SCC2220X472K502TG

CERTIFIED SAFETY CAPACITORS SCC-TG-009-1807 1. Scope The SCC series X2, X1/Y2 safety capacitors are designed specifically for use in modem, facsimile, telephone and other electronic equipment. These parts are compliant to EN60384-14, IEC60384-14 , UL60384-14 , CSA 60384-1 & CSA 60384-14. (This product compliant with the RoHS & HF and Pb free.) 2. Parts Number Code SCC 1812 X 102 K 502 T G (1) (2) (3) (4) (5) (6) (7) (8) (1)Product (5)Capacitance Tolerance Product Code SCC Safety Approval of MLCC Product (2)Chip Size Code 1808 1812 2208 2211 2220 2825 Length×Width unit : mm(inch) 4.60× 2.00 (.18× .08) 4.60× 3.20 (.18× .12) 5.70× 2.00 (.22× .08) 5.70× 2.80 (.22× .11) 5.70× 5.00 (.22× .20) 7.10× 6.35 (.28× .25) (4)Capacitance Temperature Range -55 ~+125 -55 ~+125 ℃ ℃ ℃ ℃ Code 202 252 502 602 Temperature Coefficient 30 ppm/ ± 15% ℃ unit :pico farads(pF) Code Nominal Capacitance (pF) 5R0 5.0 330 33.0 151 150.0 102 1,000.0 103 10,000.0 . If there is a decimal point, it shall be expressed by an English capital letter R ※ Tolerance ± 0.25 pF ± 0.50 pF ± 1.00 pF ± 5.00 % ± 10.0 % ± 20.0 % +10%~+20% Nominal Capacitance Less Than 10 pF (Include 10 pF) More Than 10 pF (6) Class Level of Capacitors (3)Temperature Characteristics Code Temperature Characteristic N NPO X X7R Code C D E J K M Q Class X2 X2 (305Vac) X1/Y2 X1/Y2 for SCC2208N,SCC2211N,SCC2220N Series (7)Tapping Code T B Type Tape & Reel Bulk (8)Special Requirement Code Code G Page : 1 /15 Downloaded From Oneyac.com Type Pb free Type CERTIFIED SAFETY CAPACITORS SCC-TG-009-1807 3. Nominal Capacitance and Tolerance 3.1 Standard Combination of Nominal Capacitance and Tolerance Class Class Ⅰ Characteristic NPO Class Ⅱ Tolerance Less Then 10 pF C (± 0.25 pF) D (± 0.50 pF) E (± 1.00 pF) More Than 10 pF J (± 5.00 %) K (± 10.0 %) X7R K (± 10.0 %), Nominal Capacitance 0.5,1,1.5,2,2.5,3,3.5,4,4.5,5 5,6,7,8,9,10 6,7,8,9,10 E-24 series M (± 20.0 %) E-12 series 3.2 E series(standard Number) Standard No. E- 3 E- 6 E-12 E-24 1.0 1.0 1.0 1.0 1.1 1.5 1.2 1.2 1.3 1.5 1.5 1.6 1.8 1.8 2.0 Application Capacitance 2.2 2.2 3.3 2.2 2.7 3.3 3.9 2.2 2.7 3.3 3.9 2.4 3.0 3.6 4.3 4. Operation Temperature Range Class Ⅰ Ⅱ Characteristic NPO X7R 5. Storage Condition ： Temperature Range -55 ~ +125 -55 ~ +125 ℃ ℃ ℃ ℃ Reference Temp. 25 25 ℃ Storage Temperature 5 to 40 ： Relative Humidity 20 to 70 % ： Storage Time 12 months max. Page : 2 /15 Downloaded From Oneyac.com ℃ ℃ 4.7 4.7 4.7 4.7 5.1 6.8 5.6 5.6 6.2 6.8 6.8 7.5 8.2 8.2 9.1 CERTIFIED SAFETY CAPACITORS SCC-TG-009-1807 6. Dimensions 6.1 Configuration and Dimension ： Unit:mm BW TYPE 1812 L 4.60± 0.30 T W L ： 6.2 Termination Type Solder Metal Barrier External Electrodes Inner Electrodes Ceramic Body Page : 3 /15 Downloaded From Oneyac.com W 3.20± 0.30 T 2.00± 0.20 BW (min) 0.20 CERTIFIED SAFETY CAPACITORS SCC-TG-009-1807 7. Electronic Nominal Specification 7.1 Safety Standard: TUV : IEC 60384-14:2013 EN 60384-14:2013 UL :UL 60384-14 CSA 60384-1 & CSA 60384-14 Temperature Characteristic Class Size Rated Voltage Certificated NPO