C0805X221K102T

MULTILAYER CERAMIC CHIP CAPACITORS HVC-008-0807 1. Scope This specification is applies to Multilayer Ceramic Chip Capacitor (MLCC) for use in electric equipment for the voltage is ranging from 100V to 5KV. The MLCC support for Lead-Free wave and reflow soldering, and electrical characteristic and reliability are same as before. (This product compliant with the RoHS.) 2. Parts Number Code C 0805 X 472 K 501 T (1) (2) (3) (4) (5) (6) (7) (5)Capacitance Tolerance (1)Product Product Code C Multilayer Ceramic Chip Capacitor (2)Chip Size Code 0201 0402 0603 0805 1206 1210 1808 1812 1825 2208 2211 2220 2225 Length×Width unit : mm(inch) 0.60× 0.30 (.024× .011) 1.00× 0.50 (.039× .020) 1.60× 0.80 (.063× .031) 2.00× 1.25 (.079× .049) 3.20× 1.60 (.126× .063) 3.20× 2.50 (.126× .098) 4.60× 2.00 (.181× .079) 4.60× 3.20 (.181× .125) 4.60× 6.35 (.181× .250) 5.70× 2.00 (.220× .197) 5.70× 2.80 (.220× .110) 5.70× 5.00 (.220× .197) 5.70× 6.35 (.220× .250) (3)Temperature Characteristics Code Temperature Characteristic N L X B S Y Z E NPO SL X7R X5R X6S Y5V Z5U Y5U (4)Capacitance Code Temperature Range ℃~+125℃ ℃~+85℃ ℃~+125℃ ℃~+85℃ ℃~+105℃ ℃~+85℃ ℃~+85℃ ℃~+85℃ -55 -30 -55 -55 -55 -30 +10 -30 Temperature Coefficient ℃ 30 ppm/ +350~-1000ppm ± 15% ± 15% ± 22% +22/-82% +22/-56% +22/-56% unit :pico farads(pF) Nominal Capacitance (pF) Code Tolerance Nominal Capacitance B C D E F G J K M Z ± 0.10 pF ± 0.25 pF ± 0.50 pF ± 1.00 pF ± 1.00 % ± 2.00 % ± 5.00 % ± 10.0 % ± 20.0 % +80/-20 % Less Than 10 pF (Include 10 pF) (6)Rated Voltage Code 101 201 251 501 631 102 202 252 302 502 Rated Voltage (Vdc) 100 200 250 500 630 1,000 2,000 2,500 3,000 5,000 (7)Tapping Code T 5R0 5.0 B 120 12.0 151 150.0 472 4,700.0 103 10,000.0 474 470,000.0 105 1,000,000.0 106 10,000,000.0 . If there is a decimal point, it shall be expressed by an English capital letter R Page : 1/15 ※ More Than 10 pF Type Tape & Reel Bulk MULTILAYER CERAMIC CHIP CAPACITORS HVC-008-0807 3. Nominal Capacitance and Tolerance 3.1 Standard Combination of Nominal Capacitance and Tolerance Class Ⅰ Ⅱ Characteristic NPO / SL X7R/X5R/X7E Y5V Z5U Y5U Tolerance Less Then 10 pF B (± 0.10 pF) C (± 0.25 pF) D (± 0.50 pF) E (± 1.00 pF) More Than 10 pF F (±1.00 %) G (±2.00 %) J (± 5.00 %) K (± 10.0 %) K (± 10.0 %), M (± 20.0 %) M (± 20.0 %), Z( 80/ 20 %) ＋ － Nominal Capacitance 0.5,1,1.5,2,2.5,3 0.5,1,1.5,2,2.5,3,3.5,4,4.5,5 5,6,7,8,9,10 6,7,8,9,10 E-12, E-24 series E-3, E-6 series E- 3 series 3.2 E series(standard Number) Standard No. E- 3 E- 6 E-12 E-24 1.0 1.0 1.0 1.0 1.1 1.5 1.2 1.2 1.3 1.5 1.5 1.6 1.8 1.8 2.0 Application Capacitance 2.2 2.2 3.3 2.2 2.7 3.3 3.9 2.2 2.7 3.3 3.9 2.4 3.0 3.6 4.3 4. Operation Temperature Range Class Ⅰ Ⅱ Characteristic NPO SL X7R X5R X6S Y5V Z5U Y5U Other 5. Storage Condition ： Temperature Range -55 ~ +125 -25 ~ +125 -55 ~ +125 -55 ~ +85 -55 ~ +105 -30 ~ +85 +10 ~ +85 -30 ~ +85 -25 ~ +85 ℃ ℃ ℃ ℃ ℃ ℃ ℃ ℃ ℃ ℃ ℃ ℃ ℃ ℃ ℃ ℃ ℃ ℃ ℃ Storage Temperature 5 to 40 ： Relative Humidity 20 to 70 % ： Storage Time 12 months max. Page : 2/15 Reference Temp. 25 25 25 25 25 25 25 25 25 ℃ ℃ ℃ ℃ ℃ ℃ ℃ ℃ ℃ 4.7 4.7 4.7 4.7 5.1 6.8 5.6 5.6 6.2 6.8 6.8 7.5 8.2 8.2 9.1 MULTILAYER CERAMIC CHIP CAPACITORS 6. Dimensions 6.1 Configuration and Dimension HVC-008-0807 ： BW B T W L TYPE 0805 L 2.00± 0.20 W 1.25± 0.20 T 0.85± 0.10 ： 6.2 Termination Type Solder Metal Barrier External Electrodes Inner Electrodes Ceramic Body Page : 3/15 B (min) 0.70 Unit:mm BW (min) 0.20 MULTILAYER CERAMIC CHIP CAPACITORS HVC-008-0807 7. Performance No. Item 1 Visual 2 3 4 Specification No abnormal exterior appearance Visual inspection Dimension See Page 3 Visual inspection Insulation Resistance 10,000M or 500/C Product Whichever Is Smaller Capacitance Ω Class Ω Ⅰ Within The Specified Tolerance Class Within The Specified Tolerance Ⅱ Q δ Tan 6 Class ≧ ≧ ＋ More Than 30pF : Q 1000 30pF & Below: Q 400 20C NPO/SL (C : Capacitance , pF) Ⅰ Class Ⅱ Withstanding Voltage ≦ ＞ V 500V, Rated Voltage V 500V, Applied 500Vdc Charge Time 60sec. Is applied less than 50mA current. ： Class Ⅰ： NPO/SL NPO/SL 5 Test Condition Char. Maximum X7R 2.5% Z5U/Y5U 4.0% No dielectric breakdown or mechanical breakdown Capacitance C 100pF C 100pF ≦ ＞ ClassⅡ： Frequency 1MHz±10% 1KHz±10% Voltage 1.0±0.2Vrms Frequency Voltage X7R 1KHz±10% 1.0±0.2Vrms Z5U/Y5U 1KHz±10% 1.0±0.2Vrms Perform a heat temperature at 150±5 for 30min. then place room temp. for 24±2hr. ℃ ＜ V 500V : 200% Rated Voltage 500V V 1000V: 150% Rated Voltage 1000 V :120% Rated Voltage for 1~5 sec. Current is limited to less than 50mA. ≦＜ ≦ ※ Withstanding voltage testing requires immersion of the element in a isolation fluid prevent arcing on the chip surface, at voltage over 1000Vdc. 7 8 Ⅰ Char. Temp. Range Cap. Change(%) ClassⅠ: [C2-C1/C1(T2-T1)] × 100% NPO -55℃~+125℃ ± 30 ppm/℃ SL -30℃~+85℃ +350~-1000ppm ClassⅡ: (C2-C1)/C1 × 100% Char. Temp. Range Cap. Change(%) Ⅱ X7R -55℃~+125℃ ± 15% T1: Standard temperature (25℃) Y5U -30℃~+85℃ +22% ~-56% T2: Test temperature C1:Capacitance at standard temperature(25℃) +22% ~-56% C2: Capacitance at test temperature (T2) Z5U +10℃~+85℃ Adhesive Strength No indication of peeling shall occur on A 5N·f (≒0.5Kg·f) pull force shall be applied Temperature Class Capacitance Coefficient Class of Termination the terminal electrode. for 10± 1 second. 5N·f 9 Resistance Appear- No mechanical damage shall be occur. Bending shall be applied to the 1.0 mm with to ance 1.0 mm/sec. R230 Flexure C-Meter Capacitance Change Bending of Substrate Limit Char. Cap. Change NPO ± 5.0% C Meter SL ± 5.0% 45±1mm 45±1mm X7R ± 12.5% Y5U/Z5U ± 30.0% ≦ ≦ ≦ ≦ Page : 4/15 MULTILAYER CERAMIC CHIP CAPACITORS No. 10 11 Item Specification Solderability More than 90% of the terminal surface is to be soldered newly, so metal part does not come out or dissolve . Resistance To Soldering Heat Appearance Capacitance 13 Humidity Appearance Capacitance ℃ ℃ Ⅱ ℃ ℃ Ⅰ ℃ Ⅱ Ⅰ Ⅰ δ Ⅱ Test Condition Solder