ACPF-7002-TR1

Agilent ACPF-7002 High Rejection Tx Filter for US PCS Band Data Sheet General Description The ACPF- 7002 is a high rejection full band transmit filter designed for US PCS handsets. Its performance rivals splitband surface acoustic wave (SAW) transmit filters. Since a single filter provides the rejection, no switches are required, saving board space and external components, eliminating switch loss, and reducing programming complexity. The ACPF- 7002 FBAR transmit filter utilizes Agilent's Microcap bonded- wafer chip scale packaging technology. This process allows the ultra small filters to be assembled into a Molded Chip on Board (MCOB) module. In typical cellular phone architectures, the transmit filter fits between the driver amplifier and the Power Amplifier. The ACPF- 7002 FBAR filter reduces the noise in the Rx band being amplified by the transmit chain, enhancing receiver sensitivity. High rejection keeps unwanted signals out of the receive path. Agilent’s thin- Film Bulk Acoustic Resonator (FBAR) technology makes possible highQ filters at a fraction their usual size. Features • High rejection from a single filter With no switches required. • Passband: 1850-1910 MHz 33 dB min Attenuation, 1930-1990 MHz 2.5 dB Typical Insertion Loss • Space saving solution Small footprint: 1.6 x 2.0-mm solution Low profile package: 0.9 mm high (Typ) 1.0 mm (MAX) Applications • US PCS band handsets • Wireless Data terminals Electrical Specifications, Zo=50 Ω +25° C Symbol f IL IL IL D S21 S21 S21 S21 S21 S11, S22 Pin max Parameters Passband Insertion Loss 1850-1855 MHz Insertion Loss 1855-1905 MHz Insertion Loss 1905-1910 MHz Ripple, 1850-1910 MHz Min Rejection, 1930-1990 MHz Min Rejection 10 –1800 MHz Min Rejection 1990 – 3820 MHz Min Rejection 3820 − 5730 MHz In-band return loss Safe Input Power Level Units Min MHz dB dB dB dB dB dB dB dB dB dBm 33 25 22 15.0 9.0 20 11 37 1850 2.0 1.5 2.5 Typ Max Min Typ Max Min Typ Max 1910 3.2 2.5 3.7 1910 1850 3.5 2.5 3.0 2.5 33 25 22 15.0 9.0 20 11 33 25 22 15.0 9.0 20 11 1910 1850 3.7 2.5 2.7 -30° to +25° C 25° to +85° C Absolute Maximum Ratings[2] Parameter Operating temperature[1] Storage temperature[1] Notes: 1. Temperature is defined at case TC, the temperature of the underside of the filter where it makes contact with the circuit board. 2. Specifications are guaranteed over the given temperature range. Operation in excess of any one of these conditions may result in permanent damage to the device. Unit °C °C Value -30 to +85 -30 to +100 2 Typical Performance (25o C, Zo = 50 Ohms) 0 -10 d B(S (2,1)) 0 -1 d B(S (2,1)) 1.75 1.80 1.85 1.90 1.95 2.00 2.05 2.10 -2 -3 -4 -20 -30 -40 -50 1.70 -5 1.83 1.84 1.85 1.86 1.87 1.88 1.89 1.90 1.91 1.92 1.93 Figure 1. Attenuation [dB] vs. Frequency Figure 2. Insertion Loss [dB] vs. Frequency 0 0 -5 -10 d B(S (2,1)) d B(S (1,1)) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 -10 -15 -20 -25 -30 1.70 -20 -30 -40 -50 1.75 1.80 1.85 1.90 1.95 2.00 2.05 2.10 Figure 3. Attenuation [dB] vs. Frequency (broadband) Figure 4. Return Loss [dB] vs. Frequency S (1,1) fre q (1.700GHz to 2.100GHz) Figure 5. Typical S(1,1) S (2,2) fre q (1.700GHz to 2.100GHz) Figure 6. Typical S(2,2) 3 PCB Interface & Mounting instructions Mounting Consideration and board description The ACPF- 7002 FBAR filter has one input (Pin 1), one output (Pin 3) and two grounds (Pins 2, 4). • Demo board uses 3 mil Getek Microstrip. The demoboard uses CPWG transmission lines for high isolation between the two ports. It uses via holes to connect the CPWG line from the underside of the board to the filter mounting pads on top. Note: For best performance, try to reproduce this board stack up closely. If Ground-Signal-Ground (GSG) type board is used, better return loss can be achieved since it eliminates connector mismatch. Demo boards Demo boards are available. (See board drawing in Figure 7, 8, 9). Layer1 (signal) Input connection TOP BACK Output connection Figure 8. PCB Footprint pad 0.7 mils Getek ML200D ( T=3.9) 3 mils 0.7 mils Getek ML200D ( T=4.2) 28 mils Layer 2 (ground) Figure 9. Closer look at the recommended board footprint and soldermask Layer 3 (signal) Getek material ML200D and RG200D Figure 7. Board stack up description 4 0.60 ± 0.15 0.60 ± 0.15 1.25 MAX 0.35 ± 0.15 8X SIDE VIEW Shaded Region Grounded : Pin 1 Location A : Work Week B,C,D : Lot Number 2 1 1.6 4 3 2.0 B Pin 1 Marking A C D Note: Dimensions in mm Figure 10. Detailed Bottom, Side and Top view of Package Layer 1 0.61 0.70 0.61 0.30 Layer 2 (GROUND layer) 0.3 0.55 0.05 4 OUT 3 0.30 0.05 IN 1 0.33 Metal voided To decrease Capacitance at Input Port 0.3 1.5 0.31 2 1.92 0.3 Metal voided To decrease Capacitance at output Port Via to layer 2 This region is Soldermask covering ground Region (4) & (2) is exposed ground for soldering filter pads Note: Dimensions in mm Figure 11. Suggested PCB layers, viewed from top 0.55 5 Solder Compositions Alloy type Sn42Bi58 Sn43Pb43Bi14 Sn63Pb37 Sn60Pb40 Sn91/Zn9 Sn96.2Ag2.5Cu0.8Sb0.5 Sn95.8Ag3.5Cu0.7 Sn96.5Ag3.5 Sn100 Sn95Sb5 Sn97Cu3 Melting temp. (oC) 138 144 − 163 183 186 199 216 217 221 232 235 240 Recommended working temperature (oC) 160 − 180 165 − 185 200 − 240 200 − 240 200 − 240 235 − 255 235 − 255 240 − 260 260 − 280 260 − 280 260 − 300 300 250 200 150 100 50 0 0 50 100 150 200 Time, seconds 250 300 Tested profile shown. Figure 12. Recommended solder profile 6 Temperature, °C USER DIRECTION OF UNREELING NOTES: 1. MEASURED FROM THE CENTRELINE OF THE SPROCKET HOLE TO THE CENTRELINE OF THE POCKET HOLE AND FROM THE CENTRELINE OF THE SPROCKET HOLE TO THE CENTERLINE OF THE POCKET 2. CUMULATIVE TOLERANCE OF 10 SPROCKET HOLES IS ± 0.20 3. THIS THICKNESS IS APPLICABLE AS MEASURED AT THE EDGE OF THE TAPE. 4. MATERIAL: BLACK POLYSTYRENE 5. ALL DIMENSIONS IN MM. 6. ALLOWABLE CAMBER TO BE 1MM PER 250MM IN LENGTH 7. UNLESS OTHERWISE SPECIFIED TOLERANCE ± 0.10. 8. MEASUREMENT POINT TO BE 0.3 FROM BOTTOM POCKET. 9. SURFACE RESISITIVTY FROM 1.0X105 TO 1.0x1011OHMS/SQ Figure 13. Tape drawing Figure 14. Reel drawing 7 Notes: 1. Material Polyester and AcrylicAdhesive Layers. 2. All Dimensions in MM except tape length. 3. Surface Resistivity: 106 to 1012 OHMS/SQ. Pin 1 Position User Feed Direction Empty Leader : 125 Pocket - 1 Trailer : 125 Pocket - 1 A A B ,C,D : Pin 1 Location : WORK WEEK : LOT NUMB ER C B D A C Top View Figure 15. Device orientation in the tape B D A C B D End View Ordering information Specify part number followed by option. For example: ACPF - 7002 - XXX BLK = Bulk, Min 100pcs per antistatic bag TR1 = Tape and Reel, 3000pcs per 7” reel www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. Data subject to change. Copyright 2003 Agilent Technologies, Inc. January 21, 2004 5989-0380EN