X2 1808 250 Vrms TUV/UL X7R X2 1808 250 Vrms TUV/UL X7R X2 1812 250 Vrms TUV/UL X7R X2 2220 250 Vrms TUV/UL X7R X2 2825 250 Vrms UL NPO X1/Y2 1808 250 Vrms TUV/UL X7R X1/Y2 1808 250 Vrms TUV/UL NPO X1/Y2 1812 250 Vrms TUV/UL X7R X1/Y2 1812 250 Vrms TUV/UL NPO X1/Y2 2208 250 Vrms TUV/UL X7R X1/Y2 2208 250 Vrms TUV/UL NPO X1/Y2 2211 250 Vrms TUV/UL X7R X1/Y2 2211 250 Vrms TUV/UL NPO X1/Y2 2220 250 Vrms TUV/UL X7R X1/Y2 2220 250 Vrms TUV/UL 100 X7R X2 2220 305 Vrms TUV/UL 150 10 Capacitance Range (pF) 101 102 103 1000 2 150 2200 330 4700 150 33000 47000 330 2 150 1000 680 2 130 1000 36 2 1000 2700 68 2 Page : 4 /15 1000 330 2 Downloaded From Oneyac.com 56000 1200 4700 33000 CERTIFIED SAFETY CAPACITORS SCC-TG-009-1807 8. Performance No. Item Specification 1 2 3 4 Visual Dimension Capacitance Q and Dissipation Factor No abnormal exterior appearance See Page 3 / Item 6. Within the specified tolerance Class (NPO) More than 30pF : Q 1000 30pF & below: Q 400 20C (C:pF) Class (X7R) Maximum : 2.5% (0.025) Ⅰ Ⅱ 5 6 Insulation Resistance Voltage Proof ≧ ≧ ＋ Minimum 10,000M Ω No dielectric breakdown or mechanical breakdown Test Condition Visual Inspection Visual Inspection Char. Frequency NPO C 1000pF 1MHz± 10% C 1000pF 1KHz± 10% ≦ ＞ Voltage 1.0± 0.2Vrms X7R 1KHz± 10% 1.0± 0.2Vrms After performing deage at 150±5% for 30min. and placement room temperature for 24±2hr. Applied Voltage: Applied Voltage:500V Charge Time : 60sec. Applied Voltage: X Capacitor :Applied Voltage 1075Vdc(4.3Ur) Y Capacitor :Applied Voltage 1500Vac For 1min. Voltage ramp up rate 150V/sec(for Vac Test) charge/discharge Current is less than 50mA. ≦ 7 ℃ Solderability More than 90% of the terminal surface is Solder Temperature : 245± 5 to be soldered newly, so metal part does Dip Time : 5 ± 0.5 sec. not come out or dissolve Immersing Speed : 25±10% mm/s Solder : Lead Free Solder Flux :Rosin Preheat : At 80~120 For 10~30sec. ℃ 8 Resistance to Flexure of Substrate Appearance Capacitance Cap. Change ≤ ± 5.0% of initial value ≤ ± 12.5% of initial value Q / tan To satisfy the specified initial value Insulation To satisfy the specified initial value Resistance Voltage To satisfy the specified initial value Proof Robustness Appear- No indication of peeling shall occur on of ance the terminal electrode. Shear CapacitCharacteristic Cap. Change ance Class (NPO) ≤ ± 5.0% of initial value Class (X7R) ≤ ± 12.5% of initial value Q / tan To Satisfy The Specified Initial Value Insulation To Satisfy The Specified Initial Value Resistance Voltage To Satisfy The Specified Initial Value Proof δ 9 No mechanical damage shall occur. δ Characteristic Class (NPO) Ⅰ ClassⅡ(X7R) Ⅰ Ⅱ Page : 5 /15 Downloaded From Oneyac.com Bending shall be applied to the 1.0 mm with 1.0 mm/sec. The duration of the applied forces shall be 5 ± 1sec R340 Bending Limit C Meter 45±1mm 45±1mm Solder the capacitor on P.C. board shown in Fig 1. before testing. Pull force shall be applied for 10± 1 second. 