Temperature : 245± 5 Dip Time : 5 ± 0.5 sec. Immersing Speed : 25±10% mm/s Solder : H63A Flux :Rosin Preheat : At 80~120 for 10~30sec. Class capacitor shall be set for 48±4 hours at room temperature after one hour heat Characteristic Cap. Change treatment at 150 +0/-10 before initial measure. Within ± 2.5% or Class ±0.25pFwhichever Preheat : At 150± 10 For 60~120sec. (NPO/SL) Dip : Solder Temperature of 260± 5 is larger of initial Dip Time : 10 ± 1sec. value Immersing Speed : 25±10% mm/s Class X7R Within ± 10% Solder : H63A Z5U/Y5U Within ± 20% Flux :Rosin To satisfy the specified initial value Q Class To satisfy the specified initial value Tan Class Insulation To satisfy the specified initial value Resistance Withstand To satisfy the specified initial value Voltage Appear- No mechanical damage shall occur ance CapacitCharacteristic Cap. Change ance Class Within ± 2.5% or (NPO/SL) ±0.25pFwhichever is larger of initial value Class X7R Within ± 7.5% Z5U/Y5U Within ± 20% Q To satisfy the specified initial value Class Tan To satisfy the specified initial value Class Insulation To satisfy the specified initial value Resistance Ⅰ δ Ⅱ 12 Tempera-. ture Cycle No mechanical damage shall occur. HVC-008-0807 Ⅱ Measure at room temperature after cooling for Class : 24 ± 2 Hours Class : 48 ± 4 Hours Ⅰ Ⅱ Ⅱ Class capacitor shall be set for 48± 4 hours at room temperature after one hour heat treatment at 150 +0/-10 before initial measure. ℃ Capacitor shall be subjected to five cycles of the temperature cycle as following: ℃ Step Temp.( ) Time(min) 1 Min Rated Temp. +0/-3 30 2 25 3 3 Max Rated Temp. +3/-0 30 4 25 3 Measure at room temperature after cooling for Class :24 ± 2 Hrs Class :48 ± 4 Hrs Solder the capacitor on P.C. board shown in Fig 2. before testing. No mechanical damage shall occur Class capacitor shall be set for 48± 4 hours at room temperature after one hour heat treatment at 150+0/-10 before initial Characteristic Cap. Change measure. Class Within ± 5.0% or (NPO/SL) ±0.5pF whichever is Temperature : 40± 2 larger of initial value Relative Humidity : 90 ~ 95%RH Test Time : 500 12/ 0Hr Class X7R Within ± 15% Ⅰ Ⅱ Ⅱ ℃ ℃ ＋ － Ⅰ Ⅱ Z5U/Y5U Within ± 30% Q More Than 30pF : Q 350 Class 30pF & Below: Q 275 2.5×C Tan Char. Maximum Class X7R 5.0% Z5U/Y5U 5.0% Insulation 1,000M or 50/C hichever is Resistance smaller. Ⅰ δ Ⅱ ≧ Ω ≧ ＋ Ωw Page : 5/15 Measure at room temperature after cooling for Class : 24 ± 2Hrs Class : 48 ± 4Hrs Ⅰ Ⅱ Solder the capacitor on P.C. board shown in Fig 2. before testing. MULTILAYER CERAMIC CHIP CAPACITORS No. Item High 14 Temperature Load (Life Test) Specification No mechanical damage shall occur Ⅰ Ⅱ ± ≧ Ω ≧ ＋ Ω Ⅰ Ⅱ Vibration Test Condition Ⅱ Class capacitors applied DC voltage (following table) is applied for one hour at then Characteristic Cap. Change maximum operation temperature 3 Class Within ±3.0% or shall be set for 48 4 hours at room temperature (NPO/SL) ± 0.3pFwhichever and the initial measurement