs. A unity gain buffer receives the internally generated slopes and differentially drives the ARINC line. Current is limited by the series output resistors at each pin. There are no fuses at the outputs of the HI-8570 as exists on the HI8382. The HI-8570 has 37.5 ohms in series with each output and the HI-8571 has 27.5 ohms in series with each output. The HI-8571 is for applications where external series resistance is required, typically for lightning protection devices. Both the HI-8570 and HI-8571 are built using high-speed CMOS technology. Care should be taken to ensure the V+ and V- supplies are locally decoupled and that the input waveforms are free from negative voltage spikes which may upset the chip’s internal slope control circuitry. 5V ONE “A” SIDE CURRENT CONTROL TXAOUT HI-8570 = 37.5 OHMS HI-8571 = 27.5 OHMS NULL ZERO -5V TX0IN TX1IN ESD PROTECTION AND VOLTAGE TRANSLATION CONTROL LOGIC SLP1.5 5V ONE “B” SIDE CURRENT CONTROL TXBOUT HI-8570 = 37.5 OHMS HI-8571 = 27.5 OHMS NULL ZERO CONTROL LOGIC -5V FIGURE 1 - LINE DRIVER BLOCK DIAGRAM 5V 1 HARDWIRED OR DRIVEN FROM LOGIC { 2 8 4 VCC TESTA TESTB ROUTA ROUTB 6 7 RXD1 RXD0 HI-8588 RINA RINB APPLICATION INFORMATION Figure 2 shows a possible application of the HI-8570/8571 interfacing an ARINC transmit channel from the HI6010. ARINC Channel 3 HI-6010 5 5V 1 6 SLP1.5 TXAOUT 8 BIT BUS 8 V+ TX1IN TX0IN V- 3 2 ARINC Channel TXD1 TXD0 7 HI-8570 TXBOUT GND 4 5 -5V FIGURE 2 - APPLICATION DIAGRAM HOLT INTEGRATED CIRCUITS 2 HI-8570, HI-8571 ABSOLUTE MAXIMUM RATINGS Voltages referenced to Ground Supply voltages V+....................................................+7V V-......................................................-7V DC current per input pin................. +10mA Power dissipation at 25°C plastic DIL............1.0W, derate 10mW/°C ceramic DIL..........0.5W, derate 7mW/°C Solder Temperature ........275°C for 10 sec Storage Temperature........-65°C to +150°C NOTE: Stresses above absolute maximum ratings or outside recommended operating conditions may cause permanent damage to the device. These are stress ratings only. Operation at the limits is not recommended. RECOMMENDED OPERATING CONDITIONS Supply Voltages V+....................................+4.8V to +5.3V V-..................................... -5.3V to -4.8V Temperature Range Industrial Screening.........-40°C to +85°C Hi-Temp Screening........-55°C to +125°C Military Screening..........-55°C to +125°C DC ELECTRICAL CHARACTERISTICS V+ = +5V, V- = -5V, TA = Operating Temperature Range (unless otherwise stated) PARAMETERS Input voltage (TX1IN, TX0IN, SLP1.5) high low Input current (TX1IN, TX0IN, SLP1.5) source sink ARINC output voltage (Differential) one zero null ARINC output voltage (Ref. to GND) one or zero null Operating supply current V+ VARINC output impedence HI-8570 HI-8571 SYMBOL VIH VIL TEST CONDITIONS MIN 2.1 TYP MAX V+ 0.5 UNITS volts volts IIH IIL VIN = 0V VIN = 5V - - 0.1 0.1 mA mA VDIFF1 VDIFF0 VDIFFN no load; TXAOUT - TXBOUT 9.00 no load; TXAOUT - TXBOUT -11.00 no load; TXAOUT - TXBOUT -0.50 10.00 -10.00 0 11.00 -9.00 0.50 volts volts volts VDOUT VNOUT no load & magnitude at pin no load SLP1.5 = V+ TX1IN & TX0IN = 0V: no load TX0IN & TX1IN = 0V: no load 4.50 -0.25 5.00 0 5.50 0.25 volts volts IDD IEE ZOUT -10.0 6.0 -6.0 10.0 - mA mA - 37.5 27.5 - ohms ohms HOLT INTEGRATED CIRCUITS 3 HI-8570, HI-8571 AC ELECTRICAL CHARACTERISTICS V+ = 5.0V, V- = -5V, TA = Operating Temperature Range (unless otherwise stated) PARAMETERS Line Driver propagation delay Output high to low Output low to high Line Driver transition times High Speed Output high to low Output low to high Low Speed Output high to low Output low to high Input capacitance (1) logic Notes: 1. Guaranteed but not tested t phlx t plhx SLP 1.5 = V+ pin 1 = logic 1 pin 1 = logic 1 SLP 1.5 = GND pin 1 = logic 1 pin 1 = logic 1 SYMBOL TEST CONDITIONS defined in Figure 3, no load 500 500 ns ns MIN TYP MAX UNITS t fx t rx t fx t rx 1.0 1.0 5.0 5.0 1.5 1.5 10.0 10.0 2.0 2.0 15.0 15.0 µs µs µs µs CIN - - 10 pF pin 3 t phlx t plhx pin 2 t phlx t rx t rx VDIFF pin 6 - pin 7 90% 