0603----5N( 0.5 Kg·f) 0603----10N( 1.0 Kg·f) ≦ ＞ ≒ ≒ N·f Solder the capacitor on P.C. board shown in Fig 1. before testing. CERTIFIED SAFETY CAPACITORS No. Item 10 Resistance To Soldering Heat Specification Appearance Capacitance No mechanical damage shall occur. δ Q / Tan Insulation Resistance Voltage Proof 11 Damp Heat Appear/ ance Steady CapacitState ance Q Class Ⅰ Tan δ ClassⅡ Characteristic Cap. Change Class (NPO) ≤ ± 10% of initial value Class (X7R) ≤ ± 20% of initial value To satisfy the specified initial value Ⅰ Ⅱ More than 1,000M Ω To Satisfy The Specified Initial Value No mechanical damage shall occur. Characteristic Cap. Change Class (NPO) ≤ ± 15% of initial value Class (X7R) ≤ ± 15% of initial value More Than 30pF : Q 350 30pF & Below:Q 275+2.5× C Ⅰ Ⅱ ≧ (C:pF) ≧ Ω Insulation More Than 1,000M Resistance Voltage To Satisfy The Specified Initial Value Proof 12 Endurance AppearNo Mechanical Damage Shall Be ance Occur CapacitCharacteristic Cap. Change ance Class (NPO) ≤ ± 20% of initial value Class (X7R) ≤ ± 20% of initial value Q More Than 30pF : Q 350 Class 30pF & Below:Q 275+2.5×C (C:pF) Tan Maximum 5.0% Class Insulation Minimum 1,000M Resistance Voltage To satisfy the specified initial value Proof Ⅰ δ Ⅱ ≧ Test Condition Class capacitor shall be set for 48±4 hours at room temperature after one hour heat treatment at 150 +0/-10 before initial measure. Preheat : At 150± 10 For 60~120sec. Dip : Solder Temperature of 260± 5 Dip Time : 10 ± 1sec. Flux :Rosin Measure at room temp. after cooling for: Class : 24 ± 2 Hours Class : 48 ± 4 Hours ℃ ℃ ℃ Ⅰ Ⅱ Test Condition : Temperature : 40 Humidity : 95 %RH Test Time : 500hr (21days) The capacitors with rated voltage(250Vac) applied. Measure at room temp. after cooling for: Class :24 ± 2 Hrs Class :48 ± 4 Hrs ℃ Ⅰ Ⅱ Solder The Capacitor On P.C. Board Shown In Fig 2. Before Testing. Maximum 5.0% Ⅰ Ⅱ Ⅱ SCC-TG-009-1807 ≧ Impulse Voltage Each individual capacitor shall be subjected to a 2.5KV(X2) and 5KV(X1/Y2) impulse for three times. Then the capacitors are applied to life test. Front time T1=1.2µs=1.67T Time to half-value T2=50µs Ω ℃ Temperature : 125 Test Time : 1000hrs Applied Voltage : Class X Capacitors :1.25Ur (312.5Vac) Class Y Capacitors :1.70Ur (425Vac) Except that once every hour the voltage shall be increased to 1000Vrms for 0.1s. Additional impulse 2.5KV of Y3 for EN60950 standard. Page : 6 /15 Downloaded From Oneyac.com CERTIFIED SAFETY CAPACITORS No. Item 13 Passive Flammability 14 Active Flammability Specification SCC-TG-009-1807 Test Condition 3 Capacitor didn’t burnt at all Volume Sample : 21.56mm Flame exposure time : 5 sec.Max. The cheese cloth shall not burn with The capacitors of class each test capacitors a flame applied Ur(250Vac). Then each sample shall be subjected to 20 discharges from a tank capacitor, charge to a voltage that, when discharged, places Ui(2500V) across the capacitor under test. The interval between successive discharges shall be 5s. Page : 7 /15 Downloaded From Oneyac.com CERTIFIED SAFETY CAPACITORS SCC-TG-009-1807 Fig.1 P.C. Board for Bending Strength Test Solder Resist (referring to IEC384-14 and EN132400) Copper C Unit:mm 