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LCC

LCC

  • 厂商:

    HOLYSTONECAPS(禾伸堂)

  • 封装:

  • 描述:

    LCC - Large Size NP0 & X7R MLCC Capacitors - HolyStone International

  • 数据手册
  • 价格&库存
LCC 数据手册
LCC Series - Large Size MLCC Capacitors LCC Series Large Size NP0 & X7R MLCC Capacitors 50V – 8KV  Applications.  Voltage multipliers  Power supplies  DC-DC converters  Surge protection  Industrial control circuits  Isolation  Ballast  Snubber  Custom applications  Features  Optimized internal design offers the highest possible voltage rating up to 8KVdc.  Capacitance range from 470pF - 33uF and case sizes from 1515 – 7565.  Available with proprietary surface coating for arc prevention  Available with flexible termination (Super Term) to minimize the effects of mechanical stress.  High reliability screening is available.  Pd/Ag, 100% Sn and 90/10 Sn/Pb terminations available.  RoHS compliant.  Summary of Specifications Operating Temperature Rated Voltage Temperature Coefficient Capacitance Range Dissipation Factor Insulation Resistance Ageing Dielectric Strength -55~+125 ℃ X7R : ≤ ± 15% NP0 : Q≧1000 ; X7R : D.F.≦2.5% NP0 : ≤ ± 30ppm/ ℃ 50Vdc to 8KVdc NP0 :100pF to 820nF ; X7R :1000pF to 33uF , -55~+125 ℃ (EIA Class Ⅱ ) , -55~+125 ℃ (EIA Class Ι ) 10GΩ or 500/C Ω whichever is smaller (C in Farad ) NP0:0% ; X7R: 1.0 % per decade of time V ≤ 500V 500V ≤ V < 1000V V ≥1000V : 200% rated voltage : 150% rated voltage : 120% rated voltage  How To Order C 2520 X 103 K 102 T N S Testing Requirement Ex.: S: Standard Electrical H: Hi-Reliability X Special Requirement Ex.: Blank: Standard O: Arc Prevention Coating X: Flexible Termination (Super Term) Z: Arc Prevention and SuperTerm Product Chip Size Dielectric Code C: MLCC EX.: Ex.: Multilayer 1515 N: NP0 Ceramic 2520 X: X7R Capacitor 3530 3640 4540 5550 6560 7565 Capacitance Tolerance Unit : pF Ex.: Ex.: 100:10×100 C:+/-0.25pF 471:47×101 D:+/-0.50pF 102:10×102 J:+/- 5% K:+/-10% M:+/-20% Rated Packaging Termination Voltage Ex.: Ex.: Ex.: T: Tape S:Solderable 050:50Vdc & Reel Ag 251:250Vdc W: Waffle P:Pd/Ag 631:630Vdc Pack 102:1000Vdc N: 100% B: Bulk Sn Plated W:90/10 Sn/Pb Plated - 30 - LCC Series-Large Size Multilayer Ceramic Chip Capacitors  Dimensions TYPE BW B 1515 2520 T 3530 3640 W L 4540 5550 6560 7565 L 3.80±0.50 6.35±0.50 8.90±0.50 9.20±0.50 11.5±0.50 14.0±0.50 16.5±0.50 19.0±0.50 [.750±.020] [.65±.020] [.55±.020] [.45±.020] [.36±.020] [.35±.020] [.25±.020] [.15±.020] W 3.80±0.50 [.15 ±.020] 5.00±0.50 7.60±0.50 10.2±0.50 10.2±0.50 12.7±0.50 15.3±0.50 16.5±0.50 [.65±.020] [.60±.020] [.50±.020] [.40±.020] [.40±.020] [.30±.020] [.20±.020] T (max) 3.20 [.126] [.126] [.200] [.200] [.200] [.200] [.200] [.200] Unit : mm [inches] B (min) BW (min) 1.60 0.30 [.059] [.157] [.217] [.236] [.295] [.354] [.012] [.012] [.012] [.012] [.012] [.012] [.012] [.012] 3.20 5.00 5.00 5.00 5.00 5.00 5.00 4.00 5.50 6.00 7.50 9.00 0.30 0.30 0.30 0.30 0.30 0.30 0.30 11.50 [.453] [.551] 14.00  Capacitance Range Size 1515 2520 3530 3640 4540 5550 6560 7565 Dielectric NPO X7R NPO X7R NPO X7R NPO X7R NPO X7R NPO X7R NPO X7R NPO X7R 50V 473 225 823 475 154 106 224 126 284 156 364 186 654 226 844 336 100V 393 105 683 225 134 475 184 565 244 685 304 825 484 186 674 226 200V 363 474 563 474 104 225 124 225 184 225 224 275 404 106 504 186 500V 103 124 473 224 823 824 104 105 154 125 184 225 304 335 474 475 Capacitance maximum 1KV 2KV 3KV 222 821 473 682 103 392 222 473 153 472 253 103 472 224 473 183 373 153 562 274 683 273 483 203 962 394 104 393 683 273 153 474 124 823 104 423 223 105 224 104 134 553 283 125 364 154 4KV 5KV 8KV 102 222 332 822 362 153 472 223 562 333 682 563 103 823 471 102 102 472 122 103 152 153 182 223 332 333 472 473 471 102 561 182 621 392 681 562 821 103 102 153   All values are capacitance EIA codes. Other dimensions, capacitance values and voltage ratings are available. Please contact HEC. *Soldering and handling precautions: Large ceramic capacitors are more prone to thermal and mechanical cracks. To minimize mechanical cracks, capacitors have to be handled carefully in the original waffle pack container, carrier tape or other suitable container. Care must be taken that ceramic chips do not come into contact with one another causing chip outs, cracks or other mechanical damage. The recommended method for soldering large chips is reflow soldering. Wave soldering and manual soldering are not recommended. Ceramic capacitors should be preheated to within 50°C of the peak soldering temperature and then use a maximum 2°C/second ramp rate for both heating and cooling. A sudden increase or decrease in temperature during soldering may cause internal thermal cracks. Available Options: • HEC offers flexible termination (Super Term) for very large chips to minimize mechanical cracks due to board flexing. • To minimize the potential for surface arcing in higher voltage applications, HEC offers the option of a proprietary surface coating. • Pure tin terminated / ROHS compliant products are offered as standard, however, lead (Pb) content plated termination is also available. • Pd/Ag termination is also available as an option for hybrid circuits and other applications. - 31 -

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