shall be is larger conducted. Class X7R Within ± 15% Applied Voltage : Z5U/Y5U Within ± 30% Q More Than 30pF : Q 350 Rated Voltage Applied Voltage Class 30pF & Below:Q 275 2.5× C 150%Rated Voltage V≤250Vdc Tan Char. maximum Less Than 1KVdc 120%Rated Voltage Class X7R 5.0% More Than 100%Rated Voltage Z5U/Y5U 5.0% 1KVdc(include 1KV) Insulation 1,000M or 50/C whichever is Resistance smaller. (C in Farad) 1210/100V capacitance more than 1.0uF applied voltage of 120% rated voltage Temperature : max. operation temperature Test Time : 1000 +12/-0Hr Current Applied : 50 mA Max. Measure at room temperature after cooling for Class : 24 2 Hours Class : 48 4 Hours Appear- No mechanical damage shall occur Solder the capacitor on P.C. Board shown in ance Fig 2. before testing. CapacitCharacteristic Cap. Change Vibrate the capacitor with amplitude of 1.5mm ance Class Within ± 2.5% or (NPO/SL) ± 0.25pFwhichever P-P changing the frequencies from 10Hz to 55Hz and back to 10Hz in about 1 min. is larger Class X7R Within ± 7.5% Repeat this for 2 hours each in 3perpendicular Z5U/Y5U Within ± 20% directions. Q To satisfy the specified initial value Class Tan To satisfy the specified initial value Class Insulation To satisfy the specified initial value Resistance Appearance Capacitance Ⅰ δ Ⅱ 15 HVC-008-0807 Ⅰ Ⅰ δ Ⅱ Ⅱ Page : 6/15 ± ± ±℃ MULTILAYER CERAMIC CHIP CAPACITORS HVC-008-0807 Fig.1 P.C. Board for Bending Strength Test Solder Resist Copper C 40mm Material : Glass Epoxy Substrate A : Copper (Thickness : 0.035mm) B : Solder Resist 100mm 1.6mm Fig.2 Test Substrate Solder Resist Copper C Material : Glass Epoxy Substrate A 40mm B : Copper (Thickness : 0.035mm) : Solder Resist Thickness : 1.6 mm 100mm Unit:mm Type 0201 0402 0603 0805 1206 1210 1808 1812 2208 2211 2220 1825 2225 A 0.2 0.5 1.0 1.2 2.2 2.2 3.5 3.5 4.5 4.5 4.5 3.5 4.5 B 0.9 1.5 3.0 4.0 5.0 5.0 7.0 7.0 8.0 8.0 8.0 7.0 8.0 Page : 7/15 C 0.4 0.6 1.0 1.6 2.0 2.9 2.5 3.7 2.5 3.0 5.6 6.9 7.0 MULTILAYER CERAMIC CHIP CAPACITORS HVC-008-0807 8. Packing 8.1 Bulk Packing According to customer request. 8.2 Chip Capacitors Tape Packing Chip Section Empty Section 40mm min. Empty Section 20mm min. Drawing Direction 400mm min. 8.3 Material And Quantity Tape Material Paper Plastic 0201 T 0.33mm 15,000 pcs/Reel NA Tape Material Paper Plastic T 0.90mm 4,000 pcs/Reel NA 0402 T 0.55mm 10,000 pcs/Reel NA ≦ ≦ 0603/0805 T 0.90mm T 0.90mm 4,000 pcs/Reel NA NA 3,000 pcs/Reel ＞ ≦ 1206 ≦ 0.90mm ＜T≦1.25mm NA 3,000 pcs/Reel T ＞1.25mm NA 2,000 pcs/Reel Tape 1812/1825/2211/2220 2225 Material T 2.20mm T 2.20mm T 2.20mm T 2.20mm Paper NA NA NA NA Plastic 1000 pcs/Reel 700 pcs/Reel 1000 pcs/Reel 400 pcs/Reel NA Not Available ≦ ＞ ≦ ＞ ： 1210/1808 T 1.25mm NA NA 3000 pcs/Reel 2000 pcs/Reel T ≦1.25mm 2208 T ≦2.20mm NA 1000 pcs/Reel 8.4 Cover Tape Reel Off Force 8.4.1 Peel-Off Force 5 g·f ≦Peel-Off Force ≦70 g·f 8.4.2 Measure Method 165 to 180° Top Tape Bottom Tape Page : 8/15 ＞ MULTILAYER CERAMIC CHIP