40mm Material : Glass Epoxy Substrate A : Copper (Thickness : 0.035mm) B : Solder Resist 100mm 1.6mm Fig.2 Test Substrate C 10mm A Material : Glass Epoxy Substrate : Copper (Thickness : 0.035mm) : Solder Resist Thickness : 1.6 mm 3mm B Unit:mm Type 1206 1808 1812 2208 2211 2220 A 2.2 3.5 3.5 4.5 4.5 4.5 B 5.0 7.0 7.0 8.0 8.0 8.0 Page : 8 /15 Downloaded From Oneyac.com C 2.0 2.5 3.7 2.5 3.0 5.6 CERTIFIED SAFETY CAPACITORS SCC-TG-009-1807 9. Packing 9.1 Bulk Packing According to customer request. 9.2 Chip Capacitors Tape Packing Empty Section 40mm min. Chip Section Empty Section 20mm min. Drawing Direction 400mm min. 9.3 Material And Quantity Tape Material Plastic ≦ T 0.90mm 4,000 pcs/Reel 1206 0.90mm T 1.25mm 3,000 pcs/Reel ＜≦ Tape 1808 Material 0.9mm T 1.25mm 1.25mm T 2.0mm Plastic 3000 pcs/Reel 2000 pcs/Reel ＜≦ ＜≦ ＞ T 1.25mm 2,000 pcs/Reel 1812/2208/2211/2220 1.25mm T 2.2mm T 2.2mm 1000 pcs/Reel 700 pcs/Reel ＜≦ Tape 2825 Material T 2.6mm Plastic 400 pcs/Reel ＞ 9.4 Cover Tape Reel Off Force 9.4.1 Peel-Off Force 5 g·f ≦Peel-Off Force ≦70 g·f 9.4.2 Measure Method 165 to 180° Top Tape Bottom Tape Page : 9 /15 Downloaded From Oneyac.com ＞ CERTIFIED SAFETY CAPACITORS SCC-TG-009-1807 9.5 Plastic Tape Pitch Hold Chip Inserting Hole I F A G H B t C O D E J Unit:mm Type 1206 1808 1812 2208 2211 2220 2825 A 1.9± 0.2 2.5±0.2 3.6±0.2 2.5±0.2 3.2±0.2 5.4±0.2 6.7±0.2 B 3.5± 0.2 4.9±0.2 4.9±0.2 6.1±0.2 6.1±0.2 6.1±0.2 7.5±0.2 C 4.0± 0.1 Type 1206 1808 1812 2208 2211 2220 2825 G 5.5± 0.05 H 12.0 ± 0.3 φ1.5+0.1/-0 7.5± 0.10 16.0 ± 0.3 D 2.0± 0.05 E 4.0± 0.1 F 1.75± 0.1 8.0± 0.1 12.0± 0.1 I J 3.7 max. t 0.3 max. O 1.0± 0.1 1.5± 0.1 0.35 max. 9.6 Reel Dimensions ：Polystyrene Reel Material E C B D A Type 1206 1808 1812 2208 2211 2220 2825 A 178± 2.0 W B φ50 min C φ13± 0.5 Unit:mm D φ21± 0.8 Page : 10 /15 Downloaded From Oneyac.com E 2.0±0.5 W 14± 0.15 CERTIFIED SAFETY CAPACITORS SCC-TG-009-1807 Caution 1. Storage Store the capacitors where the temperature and relative humidity don’t exceed 40°C and 70%RH. We recommend that the capacitors be used within 12 months from the date of manufacturing. Store the products in the original package and do not open the outer wrapped, polyethylene bag, till just before usage. If it is open, seal it as soon as possible or keep it in a desiccant with a desiccation agent. 2. Construction of Board Pattern Improper circuit layout and pad/land size may cause excessive or not enough solder amount on the PC board. Not enough solder may create weak joint, and excessive solder may increase the potential of mechanical or thermal cracks on the ceramic capacitor. Therefore we recommend the land size to be as shown in the following table: 2.1 Size and recommend land dimensions for reflow soldering. Capacitor C Slit Land EIA Code 1808 1812 2208 2211 2220 E D B Chip (mm) L W 4.60 2.00 4.60 3.20 5.70 2.00 5.70 2.80 5.70 5.00 A 2.8~3.4 2.8~3.4 4.0~4.6 4.0~4.6 4.0~4.6 B 1.2~1.4 1.2~1.4 1.4~1.6 1.4~1.6 1.4~1.6 Land (mm) C 1.5~1.8 2.3~3.0 1.5~1.8 2.0~2.6 3.5~4.8 D 1.0~2.8 1.0~2.8 1.0~4.0 1.0~4.0 1.0~4.0 E 3.6~4.1 