10% 90% 10% 10% 5V 0V t plhx 5V 0V 10V 0V -10V t fx t fx FIGURE 3 - LINE DRIVER TIMING HOLT INTEGRATED CIRCUITS 4 HI-8570, HI-8571 PACKAGE THERMAL CHARACTERISTICS Maximum ARINC Load PACKAGE STYLE 1 ARINC 429 DATA RATE Low Speed3 High Speed4 SUPPLY CURRENT (mA) Ta = 25°C Ta = 85°C 2 JUNCTION TEMP, Tj °C Ta = 25°C Ta = 85°C Ta = 125°C Ta = 125°C 8 Lead Plastic ESOIC5 20.98 26.40 20.96 26.16 20.96 25.96 38.24 44.78 98.34 104.66 138.92 144.59 TXAOUT and TXBOUT Shorted to Ground PACKAGE STYLE 1 6,7,8 ARINC 429 DATA RATE Low Speed 3 SUPPLY CURRENT (mA) Ta = 25°C Ta = 85°C 2 JUNCTION TEMP, Tj °C Ta = 25°C Ta = 85°C Ta = 125°C Ta = 125°C 8 Lead Plastic ESOIC 5 30.26 30.44 29.22 29.42 28.46 28.68 53.75 53.92 112.76 112.95 152.04 152.25 High Speed4 Notes: 1. All data taken in still air. 2. At 100% duty cycle, 5V power supplies. 3. Low Speed: Data Rate = 12.5 Kbps, Load: R = 400 Ohms, C = 30 nF. 4. High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms, C = 10 nF. Data not presented for C = 30 nF as this is considered unrealistic for high speed operation. 5. 8 Lead Plastic ESOIC (Thermally enhanced SOIC with built in heat sink). Heat sink not soldered. 6. Similar results would be obtained with TXAOUT shorted to TXBOUT. 7. For applications requiring survival with continuous short circuit, operation above Tj = 175°C is not recommended. 8. Data will vary depending on air flow and the method of heat sinking employed. HEAT SINK - ESOIC PACKAGES An 8-pin thermally enhanced SOIC package is used for the HI-8570/HI-8571 products. The ESOIC package includes a metal heat sink located on the bottom surface of the device. This heat sink should be soldered down to the printed circuit board for optimum thermal dissipation. The heat sink is electrically isolated from the chip and can be soldered to any ground or power plane. However, since the chip’s substrate is at V+, connecting the heat sink to this power plane is recommended to avoid coupling noise into the circuit. HOLT INTEGRATED CIRCUITS 5 HI-8570, HI-8571 ORDERING INFORMATION HI - 857x xx x x PART NUMBER LEAD FINISH Blank F PART NUMBER Tin / Lead (Sn / Pb) Solder 100% Matte Tin (Pb-free, RoHS compliant) TEMPERATURE RANGE FLOW BURN IN I T M PART NUMBER -40°C TO +85°C -55°C TO +125°C -55°C TO +125°C PACKAGE DESCRIPTION I T M NO NO YES PD PS CR PART NUMBER 8 PIN PLASTIC DIP 8 PIN PLASTIC ESOIC - NB 8 PIN CERDIP (Not Available Pb-Free) OUTPUT SERIES RESISTANCE BUILT-IN REQUIRED EXTERNALLY 8570 8571 37.5 Ohms 27.5 Ohms 0 10 Ohms Legend: ESOIC - Thermally Enhanced Small Outline Package (SOIC w/built-in heat sink) NB - Narrow Body HOLT INTEGRATED CIRCUITS 6 HI-8570 / HI-8571 PACKAGE DIMENSIONS inches (millimeters) 8-PIN PLASTIC SMALL OUTLINE (ESOIC) - NB (Narrow Body, Thermally Enhanced) Top View .1935 ± .0035 (4.915 ± .085) .0085 ± .0015 (.2159 ± .0381) Package Type: 8HNE Bottom View .140 ± .010 (3.556 ± .254) .236 ± .008 (5.994 ± .203) PIN 1 .1535 ± .0035 (3.90 ± .09) .100 ± .010 (2.540 ± .254) .0165 ± .0035 (.4191 ± .0889) DETAIL A .055 ± .005 (1.397 ± .127) Electrically isolated metal heat sink on bottom of package (Connect to any ground or power plane for optimum thermal dissipation) 0° to 8° .0025 ± .0015 (.0635 ± .0381) .050 ± .010 (1.27 ± .254) .033 ± .017 (.8382 ± .4318) DETAIL A 8-PIN PLASTIC DIP Package Type: 8P .385 ± .015 (4.699 ± .381) .250 ± .010 (6.350 ± .254) .100 ± .010 (3.540 ± .254) .300 ± .010 (7.620 ± .254) .025 ± .010 (.635 ± .254) .0115 ± .0035 (.292 ± .089) .055 ± .010 (1.397 ± .254) .335 ± .035 (8.509 ± .889) 7° TYP. .135 ± .015 (3.429 ± .381) .1375 ± .0125 (3.493 ± .318) .019 ± .002 (.483 ± .102) HOLT INTEGRATED CIRCUITS 7 HI-8570 / HI-8571 PACKAGE DIMENSIONS inches (millimeters) 8-PIN CERDIP Package Type: 8D .380 ± .004 (9.652 ± .102) .005 MIN. (.127 MIN.) .248 ± .003 (6.299 ± .076) .039 ± .006 (.991 ± .154) .100 ± .008 (2.540 ± .203) .015 MIN. (.381 MIN.) .314 ± .003 (7.976 ± .076) .200 MAX. (5.080 MAX.) .163 ± .037 (4.140 ± .940) Base Plane Seating Plane .056 ± .006 (1.422 ± .152) .018 ± .006 (.457 ± .152) .350 ± .030 (8.890 ± .762) .010 ± .006 (.254 ± .152) HOLT INTEGRATED CIRCUITS 8