CAPACITORS 8.5 Paper Tape Pitch Hold HVC-008-0807 Chip Inserting Hole I F A G B C t D H E Unit:mm TYPE 0201 0402 0603 0805 1206 1210 A 0.37± 0.1 0.61± 0.1 1.10± 0.2 1.50± 0.2 1.90± 0.2 2.90± 0.2 B 0.67± 0.1 1.20± 0.1 1.90± 0.2 2.30± 0.2 3.50± 0.2 3.60± 0.2 C 4.00± 0.1 TYPE 0201 0402 0603 0805 1206 1210 F 1.75± 0.10 G 3.50± 0.05 H 8.0± 0.30 D 2.00± 0.05 E 2.00± 0.1 4.00± 0.1 I φ1.50 +0.10/-0 t 1.10 max. 8.6 Plastic Tape Pitch Hold Chip Inserting Hole I F A G B t C O D E J Type 0805 1206 1210 1808 1812 1825 2208 2211 2220 2225 H Unit:mm A 1.5±0.2 1.9±0.2 2.9±0.2 2.5±0.2 3.6±0.2 6.9 0.2 2.5±0.2 3.2±0.2 5.4±0.2 6.9 0.2 ± ± B 2.3±0.2 3.5±0.2 3.6±0.2 4.9±0.2 4.9±0.2 4.9 0.2 6.1±0.2 6.1±0.2 6.1±0.2 6.1 0.2 C 4.0± 0.1 D 2.0± 0.05 E 4.0± 0.1 8.0± 0.1 ± ± Page : 9/15 F 1.75± 0.1 MULTILAYER CERAMIC CHIP CAPACITORS Type 0805 1206 1210 1808 1812 1825 2208 2211 2220 2225 G 3.5± 0.05 H 8.0± 0.3 5.5± 0.05 12.0 ± 0.3 I φ1.5+0.1/-0 J 3.0 max. t 0.3 max. HVC-008-0807 O 0.15 min. 4.0 max. 8.7 Reel Dimensions ： Reel Material Polystyrene E C B D A W Unit:mm Type 0201 0402 0603 0805 1206 1210 1808 1812 1825 2208 2211 2220 2225 φ382 max A φ50 min B φ178±0.2 φ60±0.2 C φ13± 0.5 D φ21± 0.8 E 2.0±0.5 W 10± 0.15 ± 13 0.3 Page : 10/15 MULTILAYER CERAMIC CHIP CAPACITORS HVC-008-0807 Precautionary Notes: 1. Storage Store the capacitors where the temperature and relative humidity don’t exceed 40°C and 70%RH. We recommend that the capacitors be used within 6 months from the date of manufacturing. Store the products in the original package and do not open the outer wrapped, polyethylene bag, till just before usage. If it is open, seal it as soon as possible or keep it in a desiccant with a desiccation agent. 2. Construction of Board Pattern Improper circuit layout and pad/land size may cause excessive or not enough solder amount on the PC board. Not enough solder may create weak joint, and excessive solder may increase the potential of mechanical or thermal cracks on the ceramic capacitor. Therefore we recommend the land size to be as shown in the following table: 2.1 Size and recommend land dimensions for reflow soldering . Capacitor C Slit 0201 0402 0603 0805 1206 1210 1808 1812 1825 2208 2211 2220 2225 E D B Chip (mm) L W 0.60 0.30 1.00 0.50 1.60 0.80 2.00 1.25 3.20 1.60 3.20 2.50 4.60 2.00 4.60 3.20 4.60 6.35 5.70 2.00 5.70 2.80 5.70 5.00 5.70 6.35 EIA Code Land Solder Resistor A A 0.2~0.3 0.3~0.5 0.4~0.6 0.7~0.9 2.2~2.4 2.2~2.4 2.8~3.4 2.8~3.4 2.8~3.4 4.0~4.6 4.0~4.6 4.0~4.6 4.0~4.6 B 0.2~0.4 0.3~0.5 0.6~0.7 0.6~0.8 0.8~0.9 1.0~1.2 1.8~2.0 1.8~2.0 1.8~2.0 2.0~2.2 2.0~2.2 2.0~2.2 2.0~2.2 Land (mm) C 0.2~0.4 0.4~0.6 0.6~0.8 0.8~1.1 1.0~1.4 1.8~2.3 1.5~1.8 2.3~3.0 5.1~5.8 1.5~1.8 2.0~2.6 3.5~4.8 5.1~5.8 D ----1.0~2.0 1.0~2.0 1.0~2.8 1.0~2.8 1.0~4.0 1.0~4.0 1.0~4.0 1.0~4.0 1.0~4.0 2.2 Mechanical strength varies according to location of chip capacitors on the P.C. board. Design layout of components on the PC board such a way to minimize the stress