4.8~5.3 3.6~4.1 4.4~4.9 6.6~7.1 Solder Resistor A 2.2 Mechanical strength varies according to location of chip capacitors on the P.C. board. Design layout of components on the PC board such a way to minimize the stress imposed on the components, upon flexure of the boards in depanelization or other processes. Component layout close to the edge of the board or the “depanelization line” is not recommended. Susceptibility to stress is in the order of: a>b>c and d>e e b perforation a c slit d Page : 11 /15 Downloaded From Oneyac.com CERTIFIED SAFETY CAPACITORS SCC-TG-009-1807 2.3 Layout Recommendation Example Use of Common Solder Land Solder With Chassis Use of Common Solder Land With Other SMD Need to Avoid Solder Land Chassis Lead Wire Chip Excessive Solder Solder Adhesive α Solder Land PCB Recommendation Solder Resist Lead Wire Chip Solder Resist Solder Land Adhesive PCB Solder Land β α>β 3. Mounting 3.1 Sometimes Crack is caused by the impact load due to suction nozzle in pick and place operation. In pick and place operation, if the low dead point is too low, excessive stress is applied to component. This may cause cracks in the ceramic capacitor, therefore it is required to move low dead point of a suction nozzle to the higher level to minimize the board warp age and stress on the components. Nozzle pressure is typically adjusted to 1N to 3N (static load) during the pick and place operation. Excessive Stress Nozzle Warping of Board Warping of Board PCB Crack Support pin 3.2 Amount of Adhesive a b a Example : 0805 & 1206 0.2mm min. a b c c 70 ~ 100 µm Do not touch the solder land c Page : 12 /15 Downloaded From Oneyac.com CERTIFIED SAFETY CAPACITORS SCC-TG-009-1807 4. Soldering 4.1. Wave Soldering Most of components are wave soldered with solder at 230 to 250°C. Adequate care must be taken to prevent the potential of thermal cracks on the ceramic capacitors. Refer to the soldering methods below for optimum soldering benefits. Recommend flow soldering temperature Profile Pre-heating Soldering Cooling Temperature (°C) 300 Soldering Method 1206 and Under 250 230 200 ℃ Change in Temp.( ) T ≤ 100~130 max Δ ΔT 120seconds or more 60seconds or more 2 to 3 sec. When setting preheat temperatures, that recommend as preheat conditions which can pass the following points for PCB. 1) Preheat temperature is too low a. Flux flows to easily b. Possibility of thermal cracks 2) Preheat temperature is too high a. Flux deteriorates even when oxide film is removed b. Too large a warp in circuit board c. Loss of reliability in chip and other parts Cooling Condition: Natural cooling using air is recommended. If the chips are dipped into a solvent for cleaning, the temperature difference ( T) must be less than 100 Δ ℃ 4.2 Reflow Soldering Preheat and gradual increase in temperature to the reflow temperature is recommended to decrease the potential of thermal crack on the components. The recommended heating rate depends on the size of component; however it should not exceed 3°C/Sec. Recommend reflow profile for Lead-Free soldering temperature Profile (MIL-STD-202G #210F) Soldering Cooling Pre-heating Temperature (°C) 217 ※ The cycles of soldering : Twice (max.) Soldering Method Change in Temp.