imposed on the components, upon flexure of the boards in depanelization or other processes. Component layout close to the edge of the board or the “depanelization line” is not recommended. Susceptibility to stress is in the order of: a>b>c and d>e e b perforation a c slit d Page : 11/15 E ----3.2~3.7 4.1~4.6 3.6~4.1 4.8~5.3 7.1~8.3 3.6~4.1 4.4~4.9 6.6~7.1 7.1~8.3 MULTILAYER CERAMIC CHIP CAPACITORS HVC-008-0807 2.3 Layout Recommendation Example Use of Common Solder Land Need to Avoid Solder With Chassis Lead Wire Chip Use of Common Solder Land With Other SMD Chassis Solder Excessive Solder Solder Land Adhesive Solder Land PCB Recommendation Lead Wire Chip α Solder Resist Solder Resist Adhesive Solder Land PCB β α>β 3. Mounting 3.1 Sometimes crack is caused by the impact load due to suction nozzle in pick and place operation. In pick and place operation, if the low dead point is too low, excessive stress is applied to component. This may cause cracks in the ceramic capacitor, therefore it is required to move low dead point of a suction nozzle to the higher level to minimize the board warp age and stress on the components. Nozzle pressure is typically adjusted to 1N to 3N (static load) during the pick and place operation. Excessive Stress Nozzle Warping of Board Warping of Board PCB Crack Support pin 3.2 Amount of Adhesive a a b Example : 0805 & 1206 0.2mm min. a b c c 70 ~ 100 µm Do not touch the solder land c Page : 12/15 MULTILAYER CERAMIC CHIP CAPACITORS HVC-008-0807 4. Soldering 4.1. Wave Soldering Most of components are wave soldered with solder at 230 to 250°C. Adequate care must be taken to prevent the potential of thermal cracks on the ceramic capacitors. Refer to the soldering methods below for optimum soldering benefits. Recommend flow soldering temperature Profile Soldering Pre-heating Cooling 300 Soldering Method Change in Temp.( ) 250 1206 and Under T ≤ 100~130 max. 230 200 T Δ ℃ Temperature (°C) Δ 120seconds or more 60seconds or more 2 to 3 sec. To optimize the result of soldering, proper preheating is essential: 1) Preheat temperature is too low a. Flux flows to easily b. Possibility of thermal cracks 2) Preheat temperature is too high a. Flux deteriorates even when oxide film is removed b. Causes warping of circuit board c. Loss of reliability in chip and other components Cooling Condition: Natural cooling using air is recommended. If the chips are dipped into a solvent for cleaning, the temperature difference ( T) between the solvent and the chips must be less than 100°C. Δ 4.2 Reflow Soldering Preheat and gradual increase in temperature to the reflow temperature is recommended to decrease the potential of thermal crack on the components. The recommended heating rate depends on the size of component, however it should not exceed 3°C/Sec. Recommend reflow profile for Lead-Free soldering temperature Profile (MIL-STD-202G #210F) Soldering Cooling Pre-heating 260°C max./10sec. Min. 260max. Temperature (°C) 217 ΔT 150°C /60sec. Min. 70 to 90 sec. Page : 13/15 ※ The cycles of soldering : Twice (max.) Soldering Method Change in Temp.( ℃) 1206 and Under ΔT ≦ 190 ℃ 1210 and Over ΔT ≦ 130 ℃ MULTILAYER CERAMIC CHIP CAPACITORS HVC-008-0807 4.3 Hand Soldering Sudden temperature change in components, results in a temperature gradient recommended in the following table, and therefore may cause internal thermal cracks in the components. In general a hand soldering method is not recommended unless proper preheating and handling practices have been taken. Care must also be taken not to touch the ceramic body of the capacitor with the tip of solder Iron. 350 Soldering Method 1206 and Under 1210 and Over 250 Temperature (°C) 200 Change in Temp.( T 190 T 130 Δ ≦ Δ ≦ ℃ ℃ ℃) ΔT Within 5 seconds. How to Solder Repair by Solder Iron 1) Selection of the soldering iron tip The required temperature of solder iron for any type of repair depends on the type of the tip, the substrate material, and the solder land size. 2) recommended solder iron condition a.) Preheat the substrate to (60°C to 120°C) on a hot plate. Note that due to the heat loss, the actual setting of the hot plate may have to be higher. (For example 100°C to 150°C) b.) Soldering iron power shall not exceed 30 W. c.) Soldering iron tip diameter shall not exceed 3mm. d.) Temperature of iron tip shall not exceed 350°C., and the process should be finished within 5 seconds. ( refer to MIL-STD-202G) f.) Do not touch the ceramic body with the tip of solder iron. Direct contact of the soldering iron tip to ceramic body may cause thermal cracks. g.) After soldering operation, let the products cool down gradually in the room temperature. 5. Handling after chip mounted 5.1 Proper handling is recommended, since excessive bending and twist of the board, depends on the orientation of the chip on the board, may induce mechanical stress and cause internal crack in the capacitor. Higher potential of crack Lower potential of crack Bending → Twist 5.2 There is a potential of crack if board is warped due to excessive load by check pin ○ ╳ Check pin Support Pin Check pin Page : 14/15 MULTILAYER CERAMIC CHIP CAPACITORS HVC-008-0807 5.3 Mechanical stress due to warping and torsion. (a) Crack occurrence ratio will be increased by manual separation. (b) Crack occurrence ratio will be increased by tensile force , rather than compressive force. ○ :Compressive Stress ╳ :Tensile Stress 6. Handling of Loose Chip Capacitor 6.1 If dropped the chip capacitor may crack. Crack Floor 6.2 In piling and stacking of the P.C. boards after mounting for storage or handling, the corner of the P.C. board may hit the chip capacitor mounted on another board to cause crack. P.C.B Crack 7. Safekeeping condition and period For safekeeping of the products, we recommend to keep the storage temperature between +5 to +40°C and under humidity of 20 to 75% RH. The shelf life of capacitors is 6 months. Page : 15/15