( ℃) 1206 and Under ΔT ≦ 190 ℃ 1210 and Over ΔT ≦ 130 ℃ 260°C max./10sec. Min. 260max. ΔT 150°C / 60sec. Min. 70 to 90 sec. Page : 13 /15 Downloaded From Oneyac.com CERTIFIED SAFETY CAPACITORS SCC-TG-009-1807 4.3 Hand Soldering Sudden heating of the components results in distortion due to a high internal temperature differential, causing cracked chips. When preheating, keep temperature differential T, within the range shown in table. The smaller the T, the less stress on the chip. Δ Δ 350 Soldering Method 1206 and Under 1210 and Over 250 Temperature (°C) 200 Change in Temp.( T 150 T 130 Δ ≦ Δ ≦ ℃ ℃ ℃) ΔT Within 5 seconds. How to Solder Repair by Solder Iron 1) Selection of the soldering iron tip Tip temperature of solder iron various by its type , P.C.board material and solder land size. Higher the tip temperature, quick the operation is .but the heat shock may crack the chip capacitor. 2) recommended solder iron condition a.) Preheating Condition Board and components should be preheated sufficiently at 150°C or over, and soldering should be conducted with soldering iron as boards and components are maintained at sufficient temperatures. b.) Soldering iron power shall not exceed 30 W. c.) Soldering iron tip diameter shall not exceed 3mm. d.) Temperature of iron tip shall not exceed 350 and the process should be finished within 5 seconds. (refer to MIL-STD-202G) e.) Do not touch the ceramic dielectric with solder iron other than the terminations. Direct contact of the soldering iron with ceramic dielectric of chip capacitor may cause crack. f.) After soldering ,let the products to cool down gradually in the room temperature. The soldering to lose the use of electronic heat gun. ： ℃ ※ 5. Handling after chip mounted 5.1 Please pay attention put the component lateral to the direction in which stress acts. ╳ ○ Bending → Twist 5.2 Crack will be caused if board is warped due to excessive load by check pin. ○ ╳ Support Pin Check pin Check pin Page : 14 /15 Downloaded From Oneyac.com CERTIFIED SAFETY CAPACITORS SCC-TG-009-1807 5.3 Mechanical stress due to warping and torsion by dividing. (a) Crack occurrence ratio will be increased by manual separation. (b) Crack occurrence ratio will be increased by tensile force , rather than compressive force. ○ :Compressive Stress ╳ :Tensile Stress Failure mode: chip crack by stress Crack 6. Handling of Loose Chip Capacitor 6.1 If dropped the chip capacitor may crack. Crack Floor 6.2 Piling the P.C. board after mounting for storage or handling, the corner of the P.C. board may hit the chip capacitor of another of board to cause crack. P.C.B Crack 7. Safekeeping condition and period ℃ , Humidity 20 ~70%RH For safekeeping of the products, we recommend to keep storage temperature +5 ~+40 and use them within 12 months. Page : 15 /15 Downloaded From Oneyac.com 单击下面可查看定价，库存，交付和生命周期等信息 >>Holy Stone(禾伸堂) Downloaded From Oneyac.com